HK1022049A1 - Laser based method and system for integrated circuit repair or reconfiguration - Google Patents

Laser based method and system for integrated circuit repair or reconfiguration

Info

Publication number
HK1022049A1
HK1022049A1 HK00100967A HK00100967A HK1022049A1 HK 1022049 A1 HK1022049 A1 HK 1022049A1 HK 00100967 A HK00100967 A HK 00100967A HK 00100967 A HK00100967 A HK 00100967A HK 1022049 A1 HK1022049 A1 HK 1022049A1
Authority
HK
Hong Kong
Prior art keywords
reconfiguration
integrated circuit
based method
laser based
circuit repair
Prior art date
Application number
HK00100967A
Other languages
English (en)
Inventor
Edward J Swenson
Yunlong Sun
Richard S Harris
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of HK1022049A1 publication Critical patent/HK1022049A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
    • H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Drying Of Semiconductors (AREA)
  • Laser Beam Processing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
HK00100967A 1997-01-06 2000-02-18 Laser based method and system for integrated circuit repair or reconfiguration HK1022049A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3423297P 1997-01-06 1997-01-06
US08/898,555 US6025256A (en) 1997-01-06 1997-07-22 Laser based method and system for integrated circuit repair or reconfiguration
PCT/US1997/019533 WO1998031049A1 (en) 1997-01-06 1997-10-29 Laser based method and system for integrated circuit repair or reconfiguration

Publications (1)

Publication Number Publication Date
HK1022049A1 true HK1022049A1 (en) 2000-07-21

Family

ID=26710709

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00100967A HK1022049A1 (en) 1997-01-06 2000-02-18 Laser based method and system for integrated circuit repair or reconfiguration

Country Status (11)

Country Link
US (1) US6025256A (xx)
JP (1) JP3586470B2 (xx)
KR (1) KR100367344B1 (xx)
CN (1) CN1123926C (xx)
AU (1) AU5092598A (xx)
CA (1) CA2272653C (xx)
DE (2) DE19782235B4 (xx)
GB (1) GB2336471B (xx)
HK (1) HK1022049A1 (xx)
IL (1) IL130269A (xx)
WO (1) WO1998031049A1 (xx)

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US9064785B2 (en) * 2007-07-20 2015-06-23 Freesacle Semiconductor, Inc. Electronic device including a capacitor and a process of forming the same
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US20100078418A1 (en) * 2008-09-26 2010-04-01 Electro Scientific Industries, Inc. Method of laser micro-machining stainless steel with high cosmetic quality
US10307862B2 (en) * 2009-03-27 2019-06-04 Electro Scientific Industries, Inc Laser micromachining with tailored bursts of short laser pulses
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Also Published As

Publication number Publication date
GB9912458D0 (en) 1999-07-28
CN1242873A (zh) 2000-01-26
CA2272653A1 (en) 1998-07-16
WO1998031049A1 (en) 1998-07-16
DE19782235B4 (de) 2005-04-07
JP3586470B2 (ja) 2004-11-10
IL130269A0 (en) 2000-06-01
CN1123926C (zh) 2003-10-08
AU5092598A (en) 1998-08-03
JP2000514249A (ja) 2000-10-24
GB2336471B (en) 2001-12-05
DE19782235T1 (de) 2000-01-05
KR20000069078A (ko) 2000-11-25
GB2336471A (en) 1999-10-20
CA2272653C (en) 2004-02-17
IL130269A (en) 2002-09-12
US6025256A (en) 2000-02-15
KR100367344B1 (ko) 2003-01-08

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20161029