DE19782235T1 - Lasergestütztes Verfahren und System für die Reparatur oder Neukonfiguration einer integrierten Schaltung - Google Patents

Lasergestütztes Verfahren und System für die Reparatur oder Neukonfiguration einer integrierten Schaltung

Info

Publication number
DE19782235T1
DE19782235T1 DE19782235T DE19782235T DE19782235T1 DE 19782235 T1 DE19782235 T1 DE 19782235T1 DE 19782235 T DE19782235 T DE 19782235T DE 19782235 T DE19782235 T DE 19782235T DE 19782235 T1 DE19782235 T1 DE 19782235T1
Authority
DE
Germany
Prior art keywords
reconfiguring
repairing
laser
integrated circuit
based method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19782235T
Other languages
English (en)
Other versions
DE19782235B4 (de
Inventor
Edward J Swenson
Yunlong Sun
Richard S Harris
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of DE19782235T1 publication Critical patent/DE19782235T1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
    • H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Drying Of Semiconductors (AREA)
  • Laser Beam Processing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE19782235T 1997-01-06 1997-10-29 Lasergestütztes Verfahren und System für die Reparatur oder Neukonfiguration einer integrierten Schaltung Pending DE19782235T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3423297P 1997-01-06 1997-01-06
US08/898,555 US6025256A (en) 1997-01-06 1997-07-22 Laser based method and system for integrated circuit repair or reconfiguration
PCT/US1997/019533 WO1998031049A1 (en) 1997-01-06 1997-10-29 Laser based method and system for integrated circuit repair or reconfiguration

Publications (1)

Publication Number Publication Date
DE19782235T1 true DE19782235T1 (de) 2000-01-05

Family

ID=26710709

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19782235T Pending DE19782235T1 (de) 1997-01-06 1997-10-29 Lasergestütztes Verfahren und System für die Reparatur oder Neukonfiguration einer integrierten Schaltung
DE19782235A Expired - Lifetime DE19782235B4 (de) 1997-01-06 1997-10-29 Lasergestütztes Verfahren und System für die Reparatur oder Neukonfiguration einer integrierten Schaltung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19782235A Expired - Lifetime DE19782235B4 (de) 1997-01-06 1997-10-29 Lasergestütztes Verfahren und System für die Reparatur oder Neukonfiguration einer integrierten Schaltung

Country Status (11)

Country Link
US (1) US6025256A (de)
JP (1) JP3586470B2 (de)
KR (1) KR100367344B1 (de)
CN (1) CN1123926C (de)
AU (1) AU5092598A (de)
CA (1) CA2272653C (de)
DE (2) DE19782235T1 (de)
GB (1) GB2336471B (de)
HK (1) HK1022049A1 (de)
IL (1) IL130269A (de)
WO (1) WO1998031049A1 (de)

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US8374206B2 (en) 2008-03-31 2013-02-12 Electro Scientific Industries, Inc. Combining multiple laser beams to form high repetition rate, high average power polarized laser beam
US20100078418A1 (en) * 2008-09-26 2010-04-01 Electro Scientific Industries, Inc. Method of laser micro-machining stainless steel with high cosmetic quality
US10307862B2 (en) * 2009-03-27 2019-06-04 Electro Scientific Industries, Inc Laser micromachining with tailored bursts of short laser pulses
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Also Published As

Publication number Publication date
KR20000069078A (ko) 2000-11-25
HK1022049A1 (en) 2000-07-21
AU5092598A (en) 1998-08-03
CA2272653A1 (en) 1998-07-16
KR100367344B1 (ko) 2003-01-08
CN1242873A (zh) 2000-01-26
WO1998031049A1 (en) 1998-07-16
IL130269A0 (en) 2000-06-01
CN1123926C (zh) 2003-10-08
JP2000514249A (ja) 2000-10-24
GB2336471A (en) 1999-10-20
JP3586470B2 (ja) 2004-11-10
IL130269A (en) 2002-09-12
US6025256A (en) 2000-02-15
DE19782235B4 (de) 2005-04-07
CA2272653C (en) 2004-02-17
GB9912458D0 (en) 1999-07-28
GB2336471B (en) 2001-12-05

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Legal Events

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8110 Request for examination paragraph 44
8125 Change of the main classification

Ipc: H01L 23/525