HK1004795A2 - Heat sink in particular for electronic components - Google Patents

Heat sink in particular for electronic components

Info

Publication number
HK1004795A2
HK1004795A2 HK98103689A HK98103689A HK1004795A2 HK 1004795 A2 HK1004795 A2 HK 1004795A2 HK 98103689 A HK98103689 A HK 98103689A HK 98103689 A HK98103689 A HK 98103689A HK 1004795 A2 HK1004795 A2 HK 1004795A2
Authority
HK
Hong Kong
Prior art keywords
heat sink
electronic components
electronic
sink
components
Prior art date
Application number
HK98103689A
Other languages
English (en)
Inventor
Cesare Capriz
Original Assignee
El Bo Mec S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=11342301&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1004795(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by El Bo Mec S R L filed Critical El Bo Mec S R L
Publication of HK1004795A2 publication Critical patent/HK1004795A2/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HK98103689A 1997-05-30 1998-04-30 Heat sink in particular for electronic components HK1004795A2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT97BO000325A IT1292590B1 (it) 1997-05-30 1997-05-30 Dissipatore di calore, in particolare per componenti elettronici.

Publications (1)

Publication Number Publication Date
HK1004795A2 true HK1004795A2 (en) 1998-11-13

Family

ID=11342301

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98103689A HK1004795A2 (en) 1997-05-30 1998-04-30 Heat sink in particular for electronic components

Country Status (9)

Country Link
US (1) US5991151A (xx)
KR (1) KR19980087246A (xx)
DE (1) DE29808296U1 (xx)
FR (1) FR2764164B3 (xx)
GB (1) GB2325781B (xx)
HK (1) HK1004795A2 (xx)
IT (1) IT1292590B1 (xx)
SG (1) SG71117A1 (xx)
TW (1) TW360820B (xx)

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US5875097A (en) * 1997-06-09 1999-02-23 Power Trends, Inc. Heat sink for auxiliary circuit board
US6118656A (en) * 1998-06-23 2000-09-12 Dell Usa, Lp Heat sink having a pressure gradient
US6252773B1 (en) * 1999-04-23 2001-06-26 Lucent Technologies, Inc Heat sink attachment apparatus and method
US6304449B1 (en) * 1999-07-06 2001-10-16 Chaojiong Zhang Heat sink mounting for power semiconductors
US6219905B1 (en) 1999-08-30 2001-04-24 Sun Microsystems, Inc. Heat sink clip tool
US6617685B1 (en) 1999-08-30 2003-09-09 Sun Microsystems, Inc. Clip heat sink assembly
US6125037A (en) * 1999-08-30 2000-09-26 Sun Microsystems, Inc. Self-locking heat sink assembly and method
US6249436B1 (en) 1999-08-30 2001-06-19 Sun Microsystems, Inc. Wire heat sink assembly and method of assembling
US6243264B1 (en) 1999-08-30 2001-06-05 Sun Microsystems, Inc. SRAM heat sink assembly and method of assembling
US6556811B1 (en) * 1999-10-08 2003-04-29 Cisco Technology Inc. Transceiver unit
US6381844B1 (en) 1999-12-15 2002-05-07 Sun Microsystems, Inc. Method for thermally connecting a heat sink to a cabinet
US6343643B1 (en) 1999-12-15 2002-02-05 Sun Microsystems, Inc. Cabinet assisted heat sink
US6275380B1 (en) 2000-02-29 2001-08-14 Sun Microsystems, Inc. Add-on heat sink and method
US6304445B1 (en) 2000-04-27 2001-10-16 Sun Microsystems, Inc. Fan heat sink and method
JP4218184B2 (ja) * 2000-05-19 2009-02-04 株式会社デンソー 半導体装置の実装構造
AT411125B (de) * 2001-04-12 2003-09-25 Siemens Ag Oesterreich Halteelement für elektrische bauteile zur montage auf schaltungsträgern
DE20120695U1 (de) * 2001-12-20 2003-04-30 Jordan Gmbh & Co Kg Geb Befestigungsklammer zum Befestigen eines elektrischen/elektronischen Elementes an einem Kühlkörper
US6587344B1 (en) 2002-02-13 2003-07-01 Power-One, Inc. Mounting system for high-voltage semiconductor device
KR20040038527A (ko) * 2002-11-01 2004-05-08 삼성전자주식회사 소자용 방열부재 및 이를 구비한 회로기판과 플라즈마디스플레이 패널조립체
US20040240180A1 (en) * 2002-11-20 2004-12-02 International Business Machines Corporation Apparatus employing heat sink
US6807058B2 (en) * 2002-11-20 2004-10-19 International Business Machines Corporation Heat sink and combinations
US20040233636A1 (en) * 2002-11-20 2004-11-25 International Business Machines Corporation Apparatus employing heat sink
US6714414B1 (en) * 2003-02-07 2004-03-30 Morningstar Corporation Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces
DE10326458B4 (de) * 2003-06-12 2006-05-04 Phoenix Contact Gmbh & Co. Kg Kühlanordnung für elektronische Bauelemente
DE102004046475A1 (de) * 2004-09-23 2006-04-13 Sew-Eurodrive Gmbh & Co. Kg Elektrogerät
JP4457895B2 (ja) * 2005-01-14 2010-04-28 船井電機株式会社 電源装置、並びにそれに適用可能な放熱部材固定構造及び回路基板
US7391614B2 (en) * 2005-03-24 2008-06-24 Dell Products L.P. Method and apparatus for thermal dissipation in an information handling system
KR100717791B1 (ko) * 2005-05-25 2007-05-11 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
US7725011B2 (en) * 2005-07-29 2010-05-25 Calorigen Usa Corp. Temperature exchanging element made by extrusion and incorporating an infrared radiation diffuser
US7355148B2 (en) * 2005-07-29 2008-04-08 Calorigen Usa Corp. Temperature exchanging element made by extrusion, and its applications
DE102005036966A1 (de) * 2005-08-05 2007-02-22 Robert Seuffer Gmbh & Co. Kg Elektrische Bauelementanordnung
US20080019095A1 (en) * 2006-07-24 2008-01-24 Kechuan Liu Configurable heat sink with matrix clipping system
US8264856B2 (en) 2006-08-18 2012-09-11 Delphi Technologies, Inc. Lightweight audio system for automotive: applications and method
US7733659B2 (en) 2006-08-18 2010-06-08 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
US9237685B2 (en) 2006-08-18 2016-01-12 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
TWI303973B (en) * 2006-09-06 2008-12-01 Delta Electronics Inc Heat sink fastening device and manufacturing method thereof
DE102007050985A1 (de) * 2007-10-25 2009-04-30 Robert Bosch Gmbh Befestigungsklammer
IT1396823B1 (it) * 2008-12-11 2012-12-14 Tre S S R L Dissipatore di calore munito di un elemento elastico per la tenuta dei componenti applicati su detto dissipatore
US8011361B2 (en) * 2009-03-26 2011-09-06 Celsia Technologies Taiwan, Inc. Solar power system with tower type heat dissipating structure
DE102009044368B4 (de) * 2009-10-30 2014-07-03 Lear Corporation Gmbh Kühlanordnung
US8169781B2 (en) * 2010-04-06 2012-05-01 Fsp Technology Inc. Power supply and heat dissipation module thereof
AT510195B1 (de) * 2010-07-28 2013-08-15 Siemens Ag Spannvorrichtung
US9312201B2 (en) 2010-12-30 2016-04-12 Schneider Electric It Corporation Heat dissipation device
US8893770B2 (en) * 2011-07-29 2014-11-25 Schneider Electric It Corporation Heat sink assembly for electronic components
JP6182474B2 (ja) * 2014-02-13 2017-08-16 オムロンオートモーティブエレクトロニクス株式会社 電子部品の固定構造および固定方法
CN205864940U (zh) * 2016-07-22 2017-01-04 台达电子工业股份有限公司 散热器组件

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3215192A1 (de) * 1982-04-23 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Einspannvorrichtung fuer scheibenfoermige halbleiter-bauelemente
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
GB8531565D0 (en) * 1985-12-21 1986-02-05 Marston Palmer Ltd Heat sink
DE8606346U1 (de) * 1986-03-07 1986-06-19 Siemens AG, 1000 Berlin und 8000 München Kühlkörper zum Ableiten der in mindestens einem thermisch hochbelasteten, auf einer Leiterplatte angeordneten Bauelement anfallenden Verlustwärme an eine gekühlte Gehäusewand
US4891735A (en) * 1987-11-02 1990-01-02 Chrysler Motors Corporation Heat sink for electrical components
SE460008B (sv) * 1987-11-04 1989-08-28 Saab Scania Ab Kylkropp foer ett elektriskt kretskort samt anvaendning daerav
US4961125A (en) * 1989-08-18 1990-10-02 Thermalloy Incorporated Apparatus and method of attaching an electronic device package and a heat sink to a circuit board
US5068764A (en) * 1990-03-05 1991-11-26 Thermalloy Incorporated Electronic device package mounting assembly
US5040096A (en) * 1990-06-07 1991-08-13 Aavid Engineering, Inc. High force clip
FR2686765B1 (fr) * 1992-01-28 1994-03-18 Alcatel Converters Dispositif de fixation, notamment pour la fixation d'un composant electronique sur une paroi d'un dissipateur thermique .
US5466970A (en) * 1992-08-24 1995-11-14 Thermalloy, Inc. Hooked spring clip
US5321582A (en) * 1993-04-26 1994-06-14 Cummins Engine Company, Inc. Electronic component heat sink attachment using a low force spring
US5343362A (en) * 1994-01-07 1994-08-30 Zytec Corporation Heat sink assembly

Also Published As

Publication number Publication date
FR2764164B3 (fr) 1999-04-30
GB2325781A (en) 1998-12-02
GB9808917D0 (en) 1998-06-24
KR19980087246A (ko) 1998-12-05
IT1292590B1 (it) 1999-02-08
DE29808296U1 (de) 1998-08-27
GB2325781B (en) 2001-03-07
ITBO970325A1 (it) 1998-11-30
SG71117A1 (en) 2000-03-21
ITBO970325A0 (it) 1997-05-30
US5991151A (en) 1999-11-23
TW360820B (en) 1999-06-11
FR2764164A3 (fr) 1998-12-04

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Legal Events

Date Code Title Description
PF Patent in force
PEU Short-term patents expired

Effective date: 20060429