GB993280A - Improvements in or relating to process for contacting a semi-conductor arrangement - Google Patents

Improvements in or relating to process for contacting a semi-conductor arrangement

Info

Publication number
GB993280A
GB993280A GB35068/62A GB3506862A GB993280A GB 993280 A GB993280 A GB 993280A GB 35068/62 A GB35068/62 A GB 35068/62A GB 3506862 A GB3506862 A GB 3506862A GB 993280 A GB993280 A GB 993280A
Authority
GB
United Kingdom
Prior art keywords
conductor
stamps
semi
electrodes
joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB35068/62A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens Corp
Original Assignee
Siemens and Halske AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens Corp filed Critical Siemens and Halske AG
Publication of GB993280A publication Critical patent/GB993280A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
GB35068/62A 1961-09-19 1962-09-14 Improvements in or relating to process for contacting a semi-conductor arrangement Expired GB993280A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES75819A DE1190107B (de) 1961-09-19 1961-09-19 Thermokompressionsverfahren zum Anbringen der Kontaktelektrode oder Zuleitung eines Halbleiterbauelements

Publications (1)

Publication Number Publication Date
GB993280A true GB993280A (en) 1965-05-26

Family

ID=7505644

Family Applications (1)

Application Number Title Priority Date Filing Date
GB35068/62A Expired GB993280A (en) 1961-09-19 1962-09-14 Improvements in or relating to process for contacting a semi-conductor arrangement

Country Status (6)

Country Link
US (1) US3274667A (enExample)
CH (1) CH396224A (enExample)
DE (1) DE1190107B (enExample)
GB (1) GB993280A (enExample)
NL (1) NL283249A (enExample)
SE (1) SE305033B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2162686A (en) * 1984-08-02 1986-02-05 Stc Plc Thermistors

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1106163A (en) * 1964-03-02 1968-03-13 Post Office Improvements in or relating to the bonding of metals to semiconductor, metallic or non-metallic surfaces
US3348016A (en) * 1964-04-29 1967-10-17 Western Electric Co Apparatus for attaching leads to electrical components
US3515952A (en) * 1965-02-17 1970-06-02 Motorola Inc Mounting structure for high power transistors
US3442003A (en) * 1965-07-26 1969-05-06 Teledyne Inc Method for interconnecting thin films
US3459918A (en) * 1967-01-13 1969-08-05 Ibm Welding of electrical elements having voltage sensitive components
US3577042A (en) * 1967-06-19 1971-05-04 Int Rectifier Corp Gate connection for controlled rectifiers
US3617682A (en) * 1969-06-23 1971-11-02 Gen Electric Semiconductor chip bonder
US3660632A (en) * 1970-06-17 1972-05-02 Us Navy Method for bonding silicon chips to a cold substrate
GB1389542A (en) * 1971-06-17 1975-04-03 Mullard Ltd Methods of securing a semiconductor body to a support
US3783348A (en) * 1972-10-30 1974-01-01 Rca Corp Encapsulated semiconductor device assembly
US3878553A (en) * 1972-12-26 1975-04-15 Texas Instruments Inc Interdigitated mesa beam lead diode and series array thereof
JPS5444881A (en) * 1977-09-16 1979-04-09 Nec Corp Electrode wiring structure of integrated circuit
DE2929623C2 (de) * 1979-07-21 1981-11-26 W.C. Heraeus Gmbh, 6450 Hanau Feinstdraht aus einer Aluminiumlegierung
US4441248A (en) * 1982-12-02 1984-04-10 Stanley Electric Company, Ltd. On-line inspection method and system for bonds made to electronic components
US5038453A (en) * 1988-07-22 1991-08-13 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3068412A (en) * 1962-12-11 Electrical contact and method of making the same
US1938499A (en) * 1931-01-19 1933-12-05 Budd Edward G Mfg Co Apparatus for electric welding
US2372211A (en) * 1942-05-11 1945-03-27 Progressive Welder Company Welding apparatus
US2796510A (en) * 1955-10-10 1957-06-18 Rohr Aircraft Corp Method of resistance welding sandwich panels
GB846559A (en) * 1956-01-18 1960-08-31 Telefunken Gmbh Improvements in or relating to a method of securing electrical components to circuit panels having adhering conductors
US2946119A (en) * 1956-04-23 1960-07-26 Aeroprojects Inc Method and apparatus employing vibratory energy for bonding metals
NL219101A (enExample) * 1956-10-31 1900-01-01
US2996800A (en) * 1956-11-28 1961-08-22 Texas Instruments Inc Method of making ohmic connections to silicon semiconductors
GB846155A (en) * 1956-12-07 1960-08-24 Du Pont Improvements in or relating to the manufacture of monovinylacetylene
AT203550B (de) * 1957-03-01 1959-05-25 Western Electric Co Halbleitereinrichtung und Verfahren zu deren Herstellung
NL112688C (enExample) * 1957-04-18 1900-01-01
US3109225A (en) * 1958-08-29 1963-11-05 Rca Corp Method of mounting a semiconductor device
US3061923A (en) * 1959-05-11 1962-11-06 Knapp Mills Inc Method of making composite sheets
US3091849A (en) * 1959-09-14 1963-06-04 Pacific Semiconductors Inc Method of bonding materials
US3115697A (en) * 1960-08-31 1963-12-31 Pacific Semiconductors Inc Method of making a low resistance ohmic contact
US3125803A (en) * 1960-10-24 1964-03-24 Terminals

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2162686A (en) * 1984-08-02 1986-02-05 Stc Plc Thermistors

Also Published As

Publication number Publication date
SE305033B (enExample) 1968-10-14
DE1190107B (de) 1965-04-01
CH396224A (de) 1965-07-31
NL283249A (enExample) 1900-01-01
US3274667A (en) 1966-09-27

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