SE7408138L - - Google Patents

Info

Publication number
SE7408138L
SE7408138L SE7408138A SE7408138A SE7408138L SE 7408138 L SE7408138 L SE 7408138L SE 7408138 A SE7408138 A SE 7408138A SE 7408138 A SE7408138 A SE 7408138A SE 7408138 L SE7408138 L SE 7408138L
Authority
SE
Sweden
Prior art keywords
semi
conductor
preform
region
contact
Prior art date
Application number
SE7408138A
Other languages
English (en)
Inventor
D J Page
E S Schlegel
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of SE7408138L publication Critical patent/SE7408138L/xx

Links

Classifications

    • H10W70/20—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10W72/00—
    • H10W76/138—
    • H10W76/40—

Landscapes

  • Die Bonding (AREA)
SE7408138A 1973-06-19 1974-06-19 SE7408138L (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US37144873A 1973-06-19 1973-06-19

Publications (1)

Publication Number Publication Date
SE7408138L true SE7408138L (enExample) 1975-02-24

Family

ID=23464029

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7408138A SE7408138L (enExample) 1973-06-19 1974-06-19

Country Status (4)

Country Link
JP (1) JPS5037368A (enExample)
CH (1) CH582425A5 (enExample)
GB (1) GB1465328A (enExample)
SE (1) SE7408138L (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5383073U (enExample) * 1976-12-11 1978-07-10
JPH0214777B2 (enExample) * 1979-07-04 1990-04-10 Uesuchinguhausu Bureiku Ando Shigunaru Co Ltd
JPH0219974Y2 (enExample) * 1979-12-18 1990-05-31
JPS60150670A (ja) * 1984-01-17 1985-08-08 Mitsubishi Electric Corp 半導体装置
JPS60177674A (ja) * 1984-02-23 1985-09-11 Mitsubishi Electric Corp 圧接形半導体装置の插入電極板の固定方法
EP0380799B1 (de) * 1989-02-02 1993-10-06 Asea Brown Boveri Ag Druckkontaktiertes Halbleiterbauelement
JP2502386B2 (ja) * 1989-04-11 1996-05-29 富士電機株式会社 半導体装置
DE69032084T2 (de) * 1989-11-17 1998-07-16 Toshiba Kawasaki Kk Halbleiteranordnung mit zusammengesetzter Bipolar-MOS-Elementpille, geeignet für eine Druckkontaktstruktur
DE19505387A1 (de) * 1995-02-17 1996-08-22 Abb Management Ag Druckkontaktgehäuse für Halbleiterbauelemente

Also Published As

Publication number Publication date
GB1465328A (en) 1977-02-23
CH582425A5 (enExample) 1976-11-30
JPS5037368A (enExample) 1975-04-08

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Legal Events

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NAV Patent application has lapsed

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