JPS5037368A - - Google Patents
Info
- Publication number
- JPS5037368A JPS5037368A JP6927974A JP6927974A JPS5037368A JP S5037368 A JPS5037368 A JP S5037368A JP 6927974 A JP6927974 A JP 6927974A JP 6927974 A JP6927974 A JP 6927974A JP S5037368 A JPS5037368 A JP S5037368A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W70/20—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
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- H10W72/00—
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- H10W76/138—
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- H10W76/40—
Landscapes
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37144873A | 1973-06-19 | 1973-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5037368A true JPS5037368A (ja) | 1975-04-08 |
Family
ID=23464029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6927974A Pending JPS5037368A (ja) | 1973-06-19 | 1974-06-19 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5037368A (ja) |
| CH (1) | CH582425A5 (ja) |
| GB (1) | GB1465328A (ja) |
| SE (1) | SE7408138L (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5383073U (ja) * | 1976-12-11 | 1978-07-10 | ||
| JPS5694064U (ja) * | 1979-12-18 | 1981-07-25 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0214777B2 (ja) * | 1979-07-04 | 1990-04-10 | Uesuchinguhausu Bureiku Ando Shigunaru Co Ltd | |
| JPS60150670A (ja) * | 1984-01-17 | 1985-08-08 | Mitsubishi Electric Corp | 半導体装置 |
| JPS60177674A (ja) * | 1984-02-23 | 1985-09-11 | Mitsubishi Electric Corp | 圧接形半導体装置の插入電極板の固定方法 |
| EP0380799B1 (de) * | 1989-02-02 | 1993-10-06 | Asea Brown Boveri Ag | Druckkontaktiertes Halbleiterbauelement |
| JP2502386B2 (ja) * | 1989-04-11 | 1996-05-29 | 富士電機株式会社 | 半導体装置 |
| DE69032084T2 (de) * | 1989-11-17 | 1998-07-16 | Toshiba Kawasaki Kk | Halbleiteranordnung mit zusammengesetzter Bipolar-MOS-Elementpille, geeignet für eine Druckkontaktstruktur |
| DE19505387A1 (de) * | 1995-02-17 | 1996-08-22 | Abb Management Ag | Druckkontaktgehäuse für Halbleiterbauelemente |
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1974
- 1974-06-03 GB GB2445474A patent/GB1465328A/en not_active Expired
- 1974-06-18 CH CH833774A patent/CH582425A5/xx not_active IP Right Cessation
- 1974-06-19 JP JP6927974A patent/JPS5037368A/ja active Pending
- 1974-06-19 SE SE7408138A patent/SE7408138L/xx not_active Application Discontinuation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5383073U (ja) * | 1976-12-11 | 1978-07-10 | ||
| JPS5694064U (ja) * | 1979-12-18 | 1981-07-25 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1465328A (en) | 1977-02-23 |
| CH582425A5 (ja) | 1976-11-30 |
| SE7408138L (ja) | 1975-02-24 |