CH582425A5 - - Google Patents

Info

Publication number
CH582425A5
CH582425A5 CH833774A CH833774A CH582425A5 CH 582425 A5 CH582425 A5 CH 582425A5 CH 833774 A CH833774 A CH 833774A CH 833774 A CH833774 A CH 833774A CH 582425 A5 CH582425 A5 CH 582425A5
Authority
CH
Switzerland
Application number
CH833774A
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of CH582425A5 publication Critical patent/CH582425A5/xx

Links

Classifications

    • H10W70/20—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10W72/00—
    • H10W76/138—
    • H10W76/40—
CH833774A 1973-06-19 1974-06-18 CH582425A5 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US37144873A 1973-06-19 1973-06-19

Publications (1)

Publication Number Publication Date
CH582425A5 true CH582425A5 (enExample) 1976-11-30

Family

ID=23464029

Family Applications (1)

Application Number Title Priority Date Filing Date
CH833774A CH582425A5 (enExample) 1973-06-19 1974-06-18

Country Status (4)

Country Link
JP (1) JPS5037368A (enExample)
CH (1) CH582425A5 (enExample)
GB (1) GB1465328A (enExample)
SE (1) SE7408138L (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0022359A1 (en) * 1979-07-04 1981-01-14 Westinghouse Brake And Signal Company Limited Semiconductor contact shim, attachment method and semiconductor device including a contact shim
DE3503709A1 (de) * 1984-02-23 1985-08-29 Mitsubishi Denki K.K., Tokio/Tokyo Verfahren zur befestigung einer einsatzelektrodenplatte in eine druckgebondete halbleitereinrichtung
EP0158749A1 (en) * 1984-01-17 1985-10-23 Mitsubishi Denki Kabushiki Kaisha Semiconducteur device having pressure loaded members
EP0380799A1 (de) * 1989-02-02 1990-08-08 Asea Brown Boveri Ag Druckkontaktiertes Halbleiterbauelement
DE4011275A1 (de) * 1989-04-11 1990-10-18 Fuji Electric Co Ltd Halbleiterbauelement
EP0433650A1 (en) * 1989-11-17 1991-06-26 Kabushiki Kaisha Toshiba Semiconductor device having bipolar-MOS composite element pellet suitable for pressure contacted structure
EP0729179A1 (de) * 1995-02-17 1996-08-28 ABB Management AG Druckkontaktgehäuse für Halbleiterbauelemente

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5383073U (enExample) * 1976-12-11 1978-07-10
JPH0219974Y2 (enExample) * 1979-12-18 1990-05-31

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0022359A1 (en) * 1979-07-04 1981-01-14 Westinghouse Brake And Signal Company Limited Semiconductor contact shim, attachment method and semiconductor device including a contact shim
WO1981000172A1 (en) * 1979-07-04 1981-01-22 Westinghouse Brake & Signal Semiconductor contact shim and attachment method
EP0158749A1 (en) * 1984-01-17 1985-10-23 Mitsubishi Denki Kabushiki Kaisha Semiconducteur device having pressure loaded members
DE3503709A1 (de) * 1984-02-23 1985-08-29 Mitsubishi Denki K.K., Tokio/Tokyo Verfahren zur befestigung einer einsatzelektrodenplatte in eine druckgebondete halbleitereinrichtung
EP0380799A1 (de) * 1989-02-02 1990-08-08 Asea Brown Boveri Ag Druckkontaktiertes Halbleiterbauelement
US5063436A (en) * 1989-02-02 1991-11-05 Asea Brown Boveri Ltd. Pressure-contacted semiconductor component
DE4011275A1 (de) * 1989-04-11 1990-10-18 Fuji Electric Co Ltd Halbleiterbauelement
EP0433650A1 (en) * 1989-11-17 1991-06-26 Kabushiki Kaisha Toshiba Semiconductor device having bipolar-MOS composite element pellet suitable for pressure contacted structure
EP0729179A1 (de) * 1995-02-17 1996-08-28 ABB Management AG Druckkontaktgehäuse für Halbleiterbauelemente

Also Published As

Publication number Publication date
GB1465328A (en) 1977-02-23
SE7408138L (enExample) 1975-02-24
JPS5037368A (enExample) 1975-04-08

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Legal Events

Date Code Title Description
PL Patent ceased
PL Patent ceased