GB884035A - Process for the production of electrolytic copper platings - Google Patents

Process for the production of electrolytic copper platings

Info

Publication number
GB884035A
GB884035A GB4550/58A GB455058A GB884035A GB 884035 A GB884035 A GB 884035A GB 4550/58 A GB4550/58 A GB 4550/58A GB 455058 A GB455058 A GB 455058A GB 884035 A GB884035 A GB 884035A
Authority
GB
United Kingdom
Prior art keywords
acid
sulphonic
compounds
ester
feb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4550/58A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DEHYDAG GmbH
Dehydag Deutsche Hydrierwerke GmbH
Original Assignee
DEHYDAG GmbH
Dehydag Deutsche Hydrierwerke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DED17304A external-priority patent/DE1000204B/en
Application filed by DEHYDAG GmbH, Dehydag Deutsche Hydrierwerke GmbH filed Critical DEHYDAG GmbH
Publication of GB884035A publication Critical patent/GB884035A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

884,035. Electrodeposition of bright copper. DEHYDAG DEUTSCHE HYDRIERWERKE G.m.b.H. Feb. 12, 1958 [Feb. 13, 1957], No. 4550/58. Addition to 807,574. Class 41. In electroplating with bright copper from aqueous acid baths containing inorganic impurities such as are present in hard water and commercial copper salts instead of employing as sequestering agents the organic diamino compounds free from neutralized or unneutralized carboxyl groups as specified in Specification 807,574, there are employed sulphonic acid or sulphuric acid ester group derivatives of such compounds which may be in salt-like combination with inorganic or organic bases, the sulphonic or sulphuric ester groups being attached to any of the hydrocarbon radicals in the organic diamino compounds. Specified sequestering compounds are N-ethyl-N-#- aminoethyl - aminoethanesulphonic acid; N : N - diethyl - ethylenediamino - N<SP>1</SP> N<SP>1</SP>- bis - (ethanesulphonic acid); 1 : 3 - diaminopropane - 2 - sulphonic acid; N : N : N<SP>1</SP> : N<SP>1</SP>- tetra - n - butyl - 1 : 3 - diaminopropanol - 2 monosulphuric acid ester; piperazine-N : N<SP>1</SP>- bis-(2-hydroxypropanesurphonic acid) or its sodium salt; and 2 : 5-diaminobenzene- 1-sulphonic acid or 1 : 4-disulphonic acid. As brighteners there may be used N : N-diethyldithiocarbamic acid-ethyl ester-#-sodium sulphonate alone or in combination with 1 : 3 : 5- triazine - 2 : 4 : 6 - tris - (mercapto - 21 - hydroxypropanesulphonic acid) or its sodium salt.
GB4550/58A 1954-03-13 1958-02-12 Process for the production of electrolytic copper platings Expired GB884035A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DED17304A DE1000204B (en) 1954-03-13 1954-03-13 Process for the production of galvanic copper coatings
DED24913A DE1030133B (en) 1954-03-13 1957-02-13 Process for the production of galvanic copper coatings

Publications (1)

Publication Number Publication Date
GB884035A true GB884035A (en) 1961-12-06

Family

ID=25970685

Family Applications (2)

Application Number Title Priority Date Filing Date
GB7161/55A Expired GB807574A (en) 1954-03-13 1955-03-11 Process for the production of electrolytic copper coatings
GB4550/58A Expired GB884035A (en) 1954-03-13 1958-02-12 Process for the production of electrolytic copper platings

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB7161/55A Expired GB807574A (en) 1954-03-13 1955-03-11 Process for the production of electrolytic copper coatings

Country Status (6)

Country Link
US (2) US2986498A (en)
BE (2) BE563647A (en)
CH (2) CH340395A (en)
DE (1) DE1030133B (en)
FR (1) FR1118019A (en)
GB (2) GB807574A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE534101A (en) * 1954-03-13
DE1235101B (en) * 1959-08-21 1967-02-23 Langbein Pfanhauser Werke Ag Electrolyte with gloss additive for galvanic deposition of mirror-glossy, leveled, ductile nickel deposits
US3787297A (en) * 1971-10-26 1974-01-22 Conversion Chem Corp Zinc plating bath and method
DE2355581C3 (en) * 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanic bright gold bath with high deposition rate
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US9243339B2 (en) * 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
PL3502320T3 (en) * 2017-12-22 2021-03-08 Atotech Deutschland Gmbh A method for increasing corrosion resistance of a substrate comprising an outermost chromium alloy layer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2355070A (en) * 1937-07-03 1944-08-08 Little Inc A Electrolytic deposition of metal
GB503095A (en) * 1937-10-04 1939-03-31 Bruno Friedrich Schweig Improvements in the production of electrodeposits of copper
US2195454A (en) * 1939-01-07 1940-04-02 Louis Weisberg Inc Electrodeposition of copper
DE888493C (en) * 1951-11-03 1953-09-03 Hydrierwerke A G Deutsche Process for the production of firmly adhering and shiny galvanic copper coatings
BE543413A (en) * 1953-09-19
BE534101A (en) * 1954-03-13

Also Published As

Publication number Publication date
US2986498A (en) 1961-05-30
BE563647A (en)
BE534101A (en)
CH370612A (en) 1963-07-15
FR1118019A (en) 1956-05-30
CH340395A (en) 1959-08-15
GB807574A (en) 1959-01-21
US3030283A (en) 1962-04-17
DE1030133B (en) 1958-05-14

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