GB601994A - Improvements in electroplating apparatus - Google Patents
Improvements in electroplating apparatusInfo
- Publication number
- GB601994A GB601994A GB15032/45A GB1503245A GB601994A GB 601994 A GB601994 A GB 601994A GB 15032/45 A GB15032/45 A GB 15032/45A GB 1503245 A GB1503245 A GB 1503245A GB 601994 A GB601994 A GB 601994A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wire
- baths
- plating
- coil
- rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C47/00—Winding-up, coiling or winding-off metal wire, metal band or other flexible metal material characterised by features relevant to metal processing only
- B21C47/26—Special arrangements with regard to simultaneous or subsequent treatment of the material
- B21C47/265—"helicofil" systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S118/00—Coating apparatus
- Y10S118/19—Wire and cord immersion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S29/00—Metal working
- Y10S29/012—Method or apparatus with electroplating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
601,994. Electroplating apparatus. WIRE PROCESSING CORPORATION. June 13, 1945, No. 15032. Convention date, May 8, 1944. [Class 41] Wire or the like in the form of a helix is mounted on a rubber-covered shaft 10, by rotation of which the wire is caused to pass through an electroplating bath and, if desired, other baths, the wire being maintained in firm contact with the shaft by a rubber-covered roller 15, the pressure being adjustable by screws 17, 18. Spacing is maintained by a comb 27 and in the plating bath 33 by a member 41. Electrical contact to the coil is made by rollers 37 carried on arms 38 and anodes are positioned inside and outside the coil. Pre-plating and post-plating treatments may be effected in separate baths on each side of the plating baths. Where more than one layer of metal is required, the coating may be prevented from oxidizing between the different baths by spraying solution on the wire or by total immersion. The apparatus described will handle wire from # inch to 1 inch diameter and deposit coatings up to 50 per cent of these diameters. The plated wire may be drawn down to the required diameter.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US534543A US2495695A (en) | 1944-05-08 | 1944-05-08 | Electroplating apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
GB601994A true GB601994A (en) | 1948-05-18 |
Family
ID=24130516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB15032/45A Expired GB601994A (en) | 1944-05-08 | 1945-06-13 | Improvements in electroplating apparatus |
Country Status (2)
Country | Link |
---|---|
US (1) | US2495695A (en) |
GB (1) | GB601994A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2000045A (en) * | 1977-06-20 | 1979-01-04 | Atomic Energy Authority Uk | Device for Treating Fluid |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2680710A (en) * | 1950-09-14 | 1954-06-08 | Kenmore Metal Corp | Method and apparatus for continuously electroplating heavy wire and similar strip material |
US2708445A (en) * | 1952-07-11 | 1955-05-17 | Nat Standard Co | Wire processing apparatus |
BE523457A (en) * | 1952-10-29 | |||
US3002537A (en) * | 1954-05-27 | 1961-10-03 | Nat Standard Co | Machine for continuously treating heavy wire and similar strip material |
US2975120A (en) * | 1955-06-30 | 1961-03-14 | Nat Standard Co | Electroplating apparatus |
US3073773A (en) * | 1957-12-05 | 1963-01-15 | Nat Standard Co | Electrolytic plating |
US3046214A (en) * | 1958-09-08 | 1962-07-24 | Chain Anodizers Inc | Apparatus for continuously electrolytically treating flexible articles |
US3109783A (en) * | 1958-11-20 | 1963-11-05 | Nat Standard Co | Electrolytic plating |
US3676322A (en) * | 1970-01-06 | 1972-07-11 | Furukawa Electric Co Ltd | Apparatus and method for continuous production of electrolytically treated wires |
US4374719A (en) * | 1982-03-19 | 1983-02-22 | United States Steel Corporation | System for electrolytic cleaning of metal wire in loop form |
US5893966A (en) | 1997-07-28 | 1999-04-13 | Micron Technology, Inc. | Method and apparatus for continuous processing of semiconductor wafers |
EP1052062A1 (en) * | 1999-05-03 | 2000-11-15 | Applied Materials, Inc. | Pré-conditioning fixed abrasive articles |
US7670468B2 (en) * | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
US7678245B2 (en) * | 2000-02-17 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing |
US6991528B2 (en) * | 2000-02-17 | 2006-01-31 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US6979248B2 (en) * | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US20040020789A1 (en) * | 2000-02-17 | 2004-02-05 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7125477B2 (en) * | 2000-02-17 | 2006-10-24 | Applied Materials, Inc. | Contacts for electrochemical processing |
US7077721B2 (en) | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
US20080156657A1 (en) * | 2000-02-17 | 2008-07-03 | Butterfield Paul D | Conductive polishing article for electrochemical mechanical polishing |
US7303462B2 (en) * | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
US7066800B2 (en) * | 2000-02-17 | 2006-06-27 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
US20050092621A1 (en) * | 2000-02-17 | 2005-05-05 | Yongqi Hu | Composite pad assembly for electrochemical mechanical processing (ECMP) |
US7303662B2 (en) * | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
US7029365B2 (en) * | 2000-02-17 | 2006-04-18 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing |
US6962524B2 (en) * | 2000-02-17 | 2005-11-08 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7374644B2 (en) * | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7059948B2 (en) * | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
US7137879B2 (en) * | 2001-04-24 | 2006-11-21 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7344432B2 (en) * | 2001-04-24 | 2008-03-18 | Applied Materials, Inc. | Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
US20050194681A1 (en) * | 2002-05-07 | 2005-09-08 | Yongqi Hu | Conductive pad with high abrasion |
US20050178666A1 (en) * | 2004-01-13 | 2005-08-18 | Applied Materials, Inc. | Methods for fabrication of a polishing article |
US20060030156A1 (en) * | 2004-08-05 | 2006-02-09 | Applied Materials, Inc. | Abrasive conductive polishing article for electrochemical mechanical polishing |
US7084064B2 (en) * | 2004-09-14 | 2006-08-01 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
WO2006039436A2 (en) * | 2004-10-01 | 2006-04-13 | Applied Materials, Inc. | Pad design for electrochemical mechanical polishing |
US7520968B2 (en) * | 2004-10-05 | 2009-04-21 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact |
US20060219663A1 (en) * | 2005-03-31 | 2006-10-05 | Applied Materials, Inc. | Metal CMP process on one or more polishing stations using slurries with oxidizers |
US7427340B2 (en) * | 2005-04-08 | 2008-09-23 | Applied Materials, Inc. | Conductive pad |
US20070096315A1 (en) * | 2005-11-01 | 2007-05-03 | Applied Materials, Inc. | Ball contact cover for copper loss reduction and spike reduction |
US20080293343A1 (en) * | 2007-05-22 | 2008-11-27 | Yuchun Wang | Pad with shallow cells for electrochemical mechanical processing |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US351946A (en) * | 1886-11-02 | Machine for washing | ||
DE565764C (en) * | 1932-12-07 | Max Schloetter Dr Ing | System for plating wires, tapes, etc. like | |
US241741A (en) * | 1881-05-17 | Coating wire | ||
US189533A (en) * | 1877-04-10 | Improvement in process and apparatus for electroplating wire | ||
DE244582C (en) * | ||||
DE132457C (en) * | ||||
US638917A (en) * | 1899-05-04 | 1899-12-12 | Elisha Emerson | Process of producing wire-bars. |
US799860A (en) * | 1905-02-01 | 1905-09-19 | American Steel & Wire Co | Process of galvanizing wire. |
US1157288A (en) * | 1912-01-31 | 1915-10-19 | Gen Electric | Manufacture of fine refractory-metal wires. |
BE333311A (en) * | 1925-05-23 | |||
DE638552C (en) * | 1933-07-16 | 1936-11-17 | Hugo Pasch | Device for covering raw blade bands for razor blades with rust-protecting metal layers |
US2359095A (en) * | 1939-10-17 | 1944-09-26 | American Steel & Wire Co | Continuous production of elongated metal stock |
US2266605A (en) * | 1941-04-22 | 1941-12-16 | Rodney Hunt Machine Co | Cloth feed control |
-
1944
- 1944-05-08 US US534543A patent/US2495695A/en not_active Expired - Lifetime
-
1945
- 1945-06-13 GB GB15032/45A patent/GB601994A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2000045A (en) * | 1977-06-20 | 1979-01-04 | Atomic Energy Authority Uk | Device for Treating Fluid |
GB2000045B (en) * | 1977-06-20 | 1982-01-20 | Atomic Energy Authority Uk | Improvements in or relating to fluid treatment devices |
Also Published As
Publication number | Publication date |
---|---|
US2495695A (en) | 1950-01-31 |
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