GB1406081A - Method for electrolytic deposition - Google Patents
Method for electrolytic depositionInfo
- Publication number
- GB1406081A GB1406081A GB2713672A GB2713672A GB1406081A GB 1406081 A GB1406081 A GB 1406081A GB 2713672 A GB2713672 A GB 2713672A GB 2713672 A GB2713672 A GB 2713672A GB 1406081 A GB1406081 A GB 1406081A
- Authority
- GB
- United Kingdom
- Prior art keywords
- metal
- suspended
- electrolyte
- enclosure
- electro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/625—Discontinuous layers, e.g. microcracked layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/67—Electroplating to repair workpiece
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
- Cylinder Crankcases Of Internal Combustion Engines (AREA)
Abstract
1406081 Electro-depositing metal AGENCE NATIONALE DE VALORISATION DE LA RECHERCHE 9 June 1972 [9 June 1971] 27136/72 Heading C7B Metal is electro-deposited by arranging an anode at least 0.1mm. from a cathode, applying a cathode current density of 5 to 500A/dm<SP>2</SP>, and circulating an electrolyte longitudinally between the electrodes at a speed of at least 100m./min, the electrolyte having suspended therein up to 200g/l of particles of diameter less than 1mm. The particles may be of the metal to be deposited, e.g. Cu, Ag, Au, Ni, Cr, Sn, or non-conductive e.g. microspheres of glass or plastics material. Superposed layers with or without subsequent diffusion may be obtained: e.g. successive layers of Cu, Ag and Au and Cu, Ni and Cr. As shown, sheet, strip or wire 1 to be coated, e.g. of light metal.Al, Cu, stainless steel or refractory metal Mo, W, Ta, Ti or Ti alloy is advanced first through pre-treatment enclosure 3, for sanding, brushing, microbeading or degreasing, then as cathode through metal electro-deposition enclosure 4 comprising cylindrical anode 2, e.g. of platinized Ti then through post-treatment enclosure 9 for rinsing, drying or polishing. Electrolyte E containing the suspended particles P is circulated through the enclosure 4 via pipes 6, 8 and reservoir 7 by pump 5. The electrolyte may be: NiSO 4 and H 3 BO 3 with suspended Ni or glass beads for nickeling steel; KAg (CN) 2 ) KCN and K 2 CO 3 with suspended stainless steel balls for silvering Cu wire; or K 2 SnO 4 and potash with suspended stainless steel beads for tinning Al conductors. An electric, magnetic or ultrasonic field may be applied between the electrodes. Layers of different metal may be plated in succession in the same bath or a series of baths. Localized plating may be effected e.g. to repair a metal coating or provide a protective coating. Specification 1406082 is referred to.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7120941A FR2140310B1 (en) | 1971-06-09 | 1971-06-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1406081A true GB1406081A (en) | 1975-09-10 |
Family
ID=9078372
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2713672A Expired GB1406081A (en) | 1971-06-09 | 1972-06-09 | Method for electrolytic deposition |
GB962475A Expired GB1406082A (en) | 1971-06-09 | 1972-06-09 | Electrolytic deposition apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB962475A Expired GB1406082A (en) | 1971-06-09 | 1972-06-09 | Electrolytic deposition apparatus |
Country Status (6)
Country | Link |
---|---|
AT (1) | AT331606B (en) |
BE (1) | BE784600A (en) |
DE (1) | DE2228229A1 (en) |
FR (1) | FR2140310B1 (en) |
GB (2) | GB1406081A (en) |
IT (1) | IT960463B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4832811A (en) * | 1987-01-26 | 1989-05-23 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards |
MD2561G2 (en) * | 2003-07-29 | 2005-04-30 | Институт Прикладной Физики Академии Наук Молдовы | Process for electrolytic plating of the inner cylindrical surfaces |
GB2439807A (en) * | 2006-06-20 | 2008-01-09 | Vetco Gray Inc | A localised electroplating system |
CN102152421A (en) * | 2011-05-03 | 2011-08-17 | 蒙特集团(香港)有限公司 | Device and method for preparing linear cutting steel wires for solar silicon wafers |
US8101050B2 (en) | 2006-06-20 | 2012-01-24 | Vetco Gray Inc. | System, method, and apparatus for continuous electroplating of elongated workpieces |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4164456A (en) * | 1978-06-15 | 1979-08-14 | Dart Industries Inc. | Electrolytic process |
JPS56119790A (en) * | 1980-02-22 | 1981-09-19 | Nippon Kokan Kk <Nkk> | Production of high-corrosive zinc-electroplated steel sheet |
US4650549A (en) * | 1985-11-06 | 1987-03-17 | Hughes Tool Company | Method for electroplating helical rotors |
GB8708945D0 (en) * | 1987-04-14 | 1987-05-20 | Atomic Energy Authority Uk | Electrolytic polishing device |
GB2528873A (en) * | 2014-07-31 | 2016-02-10 | Mohammad Sakhawat Hussain | Direct high speed nickel plating on difficult to plate metals |
CN105970260B (en) * | 2016-04-25 | 2019-05-03 | 江苏师范大学 | A method of improving uniformity in jet-electrodeposited method process |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2445675A (en) * | 1941-11-22 | 1948-07-20 | William C Lang | Apparatus for producing coated wire by continuous process |
DE1202607B (en) * | 1961-01-20 | 1965-10-07 | Nyby Bruk Ab | Process for anodic surface treatment of metal objects |
US3226308A (en) * | 1961-06-15 | 1965-12-28 | Clevite Corp | Electrochemical treating method and apparatus |
GB1033953A (en) * | 1963-02-05 | 1966-06-22 | British Iron Steel Research | Improvements in or relating to the formation of metal coatings |
FR1471953A (en) * | 1965-03-26 | 1967-03-03 | Harshaw Chem Corp | Nickel electroplating process |
US3644181A (en) * | 1969-07-24 | 1972-02-22 | Sylvania Electric Prod | Localized electroplating method |
-
1971
- 1971-06-09 FR FR7120941A patent/FR2140310B1/fr not_active Expired
-
1972
- 1972-06-08 BE BE784600A patent/BE784600A/en not_active IP Right Cessation
- 1972-06-08 IT IT9523/72A patent/IT960463B/en active
- 1972-06-09 DE DE19722228229 patent/DE2228229A1/en active Pending
- 1972-06-09 GB GB2713672A patent/GB1406081A/en not_active Expired
- 1972-06-09 GB GB962475A patent/GB1406082A/en not_active Expired
- 1972-06-09 AT AT501172A patent/AT331606B/en not_active IP Right Cessation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4832811A (en) * | 1987-01-26 | 1989-05-23 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards |
MD2561G2 (en) * | 2003-07-29 | 2005-04-30 | Институт Прикладной Физики Академии Наук Молдовы | Process for electrolytic plating of the inner cylindrical surfaces |
GB2439807A (en) * | 2006-06-20 | 2008-01-09 | Vetco Gray Inc | A localised electroplating system |
GB2439807B (en) * | 2006-06-20 | 2012-01-04 | Vetco Gray Inc | Apparatus for continuous electroplating of elongated workpieces |
US8101050B2 (en) | 2006-06-20 | 2012-01-24 | Vetco Gray Inc. | System, method, and apparatus for continuous electroplating of elongated workpieces |
CN102152421A (en) * | 2011-05-03 | 2011-08-17 | 蒙特集团(香港)有限公司 | Device and method for preparing linear cutting steel wires for solar silicon wafers |
CN102152421B (en) * | 2011-05-03 | 2014-02-12 | 凡登(常州)新型金属材料技术有限公司 | Device and method for preparing linear cutting steel wires for solar silicon wafers |
Also Published As
Publication number | Publication date |
---|---|
DE2228229A1 (en) | 1972-12-14 |
GB1406082A (en) | 1975-09-10 |
ATA501172A (en) | 1975-11-15 |
FR2140310B1 (en) | 1974-03-08 |
AT331606B (en) | 1976-08-25 |
BE784600A (en) | 1972-10-02 |
IT960463B (en) | 1973-11-20 |
FR2140310A1 (en) | 1973-01-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |