GB2492972B - Method and apparatus for dividing a thin film device into separate cells - Google Patents

Method and apparatus for dividing a thin film device into separate cells

Info

Publication number
GB2492972B
GB2492972B GB1112286.8A GB201112286A GB2492972B GB 2492972 B GB2492972 B GB 2492972B GB 201112286 A GB201112286 A GB 201112286A GB 2492972 B GB2492972 B GB 2492972B
Authority
GB
United Kingdom
Prior art keywords
cut
layers
dividing
thin film
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1112286.8A
Other languages
English (en)
Other versions
GB201112286D0 (en
GB2492972A (en
Inventor
Adam North Brunton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M Solv Ltd
Original Assignee
M Solv Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M Solv Ltd filed Critical M Solv Ltd
Priority to GB1112286.8A priority Critical patent/GB2492972B/en
Publication of GB201112286D0 publication Critical patent/GB201112286D0/en
Priority to KR1020147003890A priority patent/KR101880699B1/ko
Priority to EP12751097.2A priority patent/EP2732468B1/en
Priority to US14/131,830 priority patent/US9054177B2/en
Priority to JP2014519618A priority patent/JP6106168B2/ja
Priority to TW101125253A priority patent/TWI617385B/zh
Priority to PCT/GB2012/000590 priority patent/WO2013011254A1/en
Priority to CN201280035236.8A priority patent/CN103688358B/zh
Publication of GB2492972A publication Critical patent/GB2492972A/en
Application granted granted Critical
Publication of GB2492972B publication Critical patent/GB2492972B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/30—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells
    • H10F19/31—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells having multiple laterally adjacent thin-film photovoltaic cells deposited on the same substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/30—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells
    • H10F19/31—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells having multiple laterally adjacent thin-film photovoltaic cells deposited on the same substrate
    • H10F19/33—Patterning processes to connect the photovoltaic cells, e.g. laser cutting of conductive or active layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/86—Series electrical configurations of multiple OLEDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Photovoltaic Devices (AREA)
  • Laser Beam Processing (AREA)
  • Battery Electrode And Active Subsutance (AREA)
GB1112286.8A 2011-07-15 2011-07-15 Method and apparatus for dividing a thin film device into separate cells Active GB2492972B (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GB1112286.8A GB2492972B (en) 2011-07-15 2011-07-15 Method and apparatus for dividing a thin film device into separate cells
JP2014519618A JP6106168B2 (ja) 2011-07-15 2012-07-13 薄膜デバイスを個別のセルに分割する方法及び装置
EP12751097.2A EP2732468B1 (en) 2011-07-15 2012-07-13 Method and apparatus for dividing a thin film device into separate cells
US14/131,830 US9054177B2 (en) 2011-07-15 2012-07-13 Method and apparatus for dividing a thin film device into separate cells
KR1020147003890A KR101880699B1 (ko) 2011-07-15 2012-07-13 박막 기기를 개별 셀들로 분할하는 방법 및 장치
TW101125253A TWI617385B (zh) 2011-07-15 2012-07-13 用於劃分薄膜裝置為分離的晶胞之方法和設備
PCT/GB2012/000590 WO2013011254A1 (en) 2011-07-15 2012-07-13 Method and apparatus for dividing a thin film device into separate cells
CN201280035236.8A CN103688358B (zh) 2011-07-15 2012-07-13 用于将薄膜器件划分成单独的单元的方法及设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1112286.8A GB2492972B (en) 2011-07-15 2011-07-15 Method and apparatus for dividing a thin film device into separate cells

Publications (3)

Publication Number Publication Date
GB201112286D0 GB201112286D0 (en) 2011-08-31
GB2492972A GB2492972A (en) 2013-01-23
GB2492972B true GB2492972B (en) 2013-09-11

Family

ID=44586748

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1112286.8A Active GB2492972B (en) 2011-07-15 2011-07-15 Method and apparatus for dividing a thin film device into separate cells

Country Status (8)

Country Link
US (1) US9054177B2 (enExample)
EP (1) EP2732468B1 (enExample)
JP (1) JP6106168B2 (enExample)
KR (1) KR101880699B1 (enExample)
CN (1) CN103688358B (enExample)
GB (1) GB2492972B (enExample)
TW (1) TWI617385B (enExample)
WO (1) WO2013011254A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2492971B (en) * 2011-07-15 2013-09-18 M Solv Ltd Method and apparatus for dividing thin film device into separate cells
JP2015096823A (ja) 2013-11-15 2015-05-21 浜松ホトニクス株式会社 放射線検出器、及び放射線検出器の製造方法
EP2974822B1 (en) * 2014-07-14 2017-08-16 ASM Technology Singapore Pte Ltd. Method of dicing thin semiconductor substrates
KR101677152B1 (ko) * 2015-03-27 2016-11-17 (주)엔에스 단차 가공용 레이저 절단 장치
KR101677154B1 (ko) * 2015-04-22 2016-11-17 (주)엔에스 단차 가공용 레이저 절단 장치
KR101689860B1 (ko) * 2015-05-26 2016-12-26 (주)엔에스 단차 가공용 레이저 절단 장치
KR101702568B1 (ko) * 2015-07-28 2017-02-06 (주)엔에스 단차 가공용 레이저 절단 장치
KR102567316B1 (ko) * 2015-11-04 2023-08-16 엘지디스플레이 주식회사 디스플레이 제조장치
CN105562939A (zh) * 2016-03-03 2016-05-11 苏州大学 一种印刷电路板的多波长飞秒激光扫描刻蚀加工方法
CN108604618B (zh) * 2016-12-27 2022-12-06 中国建材国际工程集团有限公司 用于监视在太阳能模块中形成隔离槽的激光划片过程的方法和系统
GB2572608A (en) * 2018-04-03 2019-10-09 Ilika Tech Ltd Laser processing method for thin film structures
KR102319690B1 (ko) * 2020-05-12 2021-11-02 주식회사 이오테크닉스 홀 형성 장치 및 홀 형성 방법
KR102737376B1 (ko) * 2022-12-23 2024-12-03 주식회사 메카로에너지 패턴형 투광 태양전지 모듈 및 그 제조 방법
KR102756303B1 (ko) * 2023-11-30 2025-01-21 주식회사 바인딩 투과형 cigs 모듈을 제작하기 위한 방법 및 이에 따라 제작된 투과형 cigs 모듈

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758526A (en) * 1986-02-17 1988-07-19 Messerschmitt-Bolkow-Blohm Gmbh Procedure for producing an integrated system of thin-film solar cells connected in series
JPS63192561A (ja) * 1987-02-04 1988-08-09 Nkk Corp マルチ切断装置
WO2000013837A1 (de) * 1998-09-08 2000-03-16 Heidelberger Druckmaschinen Ag Anordnung zum mehrkanaligen schneiden und ritzen von materialien mittels laserstrahlen
GB2458986A (en) * 2008-04-08 2009-10-14 Philip Thomas Rumsby Apparatus for patterning thin films on continuous flexible substrates
GB2474665A (en) * 2009-10-22 2011-04-27 M Solv Ltd Method and Apparatus for dividing a thin film device into separate cells

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JP3248336B2 (ja) * 1994-03-23 2002-01-21 富士電機株式会社 薄膜太陽電池の製造方法
KR100207135B1 (ko) * 1994-10-18 1999-07-15 니시무로 타이죠 반사형 액정표시소자 및 그 제조방법
JPH08267265A (ja) * 1995-03-30 1996-10-15 Fuji Electric Corp Res & Dev Ltd 薄膜加工装置
JP4233741B2 (ja) * 2000-09-27 2009-03-04 三菱重工業株式会社 太陽電池モジュール及びその製造方法
TW548689B (en) * 2001-01-25 2003-08-21 Fujitsu Display Tech Reflection type liquid crystal display device and manufacturing method thereof
JP2004330271A (ja) * 2003-05-09 2004-11-25 Kanegafuchi Chem Ind Co Ltd 透光性薄膜太陽電池の作製方法
JP4340246B2 (ja) * 2005-03-07 2009-10-07 シャープ株式会社 薄膜太陽電池およびその製造方法
JP2007310334A (ja) * 2006-05-19 2007-11-29 Mikuni Denshi Kk ハーフトーン露光法を用いた液晶表示装置の製造法
JP5088661B2 (ja) * 2006-12-05 2012-12-05 セイコーエプソン株式会社 半導体装置および電気光学装置
WO2009027476A2 (en) * 2007-08-30 2009-03-05 Oc Oerlikon Balzers Ag A thin-film solar cell system and method and apparatus for manufacturing a thin-film solar cell
JP4785827B2 (ja) * 2007-12-27 2011-10-05 三洋電機株式会社 太陽電池モジュール及びその製造方法
GB2492971B (en) 2011-07-15 2013-09-18 M Solv Ltd Method and apparatus for dividing thin film device into separate cells

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758526A (en) * 1986-02-17 1988-07-19 Messerschmitt-Bolkow-Blohm Gmbh Procedure for producing an integrated system of thin-film solar cells connected in series
JPS63192561A (ja) * 1987-02-04 1988-08-09 Nkk Corp マルチ切断装置
WO2000013837A1 (de) * 1998-09-08 2000-03-16 Heidelberger Druckmaschinen Ag Anordnung zum mehrkanaligen schneiden und ritzen von materialien mittels laserstrahlen
GB2458986A (en) * 2008-04-08 2009-10-14 Philip Thomas Rumsby Apparatus for patterning thin films on continuous flexible substrates
GB2474665A (en) * 2009-10-22 2011-04-27 M Solv Ltd Method and Apparatus for dividing a thin film device into separate cells

Also Published As

Publication number Publication date
US9054177B2 (en) 2015-06-09
TWI617385B (zh) 2018-03-11
GB201112286D0 (en) 2011-08-31
JP2014524147A (ja) 2014-09-18
EP2732468B1 (en) 2018-12-19
CN103688358B (zh) 2017-07-04
JP6106168B2 (ja) 2017-03-29
EP2732468A1 (en) 2014-05-21
KR101880699B1 (ko) 2018-07-20
GB2492972A (en) 2013-01-23
US20140162408A1 (en) 2014-06-12
TW201306983A (zh) 2013-02-16
WO2013011254A1 (en) 2013-01-24
KR20140054069A (ko) 2014-05-08
CN103688358A (zh) 2014-03-26

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