GB2474170B - Transistor with embedded si/ge material having enhanced boron confinement - Google Patents

Transistor with embedded si/ge material having enhanced boron confinement

Info

Publication number
GB2474170B
GB2474170B GB1100855.4A GB201100855A GB2474170B GB 2474170 B GB2474170 B GB 2474170B GB 201100855 A GB201100855 A GB 201100855A GB 2474170 B GB2474170 B GB 2474170B
Authority
GB
United Kingdom
Prior art keywords
confinement
transistor
embedded
enhanced boron
boron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1100855.4A
Other languages
English (en)
Other versions
GB2474170A (en
GB201100855D0 (en
Inventor
Jan Hoentschel
Maciej Wiatr
Vassilios Papageorgiou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of GB201100855D0 publication Critical patent/GB201100855D0/en
Publication of GB2474170A publication Critical patent/GB2474170A/en
Application granted granted Critical
Publication of GB2474170B publication Critical patent/GB2474170B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
    • H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
    • H01L29/66636—
    • H01L29/7834—
    • H01L29/7848—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
    • H10D30/0227—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H10D30/608—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs  having non-planar bodies, e.g. having recessed gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/791—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions
    • H10D30/797—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions being in source or drain regions, e.g. SiGe source or drain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/01—Manufacture or treatment
    • H10D62/021—Forming source or drain recesses by etching e.g. recessing by etching and then refilling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/82—Heterojunctions
    • H10D62/822—Heterojunctions comprising only Group IV materials heterojunctions, e.g. Si/Ge heterojunctions

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Thin Film Transistor (AREA)
GB1100855.4A 2008-07-31 2009-07-31 Transistor with embedded si/ge material having enhanced boron confinement Active GB2474170B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008035806A DE102008035806B4 (de) 2008-07-31 2008-07-31 Herstellungsverfahren für ein Halbleiterbauelement bzw. einen Transistor mit eingebettetem Si/GE-Material mit einem verbesserten Boreinschluss sowie Transistor
US12/503,340 US20100025743A1 (en) 2008-07-31 2009-07-15 Transistor with embedded si/ge material having enhanced boron confinement
PCT/US2009/004425 WO2010014251A2 (en) 2008-07-31 2009-07-31 Transistor with embedded si/ge material having enhanced boron confinement

Publications (3)

Publication Number Publication Date
GB201100855D0 GB201100855D0 (en) 2011-03-02
GB2474170A GB2474170A (en) 2011-04-06
GB2474170B true GB2474170B (en) 2012-08-22

Family

ID=41461560

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1100855.4A Active GB2474170B (en) 2008-07-31 2009-07-31 Transistor with embedded si/ge material having enhanced boron confinement

Country Status (8)

Country Link
US (1) US20100025743A1 (enExample)
JP (1) JP2011530167A (enExample)
KR (1) KR20110046501A (enExample)
CN (1) CN102105965A (enExample)
DE (1) DE102008035806B4 (enExample)
GB (1) GB2474170B (enExample)
TW (1) TW201017773A (enExample)
WO (1) WO2010014251A2 (enExample)

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US20110012177A1 (en) * 2009-07-20 2011-01-20 International Business Machines Corporation Nanostructure For Changing Electric Mobility
US8368125B2 (en) 2009-07-20 2013-02-05 International Business Machines Corporation Multiple orientation nanowires with gate stack stressors
KR20120107762A (ko) * 2011-03-22 2012-10-04 삼성전자주식회사 반도체 소자의 제조 방법
US9263342B2 (en) * 2012-03-02 2016-02-16 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device having a strained region
US8674447B2 (en) 2012-04-27 2014-03-18 International Business Machines Corporation Transistor with improved sigma-shaped embedded stressor and method of formation
US9165944B2 (en) 2013-10-07 2015-10-20 Globalfoundries Inc. Semiconductor device including SOI butted junction to reduce short-channel penalty
US10153371B2 (en) 2014-02-07 2018-12-11 Stmicroelectronics, Inc. Semiconductor device with fins including sidewall recesses
US9190516B2 (en) * 2014-02-21 2015-11-17 Globalfoundries Inc. Method for a uniform compressive strain layer and device thereof
US9190418B2 (en) 2014-03-18 2015-11-17 Globalfoundries U.S. 2 Llc Junction butting in SOI transistor with embedded source/drain
US9466718B2 (en) 2014-03-31 2016-10-11 Stmicroelectronics, Inc. Semiconductor device with fin and related methods
US10008568B2 (en) 2015-03-30 2018-06-26 Taiwan Semiconductor Manufacturing Co., Ltd. Structure and formation method of semiconductor device structure
US9741853B2 (en) * 2015-10-29 2017-08-22 Globalfoundries Inc. Stress memorization techniques for transistor devices
JP7150524B2 (ja) * 2018-08-24 2022-10-11 キオクシア株式会社 半導体装置

Citations (1)

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Publication number Priority date Publication date Assignee Title
US20060148220A1 (en) * 2005-01-04 2006-07-06 Nick Lindert Plasma implantation of impurities in junction region recesses

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US5770485A (en) * 1997-03-04 1998-06-23 Advanced Micro Devices, Inc. MOSFET device with an amorphized source and fabrication method thereof
JPH10308361A (ja) * 1997-05-07 1998-11-17 Mitsubishi Electric Corp 半導体装置及びその製造方法
US5877056A (en) * 1998-01-08 1999-03-02 Texas Instruments-Acer Incorporated Ultra-short channel recessed gate MOSFET with a buried contact
US6580639B1 (en) * 1999-08-10 2003-06-17 Advanced Micro Devices, Inc. Method of reducing program disturbs in NAND type flash memory devices
JP2002057118A (ja) * 2000-08-09 2002-02-22 Toshiba Corp 半導体装置とその製造方法
US6657223B1 (en) * 2002-10-29 2003-12-02 Advanced Micro Devices, Inc. Strained silicon MOSFET having silicon source/drain regions and method for its fabrication
KR100588786B1 (ko) * 2003-09-18 2006-06-12 동부일렉트로닉스 주식회사 반도체 소자 제조방법
JP4375619B2 (ja) * 2004-05-26 2009-12-02 富士通マイクロエレクトロニクス株式会社 半導体装置の製造方法
JP4837902B2 (ja) * 2004-06-24 2011-12-14 富士通セミコンダクター株式会社 半導体装置
JP2006059843A (ja) * 2004-08-17 2006-03-02 Toshiba Corp 半導体装置とその製造方法
US7407850B2 (en) * 2005-03-29 2008-08-05 Texas Instruments Incorporated N+ poly on high-k dielectric for semiconductor devices
US7892905B2 (en) * 2005-08-02 2011-02-22 Globalfoundries Singapore Pte. Ltd. Formation of strained Si channel and Si1-xGex source/drain structures using laser annealing
US7612421B2 (en) * 2005-10-11 2009-11-03 Atmel Corporation Electronic device with dopant diffusion barrier and tunable work function and methods of making same
DE102005052055B3 (de) * 2005-10-31 2007-04-26 Advanced Micro Devices, Inc., Sunnyvale Eingebettete Verformungsschicht in dünnen SOI-Transistoren und Verfahren zur Herstellung desselben
US7608515B2 (en) * 2006-02-14 2009-10-27 Taiwan Semiconductor Manufacturing Company, Ltd. Diffusion layer for stressed semiconductor devices
US7364976B2 (en) * 2006-03-21 2008-04-29 Intel Corporation Selective etch for patterning a semiconductor film deposited non-selectively
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DE102007030053B4 (de) * 2007-06-29 2011-07-21 Advanced Micro Devices, Inc., Calif. Reduzieren der pn-Übergangskapazität in einem Transistor durch Absenken von Drain- und Source-Gebieten
US7927989B2 (en) * 2007-07-27 2011-04-19 Freescale Semiconductor, Inc. Method for forming a transistor having gate dielectric protection and structure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060148220A1 (en) * 2005-01-04 2006-07-06 Nick Lindert Plasma implantation of impurities in junction region recesses

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH, SECTION -B, Vol. 237, No 1-2, 1 August 2005, pages 203-207. *

Also Published As

Publication number Publication date
DE102008035806B4 (de) 2010-06-10
WO2010014251A3 (en) 2010-04-08
GB2474170A (en) 2011-04-06
DE102008035806A1 (de) 2010-02-04
KR20110046501A (ko) 2011-05-04
CN102105965A (zh) 2011-06-22
TW201017773A (en) 2010-05-01
GB201100855D0 (en) 2011-03-02
US20100025743A1 (en) 2010-02-04
WO2010014251A2 (en) 2010-02-04
JP2011530167A (ja) 2011-12-15

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