GB2248450B - Anisotropically electroconductive adhesive and structure adhesively bonded therewith - Google Patents

Anisotropically electroconductive adhesive and structure adhesively bonded therewith

Info

Publication number
GB2248450B
GB2248450B GB9120743A GB9120743A GB2248450B GB 2248450 B GB2248450 B GB 2248450B GB 9120743 A GB9120743 A GB 9120743A GB 9120743 A GB9120743 A GB 9120743A GB 2248450 B GB2248450 B GB 2248450B
Authority
GB
United Kingdom
Prior art keywords
adhesively bonded
electroconductive adhesive
bonded therewith
anisotropically electroconductive
structure adhesively
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9120743A
Other languages
English (en)
Other versions
GB9120743D0 (en
GB2248450A (en
Inventor
Satoshi Odashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Publication of GB9120743D0 publication Critical patent/GB9120743D0/en
Publication of GB2248450A publication Critical patent/GB2248450A/en
Application granted granted Critical
Publication of GB2248450B publication Critical patent/GB2248450B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Non-Insulated Conductors (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
GB9120743A 1990-10-05 1991-09-30 Anisotropically electroconductive adhesive and structure adhesively bonded therewith Expired - Fee Related GB2248450B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2268147A JPH07123179B2 (ja) 1990-10-05 1990-10-05 異方導電接着剤による回路基板の接続構造

Publications (3)

Publication Number Publication Date
GB9120743D0 GB9120743D0 (en) 1991-11-13
GB2248450A GB2248450A (en) 1992-04-08
GB2248450B true GB2248450B (en) 1994-03-09

Family

ID=17454550

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9120743A Expired - Fee Related GB2248450B (en) 1990-10-05 1991-09-30 Anisotropically electroconductive adhesive and structure adhesively bonded therewith

Country Status (5)

Country Link
US (1) US5183969A (https=)
JP (1) JPH07123179B2 (https=)
DE (1) DE4132726A1 (https=)
GB (1) GB2248450B (https=)
TW (1) TW218394B (https=)

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US5667884A (en) * 1993-04-12 1997-09-16 Bolger; Justin C. Area bonding conductive adhesive preforms
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DE4327560A1 (de) * 1993-08-17 1995-02-23 Hottinger Messtechnik Baldwin Verfahren zum Kontaktieren von Leiterbahnanordnungen und Kontaktanordnung
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JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
JP4630719B2 (ja) * 2005-04-14 2011-02-09 キヤノン株式会社 インクジェット記録ヘッド
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JP5003113B2 (ja) * 2006-11-16 2012-08-15 三菱電機株式会社 フレキシブル配線基板の接続構造
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JP4463297B2 (ja) 2007-08-07 2010-05-19 三洋電機株式会社 太陽電池モジュール
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US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
JP6279828B2 (ja) * 2012-07-09 2018-02-14 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法
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TW201408754A (zh) * 2012-08-29 2014-03-01 Compal Electronics Inc 黏著材料及具有熱阻隔能力基板結構的製作方法
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JP6508677B2 (ja) * 2015-03-20 2019-05-08 デクセリアルズ株式会社 異方性導電接続方法及び異方性導電接続構造体
CN113840474A (zh) * 2021-09-27 2021-12-24 信利半导体有限公司 一种fpc与tft的绑定方法及显示模组
CN114206020B (zh) * 2021-12-10 2024-03-22 苏州华星光电技术有限公司 一种邦定装置以及邦定方法

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Publication number Priority date Publication date Assignee Title
JPS51114439A (en) * 1975-04-02 1976-10-08 Seiko Epson Corp An adhesive having anisotropic electroconductivity
GB2027715A (en) * 1978-08-04 1980-02-27 Western Electric Co Conductive adhesive coposition
GB2028828A (en) * 1978-08-04 1980-03-12 Western Electric Co Conductive Adhesive System Including a Conductivity Enhancer
JPS596006B2 (ja) * 1975-11-13 1984-02-08 セイコーエプソン株式会社 ドウデンイホウセイノセツチヤクホウシキ
EP0140585A1 (en) * 1983-09-30 1985-05-08 Electro Materials Corp. Of America A method of forming a solderable, electrically conductive film on a substrate and the conductive composition itself
EP0169059A2 (en) * 1984-07-18 1986-01-22 Electro Materials Corp. Of America Flexible, directly solderable conductive compositions, compositions useful in forming them, and their use as coatings on substrates
EP0169060A2 (en) * 1984-07-18 1986-01-22 Electro Materials Corp. Of America Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them
JPS62177082A (ja) * 1986-01-30 1987-08-03 Toray Ind Inc 異方導電性接着剤
JPS6386783A (ja) * 1987-07-10 1988-04-18 Shin Etsu Polymer Co Ltd 異方導電熱接着性フィルム
JPS6389584A (ja) * 1986-10-02 1988-04-20 Shin Etsu Polymer Co Ltd 異方導電性接着膜
JPH01113480A (ja) * 1987-10-27 1989-05-02 Sony Chem Corp 熱硬化型異方性導電接着剤
GB2239244A (en) * 1989-11-14 1991-06-26 David Durand Moisture-resistant electrically conductive cements

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Publication number Priority date Publication date Assignee Title
JPS51114439A (en) * 1975-04-02 1976-10-08 Seiko Epson Corp An adhesive having anisotropic electroconductivity
JPS596006B2 (ja) * 1975-11-13 1984-02-08 セイコーエプソン株式会社 ドウデンイホウセイノセツチヤクホウシキ
GB2027715A (en) * 1978-08-04 1980-02-27 Western Electric Co Conductive adhesive coposition
GB2028828A (en) * 1978-08-04 1980-03-12 Western Electric Co Conductive Adhesive System Including a Conductivity Enhancer
EP0140585A1 (en) * 1983-09-30 1985-05-08 Electro Materials Corp. Of America A method of forming a solderable, electrically conductive film on a substrate and the conductive composition itself
EP0169059A2 (en) * 1984-07-18 1986-01-22 Electro Materials Corp. Of America Flexible, directly solderable conductive compositions, compositions useful in forming them, and their use as coatings on substrates
EP0169060A2 (en) * 1984-07-18 1986-01-22 Electro Materials Corp. Of America Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them
JPS62177082A (ja) * 1986-01-30 1987-08-03 Toray Ind Inc 異方導電性接着剤
JPS6389584A (ja) * 1986-10-02 1988-04-20 Shin Etsu Polymer Co Ltd 異方導電性接着膜
JPS6386783A (ja) * 1987-07-10 1988-04-18 Shin Etsu Polymer Co Ltd 異方導電熱接着性フィルム
JPH01113480A (ja) * 1987-10-27 1989-05-02 Sony Chem Corp 熱硬化型異方性導電接着剤
GB2239244A (en) * 1989-11-14 1991-06-26 David Durand Moisture-resistant electrically conductive cements

Also Published As

Publication number Publication date
JPH04145180A (ja) 1992-05-19
JPH07123179B2 (ja) 1995-12-25
GB9120743D0 (en) 1991-11-13
TW218394B (https=) 1994-01-01
US5183969A (en) 1993-02-02
GB2248450A (en) 1992-04-08
DE4132726A1 (de) 1992-04-09

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Effective date: 20080930