GB2184728B - Heat activatable adhesives for wire scribed circuit boards - Google Patents

Heat activatable adhesives for wire scribed circuit boards

Info

Publication number
GB2184728B
GB2184728B GB8630332A GB8630332A GB2184728B GB 2184728 B GB2184728 B GB 2184728B GB 8630332 A GB8630332 A GB 8630332A GB 8630332 A GB8630332 A GB 8630332A GB 2184728 B GB2184728 B GB 2184728B
Authority
GB
United Kingdom
Prior art keywords
polymeric resin
circuit boards
heat activatable
activatable adhesives
staging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8630332A
Other languages
English (en)
Other versions
GB2184728A (en
GB8630332D0 (en
Inventor
Marju Laube Friedrich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of GB8630332D0 publication Critical patent/GB8630332D0/en
Publication of GB2184728A publication Critical patent/GB2184728A/en
Application granted granted Critical
Publication of GB2184728B publication Critical patent/GB2184728B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00—Mixing; Kneading
    • B29B7/30—Mixing; Kneading continuous, with mechanical mixing or kneading devices
    • B29B7/58—Component parts, details or accessories; Auxiliary operations
    • B29B7/72—Measuring, controlling or regulating
    • B29B7/726—Measuring properties of mixture, e.g. temperature or density
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3801—Permanent connections, i.e. wherein fibres are kept aligned by mechanical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Polymers & Plastics (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Paints Or Removers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Epoxy Resins (AREA)
GB8630332A 1985-12-20 1986-12-19 Heat activatable adhesives for wire scribed circuit boards Expired - Fee Related GB2184728B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81142185A 1985-12-20 1985-12-20

Publications (3)

Publication Number Publication Date
GB8630332D0 GB8630332D0 (en) 1987-01-28
GB2184728A GB2184728A (en) 1987-07-01
GB2184728B true GB2184728B (en) 1990-03-21

Family

ID=25206508

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8630332A Expired - Fee Related GB2184728B (en) 1985-12-20 1986-12-19 Heat activatable adhesives for wire scribed circuit boards

Country Status (8)

Country Link
EP (1) EP0227002B1 (enExample)
JP (2) JPS62148584A (enExample)
AT (1) ATE83497T1 (enExample)
AU (1) AU587097B2 (enExample)
CA (1) CA1304865C (enExample)
DE (1) DE3643660A1 (enExample)
FR (1) FR2594838B1 (enExample)
GB (1) GB2184728B (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4788091A (en) * 1987-08-17 1988-11-29 Emhart Enterprises Corp. Flame retardant embossing film
US4972050A (en) * 1989-06-30 1990-11-20 Kollmorgen Corporation Wire scribed circuit boards and methods of their manufacture
WO1992020754A1 (en) * 1991-05-16 1992-11-26 Minnesota Mining And Manufacturing Company Epoxide-based adhesive
JPH07244116A (ja) * 1994-03-07 1995-09-19 Hitachi Chem Co Ltd 半導体特性測定用治具とその製造法並びにその使用方法
KR100568491B1 (ko) * 1997-07-04 2006-04-07 제온 코포레이션 반도체부품 접착제
JP3591844B2 (ja) 1997-07-17 2004-11-24 フーバー ウント ズーナー アーゲー 光波ガイドを光学的プラグイン接続のためにコネクタに固定する方法
GB2353532B (en) * 1998-03-23 2001-08-01 Api Foils Ltd Hot dieless foiling
EP1004227A1 (en) * 1998-05-01 2000-05-31 Isola Laminate Systems Corporation Intermediate layer to improve peel strength of copper foils
JP5142238B2 (ja) * 2001-02-02 2013-02-13 コニシ株式会社 揺変性持続型エポキシ樹脂組成物
JP2003217921A (ja) * 2001-11-16 2003-07-31 Furukawa Electric Co Ltd:The 回路布線用粘接着フィルムおよびそれを用いた樹脂付き回路
EP1807239A2 (de) 2004-11-02 2007-07-18 Imasys AG Verlegevorrichtung, kontaktiervorrichtung, zustellsystem, verlege- und kontaktiereinheit herstellungsanlage, verfahren zur herstellung und eine transpondereinheit
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
EP2040201B1 (en) 2007-09-18 2010-11-17 HID Global Ireland Teoranta Method for bonding a wire conductor laid on a substrate
KR101075192B1 (ko) * 2009-03-03 2011-10-21 도레이첨단소재 주식회사 전자부품 제조용 점착테이프
JP2011051189A (ja) * 2009-09-01 2011-03-17 Ju Teng Internatl Holdings Ltd ケーシングの埋め込み成形方法
ITTO20110283A1 (it) * 2011-03-29 2012-09-30 Avio Spa Formulazioni polimeriche a reologia chimicamente regolabile per la fabbricazione di preimpregnati e articoli in materiale composito
WO2014046014A1 (ja) * 2012-09-20 2014-03-27 株式会社クラレ 回路基板およびその製造方法
EP3024871B1 (en) 2013-07-26 2022-12-07 Zephyros Inc. Thermosetting adhesive films including a fibrous carrier
CN108659773A (zh) * 2017-03-29 2018-10-16 孚能科技（赣州）有限公司 一种电池组的灌封方法和电池组
CN109722196B (zh) * 2018-12-28 2021-10-29 蚌埠赛尔时代工贸有限公司 一种常温固化石材干挂胶的制备方法
CN109722195B (zh) * 2018-12-28 2021-10-29 蚌埠赛尔时代工贸有限公司 一种抗冲击、剪压强度高的石材干挂胶
CN115850776B (zh) * 2022-11-29 2024-01-30 桂林电器科学研究院有限公司 高结合力聚酰亚胺薄膜及其制备方法
CN119119885B (zh) * 2024-09-25 2025-04-25 惠州市亿力通新材料有限公司 一种pvc胶带

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3321549A (en) * 1964-06-15 1967-05-23 Union Carbide Corp Thermoplastic polyhydroxyethers modified by the addition of a blend of an epoxy resin and an amine blocked polyisocyanate
US3740289A (en) * 1968-10-10 1973-06-19 Allen Bradley Co Method for making adhesive coated ferrite magnets
US3655818A (en) * 1968-10-18 1972-04-11 Minnesota Mining & Mfg Particulate adhesive containing polyepoxides carboxylated butadiene-acrylonitrile copolymer and a urea derivative as a curing agent
US4169732A (en) * 1978-01-09 1979-10-02 International Business Machines Corporation Photosensitive coating composition and use thereof
JPS596591A (ja) * 1982-06-28 1984-01-13 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン ワイヤ封入型回路板の製造方法
US4544801A (en) * 1982-06-28 1985-10-01 International Business Machines Corporation Circuit board including multiple wire photosensitive adhesive

Also Published As

Publication number Publication date
FR2594838A1 (fr) 1987-08-28
JPH0212995B2 (enExample) 1990-04-03
JPS62148584A (ja) 1987-07-02
FR2594838B1 (fr) 1988-11-10
JPH037709B2 (enExample) 1991-02-04
GB2184728A (en) 1987-07-01
JPH02187486A (ja) 1990-07-23
DE3643660C2 (enExample) 1992-04-30
EP0227002A1 (en) 1987-07-01
AU6664686A (en) 1987-06-25
CA1304865C (en) 1992-07-07
GB8630332D0 (en) 1987-01-28
ATE83497T1 (de) 1993-01-15
DE3643660A1 (de) 1987-06-25
AU587097B2 (en) 1989-08-03
EP0227002B1 (en) 1992-12-16

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20041219