GB2151845A - A semiconductor memory - Google Patents

A semiconductor memory Download PDF

Info

Publication number
GB2151845A
GB2151845A GB08429620A GB8429620A GB2151845A GB 2151845 A GB2151845 A GB 2151845A GB 08429620 A GB08429620 A GB 08429620A GB 8429620 A GB8429620 A GB 8429620A GB 2151845 A GB2151845 A GB 2151845A
Authority
GB
United Kingdom
Prior art keywords
header
resin
transistor
guides
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08429620A
Other languages
English (en)
Other versions
GB8429620D0 (en
Inventor
Masao Yamaguchi
Nobukatsu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB8429620D0 publication Critical patent/GB8429620D0/en
Publication of GB2151845A publication Critical patent/GB2151845A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W70/481—
    • H10W72/00—
    • H10W72/5363—
    • H10W72/5449—
    • H10W74/00—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB08429620A 1983-12-16 1984-11-23 A semiconductor memory Withdrawn GB2151845A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58236154A JPS60128646A (ja) 1983-12-16 1983-12-16 絶縁型パワートランジスタの製造方法

Publications (2)

Publication Number Publication Date
GB8429620D0 GB8429620D0 (en) 1985-01-03
GB2151845A true GB2151845A (en) 1985-07-24

Family

ID=16996560

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08429620A Withdrawn GB2151845A (en) 1983-12-16 1984-11-23 A semiconductor memory

Country Status (3)

Country Link
JP (1) JPS60128646A (cg-RX-API-DMAC10.html)
KR (1) KR930007518B1 (cg-RX-API-DMAC10.html)
GB (1) GB2151845A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4115128A1 (de) * 1990-05-24 1991-11-28 Motorola Inc Halbleiter-leistungs-anordnung fuer hochfrequnez-anwendungen
US9620391B2 (en) 2002-10-11 2017-04-11 Micronas Gmbh Electronic component with a leadframe
WO2020050991A1 (en) * 2018-09-04 2020-03-12 Apple Inc. Overmolded electronic components on circuit board

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60172346U (ja) * 1984-04-23 1985-11-15 新電元工業株式会社 樹脂密封型半導体装置
JPS61207040U (cg-RX-API-DMAC10.html) * 1985-06-17 1986-12-27
JPS62180957U (cg-RX-API-DMAC10.html) * 1986-05-06 1987-11-17
JPH079917B2 (ja) * 1987-05-11 1995-02-01 サンケン電気株式会社 樹脂封止型半導体装置の製造方法
JPH0824156B2 (ja) * 1987-05-25 1996-03-06 サンケン電気株式会社 樹脂封止型半導体装置の製造方法
JPH0744194B2 (ja) * 1989-02-17 1995-05-15 サンケン電気株式会社 樹脂封止形半導体装置の製造方法
JP3598579B2 (ja) * 1995-04-17 2004-12-08 株式会社デンソー 電磁弁ブロック
JP4953205B2 (ja) * 2007-05-01 2012-06-13 三菱電機株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0063811A1 (en) * 1981-04-28 1982-11-03 Matsushita Electronics Corporation A method for manufacturing a plastic encapsulated semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS615818Y2 (cg-RX-API-DMAC10.html) * 1979-06-07 1986-02-21
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
JPS58143538A (ja) * 1982-02-19 1983-08-26 Matsushita Electronics Corp 樹脂封止形半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0063811A1 (en) * 1981-04-28 1982-11-03 Matsushita Electronics Corporation A method for manufacturing a plastic encapsulated semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4115128A1 (de) * 1990-05-24 1991-11-28 Motorola Inc Halbleiter-leistungs-anordnung fuer hochfrequnez-anwendungen
DE4115128C2 (de) * 1990-05-24 1999-09-30 Motorola Inc Halbleiter-Leistungs-Anordnung für Hochfrequenz-Anwendungen und Verfahren zu Bildung einer solchen
US9620391B2 (en) 2002-10-11 2017-04-11 Micronas Gmbh Electronic component with a leadframe
WO2020050991A1 (en) * 2018-09-04 2020-03-12 Apple Inc. Overmolded electronic components on circuit board
US11602055B2 (en) 2018-09-04 2023-03-07 Apple Inc. Overmolded components having sub-flush residuals
US12156345B2 (en) 2018-09-04 2024-11-26 Apple Inc. Overmolded components having sub-flush residuals

Also Published As

Publication number Publication date
GB8429620D0 (en) 1985-01-03
JPS60128646A (ja) 1985-07-09
JPH0527261B2 (cg-RX-API-DMAC10.html) 1993-04-20
KR850005152A (ko) 1985-08-21
KR930007518B1 (ko) 1993-08-12

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)