GB2138633B - Bonding semiconductor chips to a lead frame - Google Patents

Bonding semiconductor chips to a lead frame

Info

Publication number
GB2138633B
GB2138633B GB08409512A GB8409512A GB2138633B GB 2138633 B GB2138633 B GB 2138633B GB 08409512 A GB08409512 A GB 08409512A GB 8409512 A GB8409512 A GB 8409512A GB 2138633 B GB2138633 B GB 2138633B
Authority
GB
United Kingdom
Prior art keywords
lead frame
semiconductor chips
bonding semiconductor
bonding
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08409512A
Other languages
English (en)
Other versions
GB2138633A (en
Inventor
Toshio Tetsuya
Hiroyuki Baba
Osamu Usuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of GB2138633A publication Critical patent/GB2138633A/en
Application granted granted Critical
Publication of GB2138633B publication Critical patent/GB2138633B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
GB08409512A 1983-04-16 1984-04-12 Bonding semiconductor chips to a lead frame Expired GB2138633B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58066340A JPS59193036A (ja) 1983-04-16 1983-04-16 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
GB2138633A GB2138633A (en) 1984-10-24
GB2138633B true GB2138633B (en) 1986-10-01

Family

ID=13313027

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08409512A Expired GB2138633B (en) 1983-04-16 1984-04-12 Bonding semiconductor chips to a lead frame

Country Status (3)

Country Link
JP (1) JPS59193036A (enExample)
DE (1) DE3413885A1 (enExample)
GB (1) GB2138633B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3446780A1 (de) * 1984-12-21 1986-07-03 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren und verbindungswerkstoff zum metallischen verbinden von bauteilen
US4954870A (en) * 1984-12-28 1990-09-04 Kabushiki Kaisha Toshiba Semiconductor device
JPS61156823A (ja) * 1984-12-28 1986-07-16 Toshiba Corp 半導体装置
JPH0783034B2 (ja) * 1986-03-29 1995-09-06 株式会社東芝 半導体装置
JPS63110765A (ja) * 1986-10-29 1988-05-16 Sumitomo Metal Mining Co Ltd Ｉｃ用リ−ドフレ−ム
US7776452B2 (en) 2004-08-10 2010-08-17 Neomax Materials Co. Ltd. Heat sink member and method of manufacturing the same
CA2609252C (en) 2005-05-23 2012-01-10 Neomax Materials Co., Ltd. Cu-mo substrate and method for producing same
US20100247955A1 (en) 2006-09-29 2010-09-30 Kabushiki Kaisha Toshiba Joint with first and second members with a joining layer located therebetween containing sn metal and another metallic material; methods for forming the same
JP2008221290A (ja) * 2007-03-14 2008-09-25 Toshiba Corp 接合体および接合方法
JP5253794B2 (ja) * 2006-12-25 2013-07-31 山陽特殊製鋼株式会社 鉛フリー接合用材料およびその製造方法
JP5758242B2 (ja) * 2011-09-06 2015-08-05 山陽特殊製鋼株式会社 鉛フリー接合材料
JP5744080B2 (ja) * 2013-02-04 2015-07-01 株式会社東芝 接合体および半導体装置
JP2015056646A (ja) * 2013-09-13 2015-03-23 株式会社東芝 半導体装置及び半導体モジュール

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB907734A (en) * 1959-06-06 1962-10-10 Teizo Takikawa Method of soldering silicon or silicon alloy
DE1298387C2 (de) * 1964-02-06 1973-07-26 Semikron Gleichrichterbau Halbleiter-Anordnung
GB1389542A (en) * 1971-06-17 1975-04-03 Mullard Ltd Methods of securing a semiconductor body to a support
US3821785A (en) * 1972-03-27 1974-06-28 Signetics Corp Semiconductor structure with bumps
DE2514922C2 (de) * 1975-04-05 1983-01-27 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Gegen thermische Wechselbelastung beständiges Halbleiterbauelement
JPS592174B2 (ja) * 1978-07-28 1984-01-17 株式会社東芝 半導体装置
DE2930789C2 (de) * 1978-07-28 1983-08-04 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa Halbleitervorrichtung
JPS592175B2 (ja) * 1978-07-28 1984-01-17 株式会社東芝 半導体装置
JPS5521106A (en) * 1978-07-31 1980-02-15 Nec Home Electronics Ltd Method of forming ohmic electrode
JPS55107238A (en) * 1979-02-09 1980-08-16 Hitachi Ltd Semiconductor device and method of manufacturing the same

Also Published As

Publication number Publication date
JPH0226376B2 (enExample) 1990-06-08
JPS59193036A (ja) 1984-11-01
DE3413885C2 (enExample) 1990-02-22
DE3413885A1 (de) 1984-10-25
GB2138633A (en) 1984-10-24

Similar Documents

Publication Publication Date Title
DE3468809D1 (en) Semiconductor integrated circuit including a lead frame chip support
DE3476296D1 (en) Semiconductor package
DE3380380D1 (en) Power chip package
DE3172625D1 (en) Connection part for removably connecting a semiconductor chip to said part
GB2164213B (en) Structure for connecting leadless chip carrier
GB8405827D0 (en) Semiconductor chip carrier
DE3277758D1 (en) Semiconductor chip mounting module
GB2144657B (en) Attaching semiconductors to lead frames
EP0147998A3 (en) Semiconductor ic output circuitry
IL87095A0 (en) Package for semiconductor chips
EP0253444A3 (en) Method of bonding a semiconductor chip to a substrate
DE3370240D1 (en) Bonding leads to semiconductor devices
DE3479271D1 (en) Wire bonding method for producing a semiconductor device and semiconductor device produced by this method
DE3477864D1 (en) Lead frame for a semiconductor element
GB2138633B (en) Bonding semiconductor chips to a lead frame
DE3278844D1 (en) A semiconductor device having a leadless chip carrier
GB8522166D0 (en) Encapsulating semiconductor components
DE3370407D1 (en) Package for a semiconductor chip with lead terminals
GB8506111D0 (en) Encapsulating semiconductor components
IL86643A (en) Tape automated bonding semiconductor package
GB2221570B (en) Bonding a semiconductor to a substrate
GB8426633D0 (en) Packages for semi-conductor devices
GB2146174B (en) Hermetic power chip packages
EP0256357A3 (en) Semiconductor chip including a bump structure for tape automated bonding
EP0190077A3 (en) A package structure for a semiconductor chip

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19980412