GB1595245A - Method of producing thinclad materials for printed circuits - Google Patents
Method of producing thinclad materials for printed circuits Download PDFInfo
- Publication number
- GB1595245A GB1595245A GB54191/77A GB5419177A GB1595245A GB 1595245 A GB1595245 A GB 1595245A GB 54191/77 A GB54191/77 A GB 54191/77A GB 5419177 A GB5419177 A GB 5419177A GB 1595245 A GB1595245 A GB 1595245A
- Authority
- GB
- United Kingdom
- Prior art keywords
- metal
- foil
- pressure
- pressure laminate
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/208—Magnetic, paramagnetic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Insulating Bodies (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2659625A DE2659625C3 (de) | 1976-12-30 | 1976-12-30 | Verfahren zur Herstellung von Basismaterial zur Herstellung gedruckter Schaltungen |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1595245A true GB1595245A (en) | 1981-08-12 |
Family
ID=5997078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB54191/77A Expired GB1595245A (en) | 1976-12-30 | 1977-12-29 | Method of producing thinclad materials for printed circuits |
Country Status (11)
Country | Link |
---|---|
JP (1) | JPS53111480A (es) |
BE (1) | BE862476A (es) |
BR (1) | BR7708768A (es) |
CH (1) | CH627405A5 (es) |
DE (1) | DE2659625C3 (es) |
ES (1) | ES466030A1 (es) |
FR (1) | FR2376593A1 (es) |
GB (1) | GB1595245A (es) |
IT (1) | IT1091341B (es) |
NL (1) | NL7714506A (es) |
SE (1) | SE7714867L (es) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2486875A1 (fr) * | 1980-07-17 | 1982-01-22 | Dassault Avions | Procede pour metalliser au moins partiellement la surface d'une piece stratifiee |
DE3631055C1 (de) * | 1986-09-12 | 1987-05-21 | Deutsche Automobilgesellsch | Verfahren zum kontinuierlichen Traenken von Vliesstoff- oder Nadelfilzbahnen mit einer Aktivierungsloesung |
JPH0648384Y2 (ja) * | 1988-06-28 | 1994-12-12 | 株式会社千代田製作所 | 標本整理用スライドガラスアダプタ |
CN107529293B (zh) * | 2017-09-18 | 2019-05-28 | Oppo广东移动通信有限公司 | 一种移动终端、多层pcb电路板及其制造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL135706C (es) * | 1966-07-29 | 1900-01-01 | ||
DE1646064C3 (de) * | 1966-12-29 | 1978-05-24 | Politechnika Slaska Im. Wincentego Pstrowskiego, Gleiwitz (Polen) | Verfahren zur Herstellung von mit Polyesterharzen beschichteten Metallfolien für elektro- und radiotechnische sowie elektronische Zwecke |
DE1690025B2 (de) * | 1967-08-09 | 1976-10-07 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Vorbehandlungsverfahren fuer duenne isolierfolien aus polyaethylenterephthalat |
BE788117A (fr) * | 1971-08-30 | 1973-02-28 | Perstorp Ab | Procede de production d'elements pour circuits imprimes |
DE2413932C2 (de) * | 1973-04-25 | 1984-08-30 | Yates Industries, Inc., Bordentown, N.J. | Verfahren zum Herstellen einer Verbundfolie für die Ausbildung gedruckter Schaltkreise |
JPS5143571A (ja) * | 1974-10-09 | 1976-04-14 | Hiroki Katsuki | Keesuisosochi |
-
1976
- 1976-12-30 DE DE2659625A patent/DE2659625C3/de not_active Expired
-
1977
- 1977-12-26 JP JP15873377A patent/JPS53111480A/ja active Granted
- 1977-12-29 SE SE7714867A patent/SE7714867L/xx not_active Application Discontinuation
- 1977-12-29 NL NL7714506A patent/NL7714506A/xx not_active Application Discontinuation
- 1977-12-29 ES ES466030A patent/ES466030A1/es not_active Expired
- 1977-12-29 GB GB54191/77A patent/GB1595245A/en not_active Expired
- 1977-12-29 CH CH1621877A patent/CH627405A5/de not_active IP Right Cessation
- 1977-12-29 BE BE183974A patent/BE862476A/xx unknown
- 1977-12-29 IT IT52423/77A patent/IT1091341B/it active
- 1977-12-29 BR BR7708768A patent/BR7708768A/pt unknown
- 1977-12-30 FR FR7739862A patent/FR2376593A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
SE7714867L (sv) | 1978-07-01 |
BE862476A (fr) | 1978-04-14 |
DE2659625B2 (de) | 1979-01-11 |
BR7708768A (pt) | 1978-09-05 |
ES466030A1 (es) | 1978-10-01 |
NL7714506A (nl) | 1978-07-04 |
DE2659625A1 (de) | 1978-07-06 |
IT1091341B (it) | 1985-07-06 |
FR2376593B1 (es) | 1980-07-04 |
CH627405A5 (en) | 1982-01-15 |
DE2659625C3 (de) | 1981-07-02 |
JPS53111480A (en) | 1978-09-29 |
FR2376593A1 (fr) | 1978-07-28 |
JPS5731675B2 (es) | 1982-07-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |