BE862476A - Procede pour la fabrication de materiaux de pellicules minces pour des circuits imprimes - Google Patents

Procede pour la fabrication de materiaux de pellicules minces pour des circuits imprimes

Info

Publication number
BE862476A
BE862476A BE183974A BE183974A BE862476A BE 862476 A BE862476 A BE 862476A BE 183974 A BE183974 A BE 183974A BE 183974 A BE183974 A BE 183974A BE 862476 A BE862476 A BE 862476A
Authority
BE
Belgium
Prior art keywords
manufacture
thin film
film materials
printed circuits
printed
Prior art date
Application number
BE183974A
Other languages
English (en)
French (fr)
Original Assignee
Ferrozell Ges Sachs & Co M B H
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferrozell Ges Sachs & Co M B H filed Critical Ferrozell Ges Sachs & Co M B H
Publication of BE862476A publication Critical patent/BE862476A/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036Multilayers with layers of different types
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0004Cutting, tearing or severing, e.g. bursting; Cutter details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206Insulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/208Magnetic, paramagnetic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulating Bodies (AREA)
  • Physical Vapour Deposition (AREA)
BE183974A 1976-12-30 1977-12-29 Procede pour la fabrication de materiaux de pellicules minces pour des circuits imprimes BE862476A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2659625A DE2659625C3 (de) 1976-12-30 1976-12-30 Verfahren zur Herstellung von Basismaterial zur Herstellung gedruckter Schaltungen

Publications (1)

Publication Number Publication Date
BE862476A true BE862476A (fr) 1978-04-14

Family

ID=5997078

Family Applications (1)

Application Number Title Priority Date Filing Date
BE183974A BE862476A (fr) 1976-12-30 1977-12-29 Procede pour la fabrication de materiaux de pellicules minces pour des circuits imprimes

Country Status (11)

Country Link
JP (1) JPS53111480A (xx)
BE (1) BE862476A (xx)
BR (1) BR7708768A (xx)
CH (1) CH627405A5 (xx)
DE (1) DE2659625C3 (xx)
ES (1) ES466030A1 (xx)
FR (1) FR2376593A1 (xx)
GB (1) GB1595245A (xx)
IT (1) IT1091341B (xx)
NL (1) NL7714506A (xx)
SE (1) SE7714867L (xx)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2486875A1 (fr) * 1980-07-17 1982-01-22 Dassault Avions Procede pour metalliser au moins partiellement la surface d'une piece stratifiee
DE3631055C1 (de) * 1986-09-12 1987-05-21 Deutsche Automobilgesellsch Verfahren zum kontinuierlichen Traenken von Vliesstoff- oder Nadelfilzbahnen mit einer Aktivierungsloesung
JPH0648384Y2 (ja) * 1988-06-28 1994-12-12 株式会社千代田製作所 標本整理用スライドガラスアダプタ
CN107529293B (zh) * 2017-09-18 2019-05-28 Oppo广东移动通信有限公司 一种移动终端、多层pcb电路板及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL135706C (xx) * 1966-07-29 1900-01-01
DE1646064C3 (de) * 1966-12-29 1978-05-24 Politechnika Slaska Im. Wincentego Pstrowskiego, Gleiwitz (Polen) Verfahren zur Herstellung von mit Polyesterharzen beschichteten Metallfolien für elektro- und radiotechnische sowie elektronische Zwecke
DE1690025B2 (de) * 1967-08-09 1976-10-07 Schering Ag, 1000 Berlin Und 4619 Bergkamen Vorbehandlungsverfahren fuer duenne isolierfolien aus polyaethylenterephthalat
BE788117A (fr) * 1971-08-30 1973-02-28 Perstorp Ab Procede de production d'elements pour circuits imprimes
DE2413932C2 (de) * 1973-04-25 1984-08-30 Yates Industries, Inc., Bordentown, N.J. Verfahren zum Herstellen einer Verbundfolie für die Ausbildung gedruckter Schaltkreise
JPS5143571A (ja) * 1974-10-09 1976-04-14 Hiroki Katsuki Keesuisosochi

Also Published As

Publication number Publication date
JPS5731675B2 (xx) 1982-07-06
NL7714506A (nl) 1978-07-04
FR2376593B1 (xx) 1980-07-04
DE2659625C3 (de) 1981-07-02
SE7714867L (sv) 1978-07-01
GB1595245A (en) 1981-08-12
DE2659625B2 (de) 1979-01-11
JPS53111480A (en) 1978-09-29
DE2659625A1 (de) 1978-07-06
FR2376593A1 (fr) 1978-07-28
CH627405A5 (en) 1982-01-15
IT1091341B (it) 1985-07-06
ES466030A1 (es) 1978-10-01
BR7708768A (pt) 1978-09-05

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