CN1429139A - 印刷电路板的元件 - Google Patents
印刷电路板的元件 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/30—Iron, e.g. steel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/914—Transfer or decalcomania
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12639—Adjacent, identical composition, components
- Y10T428/12646—Group VIII or IB metal-base
- Y10T428/12653—Fe, containing 0.01-1.7% carbon [i.e., steel]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
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Abstract
一种在制造印刷电路板时使用的层压制品(50)的形成方法,包括下列步骤:将一层厚度为约30到160克每平方米的铬(18)施加到一厚度为约0.10到0.20毫米的钢基片(16)的每一侧面上;将一层厚度为约2到70微米的铜(42)施加到每个上述铬层(18)上;将上述钢基片(16)定位在两介电层(72)之间,上述铜层(42)与上述介电层(72)之间设有粘结剂(74);对上述层加热加压,从而将上述铜层(42)粘到上述介电层(72)上;将上述钢基片(16)从上述铜层(42)上分离;丢弃上述钢基片(16)。
Description
发明领域
本发明一般涉及印刷电路板,更特别地涉及一种方法,用于形成使用在印刷电路板和其它物件的制造过程中的元件。
背景技术
在制造印刷电路板的过程中,铜箔片通常粘结到一含部分熟化的环氧树脂的玻璃纤维织物介电层上(这种介电层通常称作“预浸片材”)。在制造敷铜箔层板的过程中,一般将铜箔片粘结到另一层箔上。在两个过程中,对铜箔进行蚀刻而产生导电线路。最近几年来的趋势是减小电子元件的尺寸,并增加设置在印刷电路板上的这种元件的数量。提供紧密分布的电路板的关键在于用铜生产出紧靠和精细的电路图形。这又驱使人们去提供其上铜层越来越薄的夹层。
铜箔的一个问题是在一定的厚度时(约每平方英尺0.5盎斯),铜箔变得非常难以处理。已经知道将铜贴到临时载体片如塑料或金属上用于随后传递到介电层或另一个铜层。将它们的铜沉积在这些载体层上将在制造过程中将铜粘附到介电基片上之前增加了另一个步骤。
发明内容
本发明提供了一种方法,用于形成在制造印刷电路板时使用的元件,这些元件上具有薄的铜层。
根据本发明的一优选实施例,有一种方法用于形成在制造印刷电路板时使用的层压制品。该方法包括下列步骤:
将一层厚度为约30克每平方米到约160克每平方米的铬层施加到一厚度为约0.10毫米到约0.20毫米的钢基片的每一侧面上;
将一层厚度为约2微米到约70微米的铜层施加到每个上述铬层上;
将上述钢基片定位在两介电层之间,上述铜层与上述介电层之间设有粘结剂;
对上述层加热加压,从而将上述铜层粘到上述介电层上;
将上述钢基片从上述铜层上分离;丢弃上述钢基片。
本发明的一个目的是提供一种具有用于制造如印刷电路板等类似物件时的铜层的元件。
本发明的另一个目的是提供一种上述的元件,其中金属基片是相对低价和可丢弃的物件。
本发明的另一个目的是提供一种上述的元件,其中该金属基片由碳钢制成,其上具有一用于与铜片结合的惰性金属外层。
本发明的另一个目的是提供一种上述的元件,其中该惰性金属是铬。
本发明的另一个目的是提供一种适于高温处理应用的上述元件。
本发明的又一个目的是提供一种上述的元件,其中该可丢弃金属基片的热膨胀系数大致等于用于形成层压印刷电路板的压板的热膨胀系数。
本发明的又一个目的是提供一种上述的元件,其中金属基片的尺寸适用用作电路板成型操作中的压板。
本发明的又一个目的是提供一种在制造如印刷电路板的过程中使用的上述元件的方法。
从下面结合附图对一优选实施例的描述中,这些和其它目的将变得清楚。
附图简介
本发明可能在某些部件或结构中采用实物形式,在说明书中详细描述且在构成其一部分的附图中示出了它的一个优选实施例,其中:
图1是一示意性视图,表示用于形成在制造印刷电路板或敷铜箔层板时使用的元件的过程;
图2是沿图1中线2-2所取的剖视图;
图3是沿图1中线3-3所取的剖视图;
图4是沿图1中线4-4所取的剖视图;
图5A是一剖视图,示出由根据本发明形成于两个涂有粘结剂的预浸层之间的元件的层压制品;
图5B是一剖视图,示出压缩在一起的图1中的层压制品;
图5C是一多层压制的剖视图;及
图5D是图5C中所示的层压制品的剖视图,示出在压制后分离的层压制品。
具体实施方式
现在参照附图,其中的图示只用于表示本发明的优选实施例,并不对本发明进行限制,图1是过程10的示意图,该过程10用于形成在制造印刷电路板或敷铜箔层板时所使用的元件50。从辊14输出一大致连续条的载体材料W。薄条W基本上由其两个表面具有铬层18的碳钢基片16构成。根据本发明,基片16具有约0.10毫米至约0.20毫米的厚度,最好是约0.14毫米至约0.18毫米;铬层18具有约30克每平方米到160克每平方米的厚度,更优选地是约50克每平方米到约140克每平方米的厚度。铬层18优选地通过真空金属化工艺或电镀工艺(未图示)施加到基片16上。基片16和铬层18的厚度很重要,因为它们涉及在下面详细描述的工艺。载体材料W(由钢基片16和铬层18构成)经过电镀过程,将铜沉积到铬层18的裸露表面上。所示实施例中,薄条W被输送通过容纳有电解溶液24的箱22。通过阴极导向辊26环绕箱22中的滚筒28导向到箱22中。薄条W从成对的并排电极32之间穿过,该并排电极32用于从电解溶液24将铜电镀到移动薄条W上。铜层42最好具有约2微米到约70微米的厚度。在一个实施例中,铜层42具有约3微米到约35微米的厚度。在另一实施例中,铜层42具有约5微米到约9微米的厚度。在又一个实施例中,铜层42具有约9微米的厚度。
图3是包含钢基片16、铬层18和铜层42的薄条W的剖视图。铜层42具有用42a表示的裸露外表面。如可从图4中最佳地看到的,铜层42的表面42a覆盖有一聚合剥离层52。剥离层52由进给辊54提供,并由夹紧辊56压到铜层42的表面42a上。图4中以剖视图表示生产的元件。薄条W输送到示意性示于图1中的切割装置62,该切割装置62用于将薄条W切断成以S表示的单个片材,这些片材堆叠和输送到一层压机,以便组装成印刷电路板或敷铜箔层压制品的一部分。
在层压过程中,当形成印刷电路板时将每个单个片材S放置在层压机(未图示)中预浸材料72之间(图5A-5D中最佳示出)(或者当形成敷铜箔层板时放置在铜层之间)。从薄条W上去除聚合剥离层52,从而暴露出铜层42的铜表面42a。将粘合剂74设置于薄条W的表面42a与预浸层72之间。向层压制品82加热加压(如图5B中示意性示出的),将铜层42粘结到预浸材料72上(或者在敷铜箔层板的情况下粘结到铜材料上)。根据本发明的一个方面,基片16的尺寸被限定为具有一特别的厚度,从而用作各层材料之间的压板。换句话说,基片16被制成具有足够的强度以有利于各元件的压制。由于基片16并不是如常规压板那样厚,就可在一特定压层内层压大量元件。在这方面,除了不需要单独的压板之外,元件50还通过允许形成大量层压制品元件而有利于提高层压过程的生产率。
在层压过程中加热加压后,铬层18在基片16与铜层42之间提供了分隔层。如图5D中最佳示出的,在打开压机后,粘结到预浸材料72上的铜层42将与铬层18分离,裸露出铜层42的内表面用于进一步加工成印刷电路。由于铜层42比常规铜箔薄得多,它们允许蚀刻出非常细、窄和非常紧密的电路线,从而提高了其上元件的密度。
根据本发明的另一方面,其上具有铬层18的碳钢基片16作为可丢弃元件而抛弃。
因此本发明提供了一种快速且相对廉价的方法,用于形成超薄铜层并用这种超薄铜层形成印刷电路板或敷铜箔层压制品。重要的是,将支承铜层42的载体基片,即钢基片16用作压板,从而不需要单独的压制元件。另外,由于其尺寸,基片16通过提供比以前公知的结构更薄的压板而在压制操作中实现更高的生产率。
以上说明是本发明的特定实施例。应当理解,该实施例的描述仅用于图示,在不脱离本发明的精神和范围的前提下,本领域技术人员可作多种替换和改进。在落入所要求的本发明或其等同物的范围内这一点来讲,这些改进和替换都应当包括在内。
Claims (8)
1.一种形成制造印刷电路板时所使用的层压制品的方法,包括下列步骤:
将一层厚度为约30克每平方米到约160克每平方米的铬施加到一厚度为约0.10毫米到约0.20毫米的钢基片的每一侧面上;
将一层厚度为约2微米到约70微米的铜施加到每个上述铬层上;
将上述钢基片定位在两介电层之间,上述铜层与上述介电层之间设有粘结剂;
对上述层加热加压,从而将上述铜层粘到上述介电层上;
将上述钢基片从上述铜层上分离;丢弃上述钢基片。
2.如权利要求1所述的形成层压制品的方法,其特征在于,通过电镀工艺施加上述铜。
3.如权利要求1所述的形成层压制品的方法,其特征在于,上述钢基片的厚度为约0.14毫米到约0.18毫米。
4.如权利要求3所述的形成层压制品的方法,其特征在于,上述铬层的厚度为约50克每平方米到约140克每平方米。
5.如权利要求4所述的形成层压制品的方法,其特征在于,上述铜层的厚度为约2微米到约70微米。
6.如权利要求4所述的形成层压制品的方法,其特征在于,上述铜层的厚度为约3微米到约35微米。
7.如权利要求4所述的形成层压制品的方法,其特征在于,上述铜层的厚度为约5微米到约9微米。
8.如权利要求4所述的形成层压制品的方法,其特征在于,上述铜层的厚度为约9微米。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US09/566,289 | 2000-05-05 | ||
US09/566,289 US6379487B1 (en) | 2000-05-05 | 2000-05-05 | Component of printed circuit board |
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CN1429139A true CN1429139A (zh) | 2003-07-09 |
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CN01808985A Pending CN1429139A (zh) | 2000-05-05 | 2001-04-06 | 印刷电路板的元件 |
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US (1) | US6379487B1 (zh) |
EP (1) | EP1289676A1 (zh) |
JP (1) | JP2003533038A (zh) |
KR (1) | KR100486618B1 (zh) |
CN (1) | CN1429139A (zh) |
AU (1) | AU2001251751A1 (zh) |
TW (1) | TWI229579B (zh) |
WO (1) | WO2001085362A1 (zh) |
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KR100913765B1 (ko) | 2007-09-21 | 2009-08-25 | 삼성전기주식회사 | 기판제조방법 |
JP5902931B2 (ja) * | 2011-12-06 | 2016-04-13 | 新光電気工業株式会社 | 配線基板の製造方法、及び、配線基板製造用の支持体 |
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US5246565A (en) | 1992-05-07 | 1993-09-21 | The United States Of America As Represented By The United States Department Of Energy | High adherence copper plating process |
SE9203327L (sv) * | 1992-11-06 | 1993-12-20 | Metfoils Ab | Förfarande vid mönsterkortstillverkning samt användning därvid |
US5552234A (en) | 1993-03-29 | 1996-09-03 | Japan Energy Corporation | Copper foil for printed circuits |
US5447619A (en) | 1993-11-24 | 1995-09-05 | Circuit Foil Usa, Inc. | Copper foil for the manufacture of printed circuit boards and method of producing the same |
US6129990A (en) * | 1998-04-10 | 2000-10-10 | R. E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
-
2000
- 2000-05-05 US US09/566,289 patent/US6379487B1/en not_active Expired - Fee Related
-
2001
- 2001-04-06 KR KR10-2002-7014845A patent/KR100486618B1/ko not_active IP Right Cessation
- 2001-04-06 EP EP01925164A patent/EP1289676A1/en not_active Withdrawn
- 2001-04-06 CN CN01808985A patent/CN1429139A/zh active Pending
- 2001-04-06 JP JP2001582008A patent/JP2003533038A/ja active Pending
- 2001-04-06 AU AU2001251751A patent/AU2001251751A1/en not_active Abandoned
- 2001-04-06 WO PCT/US2001/040460 patent/WO2001085362A1/en not_active Application Discontinuation
- 2001-04-11 TW TW090108685A patent/TWI229579B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI229579B (en) | 2005-03-11 |
US6379487B1 (en) | 2002-04-30 |
EP1289676A1 (en) | 2003-03-12 |
WO2001085362A1 (en) | 2001-11-15 |
AU2001251751A1 (en) | 2001-11-20 |
JP2003533038A (ja) | 2003-11-05 |
KR100486618B1 (ko) | 2005-05-03 |
KR20030007580A (ko) | 2003-01-23 |
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