CN1099334C - 印刷电路板的组件 - Google Patents
印刷电路板的组件 Download PDFInfo
- Publication number
- CN1099334C CN1099334C CN98812625A CN98812625A CN1099334C CN 1099334 C CN1099334 C CN 1099334C CN 98812625 A CN98812625 A CN 98812625A CN 98812625 A CN98812625 A CN 98812625A CN 1099334 C CN1099334 C CN 1099334C
- Authority
- CN
- China
- Prior art keywords
- copper foil
- carbon steel
- assembly
- steel coupon
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US1998/023545 WO2000025961A1 (en) | 1998-11-04 | 1998-11-04 | Component of printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1283144A CN1283144A (zh) | 2001-02-07 |
CN1099334C true CN1099334C (zh) | 2003-01-22 |
Family
ID=22268236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN98812625A Expired - Fee Related CN1099334C (zh) | 1998-11-04 | 1998-11-04 | 印刷电路板的组件 |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP1042092B1 (zh) |
JP (1) | JP3418709B2 (zh) |
KR (1) | KR100395266B1 (zh) |
CN (1) | CN1099334C (zh) |
CA (1) | CA2315177C (zh) |
DE (1) | DE69833783T2 (zh) |
MY (1) | MY114615A (zh) |
TW (1) | TW448107B (zh) |
WO (1) | WO2000025961A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020124938A1 (en) * | 2000-12-28 | 2002-09-12 | Henrich Peter J. | Apparatus and method for producing non- or lightly-embossed panels |
US6673471B2 (en) * | 2001-02-23 | 2004-01-06 | Nikko Materials Usa, Inc. | Corrosion prevention for CAC component |
DE10131887A1 (de) * | 2001-07-04 | 2003-01-23 | Dieter Backhaus | Trennblech bzw. Verfahren zur Herstellung eines Trennbleches für ein Multilayerpreßpaket |
CN114940006A (zh) * | 2022-05-07 | 2022-08-26 | 湖南柳鑫电子新材料有限公司 | 一种铜箔载体制作方法和铜箔载体 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5153030A (en) * | 1988-11-18 | 1992-10-06 | Cabot Corporation | Continuous treatment process for particulate material |
US5512381A (en) * | 1993-09-24 | 1996-04-30 | Alliedsignal Inc. | Copper foil laminate for protecting multilayer articles |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3595632A (en) * | 1968-09-23 | 1971-07-27 | Texas Instruments Inc | Corrosion-resistant composite sheet metal material |
GB8333753D0 (en) * | 1983-12-19 | 1984-01-25 | Thorpe J E | Dielectric boards |
DD242829A1 (de) * | 1985-11-21 | 1987-02-11 | Leipzig Galvanotechnik | Verfahren zur oberflaechenbehandlung von stahlzylindern zur metallfolienerzeugung |
JPS63134656A (ja) * | 1986-11-26 | 1988-06-07 | Nippon Steel Corp | 耐候性に優れたクロム被覆ステンレス鋼 |
JPH04304396A (ja) * | 1991-03-29 | 1992-10-27 | Nkk Corp | 耐食性に優れたクロム合金電気めっき鋼板の製造方法 |
US5153050A (en) * | 1991-08-27 | 1992-10-06 | Johnston James A | Component of printed circuit boards |
-
1998
- 1998-11-04 WO PCT/US1998/023545 patent/WO2000025961A1/en active IP Right Grant
- 1998-11-04 JP JP2000579387A patent/JP3418709B2/ja not_active Expired - Fee Related
- 1998-11-04 CA CA002315177A patent/CA2315177C/en not_active Expired - Fee Related
- 1998-11-04 CN CN98812625A patent/CN1099334C/zh not_active Expired - Fee Related
- 1998-11-04 EP EP98956596A patent/EP1042092B1/en not_active Expired - Lifetime
- 1998-11-04 DE DE69833783T patent/DE69833783T2/de not_active Expired - Lifetime
- 1998-11-04 KR KR10-2000-7007417A patent/KR100395266B1/ko not_active IP Right Cessation
-
1999
- 1999-01-11 MY MYPI99000083A patent/MY114615A/en unknown
- 1999-02-02 TW TW088101533A patent/TW448107B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5153030A (en) * | 1988-11-18 | 1992-10-06 | Cabot Corporation | Continuous treatment process for particulate material |
US5512381A (en) * | 1993-09-24 | 1996-04-30 | Alliedsignal Inc. | Copper foil laminate for protecting multilayer articles |
Also Published As
Publication number | Publication date |
---|---|
DE69833783T2 (de) | 2007-01-18 |
EP1042092A1 (en) | 2000-10-11 |
CN1283144A (zh) | 2001-02-07 |
EP1042092B1 (en) | 2006-03-08 |
KR20010033857A (ko) | 2001-04-25 |
CA2315177A1 (en) | 2000-05-11 |
KR100395266B1 (ko) | 2003-08-21 |
JP2002528925A (ja) | 2002-09-03 |
EP1042092A4 (en) | 2002-01-02 |
WO2000025961A1 (en) | 2000-05-11 |
MY114615A (en) | 2002-11-30 |
TW448107B (en) | 2001-08-01 |
DE69833783D1 (de) | 2006-05-04 |
JP3418709B2 (ja) | 2003-06-23 |
CA2315177C (en) | 2004-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: GA-TEK INC. (DBA GOULD ELECTRONICS INC.) Free format text: FORMER NAME OR ADDRESS: GA-TEK CO. |
|
CP01 | Change in the name or title of a patent holder |
Patentee after: Ga-Tek Inc. (Dba Gould Electronics Inc.) Patentee before: GA-TEK Corporation (in business activities) is known as Gothic Electronics |
|
ASS | Succession or assignment of patent right |
Owner name: NICO STUFF AMERICA CO.,LTD. Free format text: FORMER OWNER: GA-TEK INC. (DBA GOULD ELECTRONICS INC.) Effective date: 20040304 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20040304 Address after: Arizona, USA Patentee after: Nikko Materials USA Inc. Address before: ohio Patentee before: Ga-Tek Inc. (Dba Gould Electronics Inc.) |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20030122 Termination date: 20131104 |