GB1527199A - Multilayer printed circuits - Google Patents

Multilayer printed circuits

Info

Publication number
GB1527199A
GB1527199A GB19185/77A GB1918577A GB1527199A GB 1527199 A GB1527199 A GB 1527199A GB 19185/77 A GB19185/77 A GB 19185/77A GB 1918577 A GB1918577 A GB 1918577A GB 1527199 A GB1527199 A GB 1527199A
Authority
GB
United Kingdom
Prior art keywords
layers
conductive
conductive layer
thinner
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB19185/77A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CII HONEYWELL BULL
Original Assignee
CII HONEYWELL BULL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CII HONEYWELL BULL filed Critical CII HONEYWELL BULL
Publication of GB1527199A publication Critical patent/GB1527199A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12542—More than one such component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12597—Noncrystalline silica or noncrystalline plural-oxide component [e.g., glass, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Laminated Bodies (AREA)
  • Thin Magnetic Films (AREA)
GB19185/77A 1976-05-06 1977-05-06 Multilayer printed circuits Expired GB1527199A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7613553A FR2350697A1 (fr) 1976-05-06 1976-05-06 Structure perfectionnee de circuits multicouches

Publications (1)

Publication Number Publication Date
GB1527199A true GB1527199A (en) 1978-10-04

Family

ID=9172768

Family Applications (1)

Application Number Title Priority Date Filing Date
GB19185/77A Expired GB1527199A (en) 1976-05-06 1977-05-06 Multilayer printed circuits

Country Status (7)

Country Link
US (3) US4189524A (enExample)
JP (1) JPS52139958A (enExample)
DE (1) DE2719731A1 (enExample)
FR (1) FR2350697A1 (enExample)
GB (1) GB1527199A (enExample)
IT (1) IT1206367B (enExample)
NL (1) NL7704945A (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4336088A (en) * 1980-06-30 1982-06-22 International Business Machines Corp. Method of fabricating an improved multi-layer ceramic substrate
US4302625A (en) * 1980-06-30 1981-11-24 International Business Machines Corp. Multi-layer ceramic substrate
JPS5826308A (ja) * 1981-08-07 1983-02-16 Matsushita Electric Ind Co Ltd 薄膜素子部品
US4479367A (en) * 1981-12-28 1984-10-30 Santa Barbara Research Center Thermal filter
NL8302150A (nl) * 1982-06-16 1984-01-16 Nitto Electric Ind Co Uitgangsplaat voor een gedrukte schakeling met een weerstandslaag en werkwijze voor de vervaardiging daarvan.
GB8304890D0 (en) * 1983-02-22 1983-03-23 Smiths Industries Plc Chip-carrier substrates
JPS59232693A (ja) * 1983-06-17 1984-12-27 Ngk Spark Plug Co Ltd セラミツクと金属等との接合用クラツドろう材及びこれを用いたセラミツクと金属等との複合体
US4600658A (en) * 1983-11-07 1986-07-15 Motorola, Inc. Metallization means and method for high temperature applications
US4987100A (en) * 1988-05-26 1991-01-22 International Business Machines Corporation Flexible carrier for an electronic device
US4937707A (en) * 1988-05-26 1990-06-26 International Business Machines Corporation Flexible carrier for an electronic device
JP2840271B2 (ja) * 1989-01-27 1998-12-24 キヤノン株式会社 記録ヘッド
US5175399A (en) * 1989-08-29 1992-12-29 Mitsubishi Denki Kabushiki Kaisha Wiring panel including wiring having a surface-reforming layer and method for producing the same
JPH03230552A (ja) * 1990-02-05 1991-10-14 Matsushita Electric Ind Co Ltd 半導体素子実装用接合材
JP2630293B2 (ja) * 1995-02-28 1997-07-16 日本電気株式会社 多層配線基板
US6331680B1 (en) 1996-08-07 2001-12-18 Visteon Global Technologies, Inc. Multilayer electrical interconnection device and method of making same
US5888631A (en) * 1996-11-08 1999-03-30 W. L. Gore & Associates, Inc. Method for minimizing warp in the production of electronic assemblies
US6085413A (en) * 1998-02-02 2000-07-11 Ford Motor Company Multilayer electrical interconnection device and method of making same
US6380627B1 (en) * 1998-06-26 2002-04-30 The Regents Of The University Of California Low resistance barrier layer for isolating, adhering, and passivating copper metal in semiconductor fabrication
US6110576A (en) * 1998-10-16 2000-08-29 Lucent Technologies Inc. Article comprising molded circuit
WO2000079849A1 (en) * 1999-06-18 2000-12-28 Isola Laminate Systems Corp. High performance ball grid array substrates
US7342373B2 (en) * 2006-01-04 2008-03-11 Nartron Corporation Vehicle panel control system
US20100194313A1 (en) * 2007-10-01 2010-08-05 Koninklijke Philips Electronics N.V. High voltage electrical connection line

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3079282A (en) * 1960-05-24 1963-02-26 Martin N Halier Printed circuit on a ceramic base and method of making same
US3189420A (en) * 1962-10-01 1965-06-15 Paul R Gould Electrically conductive element
GB1053162A (enExample) * 1963-01-21
US3357856A (en) * 1964-02-13 1967-12-12 Electra Mfg Company Method for metallizing openings in miniature printed circuit wafers
US3499218A (en) * 1966-10-31 1970-03-10 Electro Mechanisms Inc Multilayer circuit boards and methods of making the same
US3461357A (en) * 1967-09-15 1969-08-12 Ibm Multilevel terminal metallurgy for semiconductor devices
GB1218211A (en) * 1968-01-13 1971-01-06 Bosch Gmbh Robert Improvements in or relating to the production of a plurality of coatings on an insulating carrier
USRE29326E (en) 1969-10-28 1977-07-26 Commissariat A L'energie Atomique Integrated magnetic head having alternate conducting and insulating layers within an open loop of two magnetic films
BE758053A (fr) * 1969-10-28 1971-04-01 Commissariat Energie Atomique Tete magnetique integree et procede de fabrication de ladite tete
FR2119734A5 (en) * 1970-12-25 1972-08-04 Hitachi Ltd Printed circuits - prodn by electrolytic engraving
US3751292A (en) * 1971-08-20 1973-08-07 Motorola Inc Multilayer metallization system
US3808049A (en) * 1972-06-02 1974-04-30 Microsystems Int Ltd Multi-layer thin-film circuits
US3983284A (en) * 1972-06-02 1976-09-28 Thomson-Csf Flat connection for a semiconductor multilayer structure
FR2191186B1 (enExample) * 1972-07-03 1976-01-16 Inf Ci Interna Fr
US3844831A (en) * 1972-10-27 1974-10-29 Ibm Forming a compact multilevel interconnection metallurgy system for semi-conductor devices
US4045594A (en) * 1975-12-31 1977-08-30 Ibm Corporation Planar insulation of conductive patterns by chemical vapor deposition and sputtering
US4035276A (en) * 1976-04-29 1977-07-12 Ibm Corporation Making coplanar layers of thin films
US4107726A (en) * 1977-01-03 1978-08-15 Raytheon Company Multilayer interconnected structure for semiconductor integrated circuit

Also Published As

Publication number Publication date
NL7704945A (nl) 1977-11-08
DE2719731A1 (de) 1977-11-17
IT1206367B (it) 1989-04-21
FR2350697A1 (fr) 1977-12-02
US4311727A (en) 1982-01-19
JPS52139958A (en) 1977-11-22
US4189524A (en) 1980-02-19
FR2350697B1 (enExample) 1980-06-13
US4350743A (en) 1982-09-21
JPS617740B2 (enExample) 1986-03-08

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee