JPS52139958A - Multilayer circuit - Google Patents
Multilayer circuitInfo
- Publication number
- JPS52139958A JPS52139958A JP5166577A JP5166577A JPS52139958A JP S52139958 A JPS52139958 A JP S52139958A JP 5166577 A JP5166577 A JP 5166577A JP 5166577 A JP5166577 A JP 5166577A JP S52139958 A JPS52139958 A JP S52139958A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer circuit
- multilayer
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
- H01L27/016—Thin-film circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12542—More than one such component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12597—Noncrystalline silica or noncrystalline plural-oxide component [e.g., glass, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Laminated Bodies (AREA)
- Thin Magnetic Films (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7613553A FR2350697A1 (fr) | 1976-05-06 | 1976-05-06 | Structure perfectionnee de circuits multicouches |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52139958A true JPS52139958A (en) | 1977-11-22 |
JPS617740B2 JPS617740B2 (ja) | 1986-03-08 |
Family
ID=9172768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5166577A Granted JPS52139958A (en) | 1976-05-06 | 1977-05-04 | Multilayer circuit |
Country Status (7)
Country | Link |
---|---|
US (3) | US4189524A (ja) |
JP (1) | JPS52139958A (ja) |
DE (1) | DE2719731A1 (ja) |
FR (1) | FR2350697A1 (ja) |
GB (1) | GB1527199A (ja) |
IT (1) | IT1206367B (ja) |
NL (1) | NL7704945A (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4336088A (en) * | 1980-06-30 | 1982-06-22 | International Business Machines Corp. | Method of fabricating an improved multi-layer ceramic substrate |
US4302625A (en) * | 1980-06-30 | 1981-11-24 | International Business Machines Corp. | Multi-layer ceramic substrate |
JPS5826308A (ja) * | 1981-08-07 | 1983-02-16 | Matsushita Electric Ind Co Ltd | 薄膜素子部品 |
US4479367A (en) * | 1981-12-28 | 1984-10-30 | Santa Barbara Research Center | Thermal filter |
DE3321900C2 (de) * | 1982-06-16 | 1986-01-16 | Nitto Electric Industrial Co., Ltd., Ibaraki, Osaka | Substrat für eine Schaltung mit einer Widerstandsschicht und Verfahren zu dessen Herstellung |
GB8304890D0 (en) * | 1983-02-22 | 1983-03-23 | Smiths Industries Plc | Chip-carrier substrates |
JPS59232693A (ja) * | 1983-06-17 | 1984-12-27 | Ngk Spark Plug Co Ltd | セラミツクと金属等との接合用クラツドろう材及びこれを用いたセラミツクと金属等との複合体 |
US4600658A (en) * | 1983-11-07 | 1986-07-15 | Motorola, Inc. | Metallization means and method for high temperature applications |
US4937707A (en) * | 1988-05-26 | 1990-06-26 | International Business Machines Corporation | Flexible carrier for an electronic device |
US4987100A (en) * | 1988-05-26 | 1991-01-22 | International Business Machines Corporation | Flexible carrier for an electronic device |
JP2840271B2 (ja) * | 1989-01-27 | 1998-12-24 | キヤノン株式会社 | 記録ヘッド |
US5175399A (en) * | 1989-08-29 | 1992-12-29 | Mitsubishi Denki Kabushiki Kaisha | Wiring panel including wiring having a surface-reforming layer and method for producing the same |
JPH03230552A (ja) * | 1990-02-05 | 1991-10-14 | Matsushita Electric Ind Co Ltd | 半導体素子実装用接合材 |
JP2630293B2 (ja) * | 1995-02-28 | 1997-07-16 | 日本電気株式会社 | 多層配線基板 |
US6331680B1 (en) | 1996-08-07 | 2001-12-18 | Visteon Global Technologies, Inc. | Multilayer electrical interconnection device and method of making same |
US5888631A (en) * | 1996-11-08 | 1999-03-30 | W. L. Gore & Associates, Inc. | Method for minimizing warp in the production of electronic assemblies |
US6085413A (en) * | 1998-02-02 | 2000-07-11 | Ford Motor Company | Multilayer electrical interconnection device and method of making same |
US6380627B1 (en) * | 1998-06-26 | 2002-04-30 | The Regents Of The University Of California | Low resistance barrier layer for isolating, adhering, and passivating copper metal in semiconductor fabrication |
US6110576A (en) * | 1998-10-16 | 2000-08-29 | Lucent Technologies Inc. | Article comprising molded circuit |
WO2000079849A1 (en) * | 1999-06-18 | 2000-12-28 | Isola Laminate Systems Corp. | High performance ball grid array substrates |
US7342373B2 (en) * | 2006-01-04 | 2008-03-11 | Nartron Corporation | Vehicle panel control system |
EP2198676A1 (en) * | 2007-10-01 | 2010-06-23 | Philips Intellectual Property & Standards GmbH | High voltage electrical connection line |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3079282A (en) * | 1960-05-24 | 1963-02-26 | Martin N Halier | Printed circuit on a ceramic base and method of making same |
US3189420A (en) * | 1962-10-01 | 1965-06-15 | Paul R Gould | Electrically conductive element |
GB1053162A (ja) * | 1963-01-21 | |||
US3357856A (en) * | 1964-02-13 | 1967-12-12 | Electra Mfg Company | Method for metallizing openings in miniature printed circuit wafers |
US3499218A (en) * | 1966-10-31 | 1970-03-10 | Electro Mechanisms Inc | Multilayer circuit boards and methods of making the same |
US3461357A (en) * | 1967-09-15 | 1969-08-12 | Ibm | Multilevel terminal metallurgy for semiconductor devices |
GB1218211A (en) * | 1968-01-13 | 1971-01-06 | Bosch Gmbh Robert | Improvements in or relating to the production of a plurality of coatings on an insulating carrier |
BE758053A (fr) * | 1969-10-28 | 1971-04-01 | Commissariat Energie Atomique | Tete magnetique integree et procede de fabrication de ladite tete |
DE2164490B2 (de) * | 1970-12-25 | 1974-03-07 | Hitachi Ltd., Tokio | Verfahren zur Herstellung eines Leitermusters einer elektronischen Schaltung durch Ätzen |
US3751292A (en) * | 1971-08-20 | 1973-08-07 | Motorola Inc | Multilayer metallization system |
US3983284A (en) * | 1972-06-02 | 1976-09-28 | Thomson-Csf | Flat connection for a semiconductor multilayer structure |
US3808049A (en) * | 1972-06-02 | 1974-04-30 | Microsystems Int Ltd | Multi-layer thin-film circuits |
FR2191186B1 (ja) * | 1972-07-03 | 1976-01-16 | Inf Ci Interna Fr | |
US3844831A (en) * | 1972-10-27 | 1974-10-29 | Ibm | Forming a compact multilevel interconnection metallurgy system for semi-conductor devices |
US4045594A (en) * | 1975-12-31 | 1977-08-30 | Ibm Corporation | Planar insulation of conductive patterns by chemical vapor deposition and sputtering |
US4035276A (en) * | 1976-04-29 | 1977-07-12 | Ibm Corporation | Making coplanar layers of thin films |
US4107726A (en) * | 1977-01-03 | 1978-08-15 | Raytheon Company | Multilayer interconnected structure for semiconductor integrated circuit |
-
1976
- 1976-05-06 FR FR7613553A patent/FR2350697A1/fr active Granted
-
1977
- 1977-04-29 US US05/792,210 patent/US4189524A/en not_active Expired - Lifetime
- 1977-05-03 DE DE19772719731 patent/DE2719731A1/de not_active Ceased
- 1977-05-04 JP JP5166577A patent/JPS52139958A/ja active Granted
- 1977-05-05 NL NL7704945A patent/NL7704945A/xx not_active Application Discontinuation
- 1977-05-05 IT IT7723191A patent/IT1206367B/it active
- 1977-05-06 GB GB19185/77A patent/GB1527199A/en not_active Expired
-
1979
- 1979-02-15 US US06/012,450 patent/US4311727A/en not_active Expired - Lifetime
-
1980
- 1980-12-01 US US06/211,678 patent/US4350743A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
NL7704945A (nl) | 1977-11-08 |
US4350743A (en) | 1982-09-21 |
US4189524A (en) | 1980-02-19 |
IT1206367B (it) | 1989-04-21 |
FR2350697A1 (fr) | 1977-12-02 |
JPS617740B2 (ja) | 1986-03-08 |
US4311727A (en) | 1982-01-19 |
DE2719731A1 (de) | 1977-11-17 |
FR2350697B1 (ja) | 1980-06-13 |
GB1527199A (en) | 1978-10-04 |
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