GB2057195B - Multilayer circuit structure - Google Patents

Multilayer circuit structure

Info

Publication number
GB2057195B
GB2057195B GB8026232A GB8026232A GB2057195B GB 2057195 B GB2057195 B GB 2057195B GB 8026232 A GB8026232 A GB 8026232A GB 8026232 A GB8026232 A GB 8026232A GB 2057195 B GB2057195 B GB 2057195B
Authority
GB
United Kingdom
Prior art keywords
circuit structure
multilayer circuit
multilayer
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8026232A
Other versions
GB2057195A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Publication of GB2057195A publication Critical patent/GB2057195A/en
Application granted granted Critical
Publication of GB2057195B publication Critical patent/GB2057195B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
GB8026232A 1979-08-18 1980-08-12 Multilayer circuit structure Expired GB2057195B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7928829 1979-08-18

Publications (2)

Publication Number Publication Date
GB2057195A GB2057195A (en) 1981-03-25
GB2057195B true GB2057195B (en) 1983-03-30

Family

ID=10507298

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8026232A Expired GB2057195B (en) 1979-08-18 1980-08-12 Multilayer circuit structure

Country Status (4)

Country Link
AU (1) AU533901B2 (en)
FR (1) FR2464010A1 (en)
GB (1) GB2057195B (en)
ZA (1) ZA804558B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HU191139B (en) * 1984-05-23 1987-01-28 Mta Koezponti Fizikai Kutato Intezete,Hu Method and arrangement for increasinf reliability of metallization of holes at manufacturing printed circuits
JPH023631Y2 (en) * 1984-12-28 1990-01-29
EP0349756A3 (en) * 1988-05-30 1991-03-20 Canon Kabushiki Kaisha Method of making electric circuit device
FR2669500B1 (en) * 1990-11-16 1996-06-14 Commissariat Energie Atomique HYBRID CIRCUIT FORMED BY TWO CIRCUITS WHOSE TRACKS ARE CONNECTED BY ELECTRICAL CONNECTION BALLS
US6731189B2 (en) * 2002-06-27 2004-05-04 Raytheon Company Multilayer stripline radio frequency circuits and interconnection methods
DE102009028744A1 (en) * 2009-08-20 2011-03-31 Semikron Elektronik Gmbh & Co. Kg Method for producing an electrical connection between printed circuit boards
WO2014025298A1 (en) 2012-08-10 2014-02-13 Telefonaktiebolaget L M Ericsson (Publ) A printed circuit board arrangement and a method for forming electrical connection at a printed circuit board
US10999938B1 (en) * 2020-04-29 2021-05-04 Raytheon Company Method of wire bonding a first and second circuit card

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3541222A (en) * 1969-01-13 1970-11-17 Bunker Ramo Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making
DE1919567A1 (en) * 1969-04-17 1970-11-05 Siemens Ag Detachable electrical connections between micro-assemblies and / or wiring boards
US3616532A (en) * 1970-02-02 1971-11-02 Sperry Rand Corp Multilayer printed circuit electrical interconnection device
FR2080693B3 (en) * 1970-02-23 1973-05-11 Keramische K Veb

Also Published As

Publication number Publication date
AU6148280A (en) 1981-02-26
GB2057195A (en) 1981-03-25
ZA804558B (en) 1981-09-30
AU533901B2 (en) 1983-12-15
FR2464010B1 (en) 1984-12-28
FR2464010A1 (en) 1981-02-27

Similar Documents

Publication Publication Date Title
JPS55133597A (en) Multilayer circuit board
JPS5633648A (en) Renetting circuit
JPS52139958A (en) Multilayer circuit
GB2050067B (en) Circuit boards
JPS5634187A (en) Mosstransistor circuit
JPS5368870A (en) Multilayer board
GB8320970D0 (en) Circuit arrangement
JPS53114072A (en) Multilayer circuit
GB2057195B (en) Multilayer circuit structure
JPS55135391A (en) Iil circuit
JPS55117266A (en) Integrated circuit structure
JPS5658294A (en) Multilayer circuit board
JPS55166990A (en) Circuit board
JPS55150290A (en) Circuit board
JPS5638254A (en) Multilayer structure
JPS5598897A (en) Multilayer circuit board
JPS5679425A (en) Multilayer electric circuit board
JPS55127094A (en) Circuit board
JPS5667255A (en) Multilayer structure
JPS5674611A (en) Quotienttevaluation circuit
JPS55108797A (en) Circuit board
JPS55105399A (en) Multilayer wired circuit board
JPS5599797A (en) Multilayer circuit structure
JPS566421A (en) Electronic circuit
JPS5649599A (en) Circuit board structure

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee