AU6148280A - Multilayer circuit structures - Google Patents

Multilayer circuit structures

Info

Publication number
AU6148280A
AU6148280A AU61482/80A AU6148280A AU6148280A AU 6148280 A AU6148280 A AU 6148280A AU 61482/80 A AU61482/80 A AU 61482/80A AU 6148280 A AU6148280 A AU 6148280A AU 6148280 A AU6148280 A AU 6148280A
Authority
AU
Australia
Prior art keywords
multilayer circuit
circuit structures
structures
multilayer
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU61482/80A
Other versions
AU533901B2 (en
Inventor
Dennis Davies
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Publication of AU6148280A publication Critical patent/AU6148280A/en
Application granted granted Critical
Publication of AU533901B2 publication Critical patent/AU533901B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
AU61482/80A 1979-08-18 1980-08-15 Multilayer circuit structures Ceased AU533901B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB7928829 1979-08-18
GB7928829 1979-08-18

Publications (2)

Publication Number Publication Date
AU6148280A true AU6148280A (en) 1981-02-26
AU533901B2 AU533901B2 (en) 1983-12-15

Family

ID=10507298

Family Applications (1)

Application Number Title Priority Date Filing Date
AU61482/80A Ceased AU533901B2 (en) 1979-08-18 1980-08-15 Multilayer circuit structures

Country Status (4)

Country Link
AU (1) AU533901B2 (en)
FR (1) FR2464010A1 (en)
GB (1) GB2057195B (en)
ZA (1) ZA804558B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU569186B2 (en) * 1984-12-28 1988-01-21 Fujitsu Limited High density multilayer printed circuit board

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HU191139B (en) * 1984-05-23 1987-01-28 Mta Koezponti Fizikai Kutato Intezete,Hu Method and arrangement for increasinf reliability of metallization of holes at manufacturing printed circuits
US5058800A (en) * 1988-05-30 1991-10-22 Canon Kabushiki Kaisha Method of making electric circuit device
FR2669500B1 (en) * 1990-11-16 1996-06-14 Commissariat Energie Atomique HYBRID CIRCUIT FORMED BY TWO CIRCUITS WHOSE TRACKS ARE CONNECTED BY ELECTRICAL CONNECTION BALLS
US6731189B2 (en) * 2002-06-27 2004-05-04 Raytheon Company Multilayer stripline radio frequency circuits and interconnection methods
DE102009028744A1 (en) * 2009-08-20 2011-03-31 Semikron Elektronik Gmbh & Co. Kg Method for producing an electrical connection between printed circuit boards
WO2014025298A1 (en) 2012-08-10 2014-02-13 Telefonaktiebolaget L M Ericsson (Publ) A printed circuit board arrangement and a method for forming electrical connection at a printed circuit board
US10999938B1 (en) * 2020-04-29 2021-05-04 Raytheon Company Method of wire bonding a first and second circuit card

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3541222A (en) * 1969-01-13 1970-11-17 Bunker Ramo Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making
DE1919567A1 (en) * 1969-04-17 1970-11-05 Siemens Ag Detachable electrical connections between micro-assemblies and / or wiring boards
US3616532A (en) * 1970-02-02 1971-11-02 Sperry Rand Corp Multilayer printed circuit electrical interconnection device
FR2080693B3 (en) * 1970-02-23 1973-05-11 Keramische K Veb

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU569186B2 (en) * 1984-12-28 1988-01-21 Fujitsu Limited High density multilayer printed circuit board

Also Published As

Publication number Publication date
ZA804558B (en) 1981-09-30
FR2464010A1 (en) 1981-02-27
FR2464010B1 (en) 1984-12-28
GB2057195A (en) 1981-03-25
AU533901B2 (en) 1983-12-15
GB2057195B (en) 1983-03-30

Similar Documents

Publication Publication Date Title
AU533452B2 (en) Building board
AU537522B2 (en) Absorbent boards
JPS55133597A (en) Multilayer circuit board
AU527612B2 (en) Spray-arc welding circuit
AU534278B2 (en) Line circuit
AU5496980A (en) Glass-polycarbonate laminate
AU529255B2 (en) Linearization circuit
AU6343780A (en) Multilayer shielding structure
AU5620780A (en) Laminated structures
AU530393B2 (en) Hybrid circuit
AU533901B2 (en) Multilayer circuit structures
AU538948B2 (en) Circuit
JPS53114072A (en) Multilayer circuit
AU533095B2 (en) Line circuit
AU537447B2 (en) Circuit arrangement
JPS5658294A (en) Multilayer circuit board
AU5440480A (en) Reducing circuit
JPS5638254A (en) Multilayer structure
JPS5598897A (en) Multilayer circuit board
AU535784B2 (en) Inverter circuit
JPS5667255A (en) Multilayer structure
JPS55121056A (en) Multilayer laminate
AU539754B2 (en) Circuit arrangements
JPS5599797A (en) Multilayer circuit structure
AU531886B2 (en) Building board