GB1517302A - Vacuum laminating process - Google Patents
Vacuum laminating processInfo
- Publication number
- GB1517302A GB1517302A GB4085375A GB4085375A GB1517302A GB 1517302 A GB1517302 A GB 1517302A GB 4085375 A GB4085375 A GB 4085375A GB 4085375 A GB4085375 A GB 4085375A GB 1517302 A GB1517302 A GB 1517302A
- Authority
- GB
- United Kingdom
- Prior art keywords
- areas
- layer
- photo
- resist
- raised areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
- B32B37/223—One or more of the layers being plastic
- B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Laminated Bodies (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51311274A | 1974-10-08 | 1974-10-08 | |
US56890475A | 1975-04-17 | 1975-04-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1517302A true GB1517302A (en) | 1978-07-12 |
Family
ID=27057750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4085375A Expired GB1517302A (en) | 1974-10-08 | 1975-10-06 | Vacuum laminating process |
Country Status (5)
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0028366A1 (en) * | 1979-11-02 | 1981-05-13 | E.I. Du Pont De Nemours And Company | Process for heating thin surface layers |
WO2011019886A1 (en) * | 2009-08-13 | 2011-02-17 | Dow Global Technologies, Inc. | A multi-layer laminate structure and manufacturing method |
US9123847B2 (en) | 2010-12-17 | 2015-09-01 | Dow Global Technologies Llc | Photovoltaic device |
CN113473709A (zh) * | 2020-03-31 | 2021-10-01 | 竞华电子(深圳)有限公司 | 印制电路板加工方法及印制电路板 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4069076A (en) * | 1976-11-29 | 1978-01-17 | E. I. Du Pont De Nemours And Company | Liquid lamination process |
JPS5489274A (en) * | 1977-12-27 | 1979-07-16 | Fujitsu Ltd | Method of making printed board |
DE3342678C2 (de) * | 1983-11-25 | 1995-08-31 | Held Kurt | Verfahren und Vorrichtung zur kontinuierlichen Herstellung metallkaschierter Laminate |
JPS6252552A (ja) * | 1985-08-30 | 1987-03-07 | Hitachi Chem Co Ltd | 減圧貼り合わせ方法及び装置 |
JPS63259559A (ja) * | 1987-04-16 | 1988-10-26 | Hitachi Condenser Co Ltd | 印刷配線板のパタ−ン形成方法 |
DE3737945A1 (de) * | 1987-11-07 | 1989-05-24 | Anger Wolfgang | Vakuum-laminator |
NO890091L (no) * | 1988-01-11 | 1989-07-12 | Thiokol Morton Inc | Fremgangsmaate og anordning for aa paafoere polymere materialer paa trykte kretser. |
US4834821A (en) * | 1988-01-11 | 1989-05-30 | Morton Thiokol, Inc. | Process for preparing polymeric materials for application to printed circuits |
US4992354A (en) * | 1988-02-26 | 1991-02-12 | Morton International, Inc. | Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like |
US5078820A (en) * | 1988-03-25 | 1992-01-07 | Somar Corporation | Method and apparatus for pressure sticking a thin film to a base plate |
US4927733A (en) * | 1988-12-23 | 1990-05-22 | E. I. Du Pont De Nemours And Company | Conformation of vacuum - laminated solder mask coated printed circuit boards by fluid pressurizing |
DE4018177A1 (de) * | 1990-06-07 | 1991-12-12 | Anger Electronic Gmbh | Verfahren zum laminieren von platten und vorrichtung zur durchfuerhrung des verfahrens |
DE4026802A1 (de) * | 1990-08-24 | 1992-02-27 | Anger Electronic Gmbh | Vorrichtung zum kaschieren einer leiterplatte |
DE4222262A1 (de) * | 1991-09-03 | 1993-03-04 | Anger Electronic Gmbh | Vorrichtung zum laminieren von kunststoffprodukten, insbesondere leiterplatten, pvc-folien, polycarbonatfolien und dergleichen |
DE9111708U1 (de) * | 1991-09-19 | 1992-04-16 | Anger Electronic Ges.m.b.H. Emco InnovationsCenter, Hallein | Vorrichtung zum Kaschieren (Laminieren) von bedruckten und unbedruckten Folien |
IT1274181B (it) * | 1994-05-18 | 1997-07-15 | Amedeo Candore | Laminazione di pellicole fotosensibili per formare una maschera di saldatura su schede di circuito stampato |
DE19609590A1 (de) * | 1996-03-12 | 1997-09-18 | Kontron Elektronik | Verfahren und Vorrichtung zur Beschichtung von Substraten, vorzugsweise Leiterplatten |
MY120763A (en) | 1997-09-19 | 2005-11-30 | Hitachi Chemical Co Ltd | Photosensitive film, process for laminating photosensitive resin layer, photosensitive resin layer-laminated substrate and process for curing photosensitive resin layer |
EP1117006A1 (en) * | 2000-01-14 | 2001-07-18 | Shipley Company LLC | Photoresist having increased photospeed |
JP3849641B2 (ja) | 2001-03-29 | 2006-11-22 | 日立化成工業株式会社 | 回路形成用感光性フィルム及びプリント配線板の製造法 |
US8801887B2 (en) † | 2005-12-23 | 2014-08-12 | The Boeing Company | Textured structure and method of making the textured structure |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1293655B (US06521211-20030218-C00004.png) * | 1969-04-24 | |||
US3042574A (en) * | 1957-09-25 | 1962-07-03 | Du Pont | Method of making laminated structures |
NL302012A (US06521211-20030218-C00004.png) * | 1963-08-14 | |||
CA757597A (en) * | 1963-12-30 | 1967-04-25 | L. Mees John | Method for making printed circuits |
JPS4518324Y1 (US06521211-20030218-C00004.png) * | 1966-12-19 | 1970-07-27 | ||
JPS449363Y1 (US06521211-20030218-C00004.png) * | 1968-08-05 | 1969-04-16 | ||
US3469982A (en) * | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
DE1953883A1 (de) * | 1969-10-25 | 1971-05-06 | Dornbusch & Co | Verfahren zum flaechigen Verschweissen von aufgeheizten Warenbahnen,insbesondere von thermoplastischen Kunststoff-Folien,sowie Vorrichtung zur Durchfuehrung des Verfahrens |
FR2123089B1 (US06521211-20030218-C00004.png) * | 1970-12-11 | 1974-08-23 | Saint Gobain | |
JPS48100201A (US06521211-20030218-C00004.png) * | 1972-04-04 | 1973-12-18 | ||
JPS5129443B2 (US06521211-20030218-C00004.png) * | 1972-07-20 | 1976-08-25 | ||
JPS5434909B2 (US06521211-20030218-C00004.png) * | 1973-02-08 | 1979-10-30 | ||
JPS49103167A (US06521211-20030218-C00004.png) * | 1973-02-08 | 1974-09-30 |
-
1975
- 1975-10-04 DE DE19752544553 patent/DE2544553C2/de not_active Expired
- 1975-10-06 NL NL7511714A patent/NL7511714A/xx not_active Application Discontinuation
- 1975-10-06 GB GB4085375A patent/GB1517302A/en not_active Expired
- 1975-10-07 FR FR7530652A patent/FR2287714A1/fr active Granted
- 1975-10-08 JP JP12174775A patent/JPS5513341B2/ja not_active Expired
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0028366A1 (en) * | 1979-11-02 | 1981-05-13 | E.I. Du Pont De Nemours And Company | Process for heating thin surface layers |
WO2011019886A1 (en) * | 2009-08-13 | 2011-02-17 | Dow Global Technologies, Inc. | A multi-layer laminate structure and manufacturing method |
US8163125B2 (en) | 2009-08-13 | 2012-04-24 | Dow Global Technologies Llc | Multi-layer laminate structure and manufacturing method |
US8361602B2 (en) | 2009-08-13 | 2013-01-29 | Dow Global Technologies Llc | Multi-layer laminate structure and manufacturing method |
US9123847B2 (en) | 2010-12-17 | 2015-09-01 | Dow Global Technologies Llc | Photovoltaic device |
CN113473709A (zh) * | 2020-03-31 | 2021-10-01 | 竞华电子(深圳)有限公司 | 印制电路板加工方法及印制电路板 |
CN113473709B (zh) * | 2020-03-31 | 2022-05-31 | 竞华电子(深圳)有限公司 | 印制电路板加工方法及印制电路板 |
Also Published As
Publication number | Publication date |
---|---|
FR2287714A1 (fr) | 1976-05-07 |
DE2544553A1 (de) | 1976-04-22 |
JPS5513341B2 (US06521211-20030218-C00004.png) | 1980-04-08 |
DE2544553C2 (de) | 1983-08-04 |
NL7511714A (nl) | 1976-04-12 |
JPS5163702A (US06521211-20030218-C00004.png) | 1976-06-02 |
FR2287714B1 (US06521211-20030218-C00004.png) | 1982-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PE20 | Patent expired after termination of 20 years |
Effective date: 19951005 |