IT1274181B - Laminazione di pellicole fotosensibili per formare una maschera di saldatura su schede di circuito stampato - Google Patents

Laminazione di pellicole fotosensibili per formare una maschera di saldatura su schede di circuito stampato

Info

Publication number
IT1274181B
IT1274181B ITVA940012A ITVA940012A IT1274181B IT 1274181 B IT1274181 B IT 1274181B IT VA940012 A ITVA940012 A IT VA940012A IT VA940012 A ITVA940012 A IT VA940012A IT 1274181 B IT1274181 B IT 1274181B
Authority
IT
Italy
Prior art keywords
printed circuit
films
lamination
circuit boards
atmospheric pressure
Prior art date
Application number
ITVA940012A
Other languages
English (en)
Inventor
Amedeo Candore
Original Assignee
Amedeo Candore
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amedeo Candore filed Critical Amedeo Candore
Priority to ITVA940012A priority Critical patent/IT1274181B/it
Publication of ITVA940012A0 publication Critical patent/ITVA940012A0/it
Priority to PCT/IT1995/000076 priority patent/WO1995031885A1/en
Publication of ITVA940012A1 publication Critical patent/ITVA940012A1/it
Application granted granted Critical
Publication of IT1274181B publication Critical patent/IT1274181B/it

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/161Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/066Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/085Using vacuum or low pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Pellicole fotosensibili atte a formare una maschera di saldatura sulla faccia di una scheda di circuito stampato sono più facilmente laminate sulla faccia della scheda effettuando l'evacuazione dell'aria e la pressatura meccanica all'interno di una camera a vuoto, evitando una completa fluidificazione dello strato di resina fotosensibile. Successivamente l'assieme è riscaldato in modo da fluidificare lo strato di resina fotosensibile che, per effetto della pressione atmosferica, si conforma completamente alla superficie della scheda. La ritenzione del foglio di copertura della pellicola fino al momento di riscaldare l'assieme a pressione atmosferica, facilita l'esecuzione di trattamenti atti a preservare l'integrità delle "tendinature". Il metodo risulta vantaggioso sia nel caso di pellicole sottili conformabili sia nel caso di pellicole più spesse (planarizzanti).
ITVA940012A 1994-05-18 1994-05-18 Laminazione di pellicole fotosensibili per formare una maschera di saldatura su schede di circuito stampato IT1274181B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITVA940012A IT1274181B (it) 1994-05-18 1994-05-18 Laminazione di pellicole fotosensibili per formare una maschera di saldatura su schede di circuito stampato
PCT/IT1995/000076 WO1995031885A1 (en) 1994-05-18 1995-05-16 Lamination of dry-film photoresist for forming a conformable solder mask on a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITVA940012A IT1274181B (it) 1994-05-18 1994-05-18 Laminazione di pellicole fotosensibili per formare una maschera di saldatura su schede di circuito stampato

Publications (3)

Publication Number Publication Date
ITVA940012A0 ITVA940012A0 (it) 1994-05-18
ITVA940012A1 ITVA940012A1 (it) 1995-11-18
IT1274181B true IT1274181B (it) 1997-07-15

Family

ID=11423291

Family Applications (1)

Application Number Title Priority Date Filing Date
ITVA940012A IT1274181B (it) 1994-05-18 1994-05-18 Laminazione di pellicole fotosensibili per formare una maschera di saldatura su schede di circuito stampato

Country Status (2)

Country Link
IT (1) IT1274181B (it)
WO (1) WO1995031885A1 (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1117006A1 (en) * 2000-01-14 2001-07-18 Shipley Company LLC Photoresist having increased photospeed
JP5672652B2 (ja) * 2009-03-17 2015-02-18 凸版印刷株式会社 半導体素子用基板の製造方法および半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2544553C2 (de) * 1974-10-08 1983-08-04 E.I. du Pont de Nemours and Co., 19898 Wilmington, Del. Verfahren zum Aufbringen einer photopolymerisierbaren festen Resistschicht auf ein Substrat
JPS593740B2 (ja) * 1975-07-30 1984-01-25 日立化成工業株式会社 凹凸表面に感光層の形成された固体板の製造法
US4992354A (en) * 1988-02-26 1991-02-12 Morton International, Inc. Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like
US4927733A (en) * 1988-12-23 1990-05-22 E. I. Du Pont De Nemours And Company Conformation of vacuum - laminated solder mask coated printed circuit boards by fluid pressurizing

Also Published As

Publication number Publication date
ITVA940012A1 (it) 1995-11-18
WO1995031885A1 (en) 1995-11-23
ITVA940012A0 (it) 1994-05-18

Similar Documents

Publication Publication Date Title
US5606433A (en) Lamination of multilayer photopolymer holograms
IT1250461B (it) Procedimento ed apparecchio per applicare in modo continuo in particolare maschere di saldatura su pannelli di circuiti stampati.
DK89089D0 (da) Fremgangsmaade til fremstilling af en loddemaske paa overfladen af et trykt kredsloebskort
US5422313A (en) Integrated circuit device and manufacturing method using photoresist lead covering
US4290838A (en) Method for vacuum lamination of flex circuits
US4234373A (en) Method and apparatus for vacuum lamination of flex circuits
IT1274181B (it) Laminazione di pellicole fotosensibili per formare una maschera di saldatura su schede di circuito stampato
GB8301190D0 (en) Apparatus for laminating foil to substrate
EP0267807A3 (en) Improved photosensitive laminate
JPS5758797B2 (it)
JPH07273424A (ja) 片面プリント配線板の製造方法
JPH0453190A (ja) リジッド/フレックス配線板の製造方法
JPS54125283A (en) Manufacturing of flexible printed circuit board
IT1131435B (it) Dispositivo per esporre alla luce piastre di supporto per circuiti elettrici stampati
JPS527056A (en) Method of producing laminated product for heat exchanger
TW326623B (en) The manufacturing method of surface mount technology for photodiode display
DE3671192D1 (de) Schichtpresse.
CN216539366U (zh) 防白条气泡产生的干膜烘箱自锁防护结构
JPS51124180A (en) Composite sheets
JPS5748895A (en) Diaphragm plate for entire surface drive type speaker
KR970010111B1 (en) Preheating device for substrate in laminating dry film of printed circuit board
JPS6457592A (en) Manufacture of el
JPH01314144A (ja) 感光性フィルムの積層方法
JPH0330314B2 (it)
JPH0767004B2 (ja) 露光機

Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970328