FR2287714A1 - Procede d'application d'une couche de formation de reserve photosensible sur une surface ayant des zones en relief - Google Patents

Procede d'application d'une couche de formation de reserve photosensible sur une surface ayant des zones en relief

Info

Publication number
FR2287714A1
FR2287714A1 FR7530652A FR7530652A FR2287714A1 FR 2287714 A1 FR2287714 A1 FR 2287714A1 FR 7530652 A FR7530652 A FR 7530652A FR 7530652 A FR7530652 A FR 7530652A FR 2287714 A1 FR2287714 A1 FR 2287714A1
Authority
FR
France
Prior art keywords
applying
forming coat
reserve forming
photosensitive
zones
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7530652A
Other languages
English (en)
Other versions
FR2287714B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of FR2287714A1 publication Critical patent/FR2287714A1/fr
Application granted granted Critical
Publication of FR2287714B1 publication Critical patent/FR2287714B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
FR7530652A 1974-10-08 1975-10-07 Procede d'application d'une couche de formation de reserve photosensible sur une surface ayant des zones en relief Granted FR2287714A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51311274A 1974-10-08 1974-10-08
US56890475A 1975-04-17 1975-04-17

Publications (2)

Publication Number Publication Date
FR2287714A1 true FR2287714A1 (fr) 1976-05-07
FR2287714B1 FR2287714B1 (fr) 1982-10-15

Family

ID=27057750

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7530652A Granted FR2287714A1 (fr) 1974-10-08 1975-10-07 Procede d'application d'une couche de formation de reserve photosensible sur une surface ayant des zones en relief

Country Status (5)

Country Link
JP (1) JPS5163702A (fr)
DE (1) DE2544553C2 (fr)
FR (1) FR2287714A1 (fr)
GB (1) GB1517302A (fr)
NL (1) NL7511714A (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2752900A1 (de) * 1976-11-29 1978-06-01 Du Pont Verfahren zum aufbringen eines photoresistfilms auf ein substrat
EP0144822A2 (fr) * 1983-11-25 1985-06-19 Kurt Held Procédé et dispositif pour la fabrication continue de produits strtifiés comprenant des couches métalliques
EP0324599A2 (fr) * 1988-01-11 1989-07-19 Morton International, Inc. Procédé de préparation de matériaux polymères et application aux circuits imprimés
EP0324596A2 (fr) * 1988-01-11 1989-07-19 Morton International, Inc. Méthode et appareil pour l'application de matériaux polymères aux circuits imprimés
EP0330339A2 (fr) * 1988-02-26 1989-08-30 Morton International, Inc. Photoréserve à sec pour la formation d'un masque adaptable et application dans une méthode pour la fabrication d'un circuit imprimé
EP0339275A2 (fr) * 1988-03-25 1989-11-02 Somar Corporation Procédé et dispositif pour l'adhésion sous pression d'un film mince à un substrat
EP0382936A2 (fr) * 1988-12-23 1990-08-22 E.I. Du Pont De Nemours And Company Elimination de cavités dans des plaquettes de circuits imprimés revêtues d'un masque de brasage laminé sous vide par pression hydrostatique
WO1995031885A1 (fr) * 1994-05-18 1995-11-23 Amedeo Candore Stratification d'un resist photosensible sec pour la formation d'un masque de soudure conformable sur une carte a circuits imprimes

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5489274A (en) * 1977-12-27 1979-07-16 Fujitsu Ltd Method of making printed board
US4289480A (en) * 1979-11-02 1981-09-15 E. I. Du Pont De Nemours And Company Process for heating thin surface layers
JPS6252552A (ja) * 1985-08-30 1987-03-07 Hitachi Chem Co Ltd 減圧貼り合わせ方法及び装置
JPS63259559A (ja) * 1987-04-16 1988-10-26 Hitachi Condenser Co Ltd 印刷配線板のパタ−ン形成方法
DE3737945A1 (de) * 1987-11-07 1989-05-24 Anger Wolfgang Vakuum-laminator
DE4018177A1 (de) * 1990-06-07 1991-12-12 Anger Electronic Gmbh Verfahren zum laminieren von platten und vorrichtung zur durchfuerhrung des verfahrens
DE4026802A1 (de) * 1990-08-24 1992-02-27 Anger Electronic Gmbh Vorrichtung zum kaschieren einer leiterplatte
DE4222262A1 (de) * 1991-09-03 1993-03-04 Anger Electronic Gmbh Vorrichtung zum laminieren von kunststoffprodukten, insbesondere leiterplatten, pvc-folien, polycarbonatfolien und dergleichen
DE9111708U1 (fr) * 1991-09-19 1992-04-16 Anger Electronic Ges.M.B.H. Emco Innovationscenter, Hallein, At
DE19609590A1 (de) * 1996-03-12 1997-09-18 Kontron Elektronik Verfahren und Vorrichtung zur Beschichtung von Substraten, vorzugsweise Leiterplatten
MY120763A (en) 1997-09-19 2005-11-30 Hitachi Chemical Co Ltd Photosensitive film, process for laminating photosensitive resin layer, photosensitive resin layer-laminated substrate and process for curing photosensitive resin layer
EP1117006A1 (fr) * 2000-01-14 2001-07-18 Shipley Company LLC Photoréserve à vitesse améliorée
TWI262360B (en) 2001-03-29 2006-09-21 Hitachi Chemical Co Ltd Light sensitive film for forming circuit and method for manufacturing printed circuit board
US8801887B2 (en) 2005-12-23 2014-08-12 The Boeing Company Textured structure and method of making the textured structure
ES2503791T3 (es) * 2009-08-13 2014-10-07 Dow Global Technologies Llc Una estructura laminada multicapas y método de fabricación
WO2012082613A2 (fr) 2010-12-17 2012-06-21 Dow Global Technologies Llc Dispositif photovoltaïque amélioré
CN113473709B (zh) * 2020-03-31 2022-05-31 竞华电子(深圳)有限公司 印制电路板加工方法及印制电路板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1293655B (fr) * 1969-04-24
US3042574A (en) * 1957-09-25 1962-07-03 Du Pont Method of making laminated structures
NL302012A (fr) * 1963-08-14
CA757597A (en) * 1963-12-30 1967-04-25 L. Mees John Method for making printed circuits
JPS4518324Y1 (fr) * 1966-12-19 1970-07-27
JPS449363Y1 (fr) * 1968-08-05 1969-04-16
US3469982A (en) * 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
DE1953883A1 (de) * 1969-10-25 1971-05-06 Dornbusch & Co Verfahren zum flaechigen Verschweissen von aufgeheizten Warenbahnen,insbesondere von thermoplastischen Kunststoff-Folien,sowie Vorrichtung zur Durchfuehrung des Verfahrens
FR2123089B1 (fr) * 1970-12-11 1974-08-23 Saint Gobain
JPS48100201A (fr) * 1972-04-04 1973-12-18
JPS5129443B2 (fr) * 1972-07-20 1976-08-25
JPS5434909B2 (fr) * 1973-02-08 1979-10-30
JPS49103167A (fr) * 1973-02-08 1974-09-30

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2752900A1 (de) * 1976-11-29 1978-06-01 Du Pont Verfahren zum aufbringen eines photoresistfilms auf ein substrat
EP0144822A2 (fr) * 1983-11-25 1985-06-19 Kurt Held Procédé et dispositif pour la fabrication continue de produits strtifiés comprenant des couches métalliques
EP0144822A3 (en) * 1983-11-25 1987-11-19 Kurt Held Method and apparatus for the continuous production of layered products comprising metal layers
EP0324599A3 (fr) * 1988-01-11 1991-03-27 Morton International, Inc. Procédé de préparation de matériaux polymères et application aux circuits imprimés
EP0324596A2 (fr) * 1988-01-11 1989-07-19 Morton International, Inc. Méthode et appareil pour l'application de matériaux polymères aux circuits imprimés
EP0324599A2 (fr) * 1988-01-11 1989-07-19 Morton International, Inc. Procédé de préparation de matériaux polymères et application aux circuits imprimés
EP0324596A3 (fr) * 1988-01-11 1991-04-10 Morton International, Inc. Méthode et appareil pour l'application de matériaux polymères aux circuits imprimés
EP0330339A2 (fr) * 1988-02-26 1989-08-30 Morton International, Inc. Photoréserve à sec pour la formation d'un masque adaptable et application dans une méthode pour la fabrication d'un circuit imprimé
EP0330339A3 (fr) * 1988-02-26 1991-11-27 Morton International, Inc. Photoréserve à sec pour la formation d'un masque adaptable et application dans une méthode pour la fabrication d'un circuit imprimé
EP0339275A2 (fr) * 1988-03-25 1989-11-02 Somar Corporation Procédé et dispositif pour l'adhésion sous pression d'un film mince à un substrat
EP0339275A3 (en) * 1988-03-25 1990-10-10 Somar Corporation Method and apparatus for pressure sticking a thin film to a base plate
US5078820A (en) * 1988-03-25 1992-01-07 Somar Corporation Method and apparatus for pressure sticking a thin film to a base plate
EP0382936A2 (fr) * 1988-12-23 1990-08-22 E.I. Du Pont De Nemours And Company Elimination de cavités dans des plaquettes de circuits imprimés revêtues d'un masque de brasage laminé sous vide par pression hydrostatique
EP0382936A3 (fr) * 1988-12-23 1991-11-21 E.I. Du Pont De Nemours And Company Elimination de cavités dans des plaquettes de circuits imprimés revêtues d'un masque de brasage laminé sous vide par pression hydrostatique
WO1995031885A1 (fr) * 1994-05-18 1995-11-23 Amedeo Candore Stratification d'un resist photosensible sec pour la formation d'un masque de soudure conformable sur une carte a circuits imprimes

Also Published As

Publication number Publication date
GB1517302A (en) 1978-07-12
DE2544553C2 (de) 1983-08-04
DE2544553A1 (de) 1976-04-22
FR2287714B1 (fr) 1982-10-15
JPS5513341B2 (fr) 1980-04-08
JPS5163702A (ja) 1976-06-02
NL7511714A (nl) 1976-04-12

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