GB1509135A - Gas plasma vapour etching device and method - Google Patents

Gas plasma vapour etching device and method

Info

Publication number
GB1509135A
GB1509135A GB10899/76A GB1089976A GB1509135A GB 1509135 A GB1509135 A GB 1509135A GB 10899/76 A GB10899/76 A GB 10899/76A GB 1089976 A GB1089976 A GB 1089976A GB 1509135 A GB1509135 A GB 1509135A
Authority
GB
United Kingdom
Prior art keywords
gas
gas plasma
etching device
article
plasma vapour
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB10899/76A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Publication of GB1509135A publication Critical patent/GB1509135A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Drying Of Semiconductors (AREA)
GB10899/76A 1975-04-18 1976-03-18 Gas plasma vapour etching device and method Expired GB1509135A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56957575A 1975-04-18 1975-04-18

Publications (1)

Publication Number Publication Date
GB1509135A true GB1509135A (en) 1978-04-26

Family

ID=24275994

Family Applications (1)

Application Number Title Priority Date Filing Date
GB10899/76A Expired GB1509135A (en) 1975-04-18 1976-03-18 Gas plasma vapour etching device and method

Country Status (2)

Country Link
FR (1) FR2308200A1 (https=)
GB (1) GB1509135A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0073643A1 (en) * 1981-08-27 1983-03-09 Mitsubishi Materials Corporation Sputtering apparatus
CN102359676A (zh) * 2011-09-26 2012-02-22 常州捷佳创精密机械有限公司 一种槽底排水管道联接装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4183780A (en) * 1978-08-21 1980-01-15 International Business Machines Corporation Photon enhanced reactive ion etching
WO1981000420A1 (en) * 1979-08-09 1981-02-19 Western Electric Co High capacity etching apparatus
US4298443A (en) * 1979-08-09 1981-11-03 Bell Telephone Laboratories, Incorporated High capacity etching apparatus and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0073643A1 (en) * 1981-08-27 1983-03-09 Mitsubishi Materials Corporation Sputtering apparatus
CN102359676A (zh) * 2011-09-26 2012-02-22 常州捷佳创精密机械有限公司 一种槽底排水管道联接装置
CN102359676B (zh) * 2011-09-26 2015-12-09 常州捷佳创精密机械有限公司 一种槽底排水管道联接装置

Also Published As

Publication number Publication date
FR2308200B1 (https=) 1980-10-31
FR2308200A1 (fr) 1976-11-12

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee