FR2308200A1 - Installation de fabrication de semi-conducteurs et procede pour une telle fabrication - Google Patents

Installation de fabrication de semi-conducteurs et procede pour une telle fabrication

Info

Publication number
FR2308200A1
FR2308200A1 FR7539696A FR7539696A FR2308200A1 FR 2308200 A1 FR2308200 A1 FR 2308200A1 FR 7539696 A FR7539696 A FR 7539696A FR 7539696 A FR7539696 A FR 7539696A FR 2308200 A1 FR2308200 A1 FR 2308200A1
Authority
FR
France
Prior art keywords
manufacturing
plant
semiconductor
semiconductor manufacturing
manufacturing plant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7539696A
Other languages
English (en)
Other versions
FR2308200B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Publication of FR2308200A1 publication Critical patent/FR2308200A1/fr
Application granted granted Critical
Publication of FR2308200B1 publication Critical patent/FR2308200B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
FR7539696A 1975-04-18 1975-12-24 Installation de fabrication de semi-conducteurs et procede pour une telle fabrication Granted FR2308200A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56957575A 1975-04-18 1975-04-18

Publications (2)

Publication Number Publication Date
FR2308200A1 true FR2308200A1 (fr) 1976-11-12
FR2308200B1 FR2308200B1 (fr) 1980-10-31

Family

ID=24275994

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7539696A Granted FR2308200A1 (fr) 1975-04-18 1975-12-24 Installation de fabrication de semi-conducteurs et procede pour une telle fabrication

Country Status (2)

Country Link
FR (1) FR2308200A1 (fr)
GB (1) GB1509135A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0009558A1 (fr) * 1978-08-21 1980-04-16 International Business Machines Corporation Procédé et dispositif de modification d'une surface au moyen de plasma
WO1981000420A1 (fr) * 1979-08-09 1981-02-19 Western Electric Co Appareil d'attaque chimique de grande capacite
US4298443A (en) * 1979-08-09 1981-11-03 Bell Telephone Laboratories, Incorporated High capacity etching apparatus and method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6037188B2 (ja) * 1981-08-27 1985-08-24 三菱マテリアル株式会社 スパツタリング装置
CN102359676B (zh) * 2011-09-26 2015-12-09 常州捷佳创精密机械有限公司 一种槽底排水管道联接装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0009558A1 (fr) * 1978-08-21 1980-04-16 International Business Machines Corporation Procédé et dispositif de modification d'une surface au moyen de plasma
WO1981000420A1 (fr) * 1979-08-09 1981-02-19 Western Electric Co Appareil d'attaque chimique de grande capacite
US4298443A (en) * 1979-08-09 1981-11-03 Bell Telephone Laboratories, Incorporated High capacity etching apparatus and method

Also Published As

Publication number Publication date
FR2308200B1 (fr) 1980-10-31
GB1509135A (en) 1978-04-26

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Legal Events

Date Code Title Description
CD Change of name or company name
TP Transmission of property
ST Notification of lapse