GB1443028A - Microminiaturized electrical compoennts - Google Patents

Microminiaturized electrical compoennts

Info

Publication number
GB1443028A
GB1443028A GB5031973A GB5031973A GB1443028A GB 1443028 A GB1443028 A GB 1443028A GB 5031973 A GB5031973 A GB 5031973A GB 5031973 A GB5031973 A GB 5031973A GB 1443028 A GB1443028 A GB 1443028A
Authority
GB
United Kingdom
Prior art keywords
recesses
projections
component
housing
housing part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5031973A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1443028A publication Critical patent/GB1443028A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB5031973A 1972-11-02 1973-10-30 Microminiaturized electrical compoennts Expired GB1443028A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2253627A DE2253627A1 (de) 1972-11-02 1972-11-02 Elektrisches bauelement in mikrotechnik, vorzugsweise halbleiterbauelement

Publications (1)

Publication Number Publication Date
GB1443028A true GB1443028A (en) 1976-07-21

Family

ID=5860646

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5031973A Expired GB1443028A (en) 1972-11-02 1973-10-30 Microminiaturized electrical compoennts

Country Status (6)

Country Link
JP (1) JPS5638060B2 (https=)
DE (1) DE2253627A1 (https=)
FR (1) FR2205745B1 (https=)
GB (1) GB1443028A (https=)
IT (1) IT996899B (https=)
NL (1) NL7314802A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3036371A1 (de) * 1979-09-27 1981-04-16 Hybrid Systems Corp., Bedford, Mass. Hybridschaltungspackung
DE3212903A1 (de) * 1981-04-13 1982-11-11 SGS-ATES Componenti Elettronici S.p.A., 20041 Agrate Brianza, Milano Verfahren zur herstellung von kunststoff-gehaeusen mit eingebautem waermeableiter fuer integrierte schaltungen und zur ausfuehrung des verfahrens geeignete kombination aus formwerkzeug und waermeableiter
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
GB2371674A (en) * 2001-01-30 2002-07-31 Univ Sheffield Micro-element package
EP3300104A4 (en) * 2015-05-20 2019-01-09 Kyocera Corporation SEMICONDUCTOR ELEMENT HOUSING, SEMICONDUCTOR ELEMENT AND MOUNTING STRUCTURE

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5272466U (https=) * 1975-11-26 1977-05-30
NL7713758A (nl) * 1977-12-13 1979-06-15 Philips Nv Halfgeleiderinrichting.
DE2942261A1 (de) * 1979-10-19 1981-04-30 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
DE3138743A1 (de) * 1981-09-29 1983-04-07 Siemens AG, 1000 Berlin und 8000 München In einem dichten gehaeuse montiertes oberflaechenwellenfilter und dergleichen
US5072283A (en) * 1988-04-12 1991-12-10 Bolger Justin C Pre-formed chip carrier cavity package
GB2236213A (en) * 1989-09-09 1991-03-27 Ibm Integral protective enclosure for an assembly mounted on a flexible printed circuit board
DE4224103A1 (de) * 1992-07-22 1994-01-27 Manfred Dr Ing Michalk Miniaturgehäuse mit elektronischen Bauelementen
US8058719B2 (en) * 2007-03-23 2011-11-15 Microsemi Corporation Integrated circuit with flexible planer leads
US8018042B2 (en) 2007-03-23 2011-09-13 Microsemi Corporation Integrated circuit with flexible planar leads

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS476963U (https=) * 1971-02-13 1972-09-25
JPS4816345U (https=) * 1971-07-02 1973-02-23

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3036371A1 (de) * 1979-09-27 1981-04-16 Hybrid Systems Corp., Bedford, Mass. Hybridschaltungspackung
DE3212903A1 (de) * 1981-04-13 1982-11-11 SGS-ATES Componenti Elettronici S.p.A., 20041 Agrate Brianza, Milano Verfahren zur herstellung von kunststoff-gehaeusen mit eingebautem waermeableiter fuer integrierte schaltungen und zur ausfuehrung des verfahrens geeignete kombination aus formwerkzeug und waermeableiter
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
GB2371674A (en) * 2001-01-30 2002-07-31 Univ Sheffield Micro-element package
WO2002060810A3 (en) * 2001-01-30 2003-09-04 Univ Sheffield Micro-element substrate interconnection
EP3300104A4 (en) * 2015-05-20 2019-01-09 Kyocera Corporation SEMICONDUCTOR ELEMENT HOUSING, SEMICONDUCTOR ELEMENT AND MOUNTING STRUCTURE

Also Published As

Publication number Publication date
JPS5638060B2 (https=) 1981-09-03
DE2253627A1 (de) 1974-05-16
FR2205745A1 (https=) 1974-05-31
JPS4977172A (https=) 1974-07-25
NL7314802A (https=) 1974-05-06
IT996899B (it) 1975-12-10
FR2205745B1 (https=) 1978-08-11

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee