JPS5638060B2 - - Google Patents
Info
- Publication number
- JPS5638060B2 JPS5638060B2 JP12128973A JP12128973A JPS5638060B2 JP S5638060 B2 JPS5638060 B2 JP S5638060B2 JP 12128973 A JP12128973 A JP 12128973A JP 12128973 A JP12128973 A JP 12128973A JP S5638060 B2 JPS5638060 B2 JP S5638060B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/688—Flexible insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/778—Auxiliary members characterised by their shape in encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/453—Leadframes comprising flexible metallic tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2253627A DE2253627A1 (de) | 1972-11-02 | 1972-11-02 | Elektrisches bauelement in mikrotechnik, vorzugsweise halbleiterbauelement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4977172A JPS4977172A (https=) | 1974-07-25 |
| JPS5638060B2 true JPS5638060B2 (https=) | 1981-09-03 |
Family
ID=5860646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12128973A Expired JPS5638060B2 (https=) | 1972-11-02 | 1973-10-30 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS5638060B2 (https=) |
| DE (1) | DE2253627A1 (https=) |
| FR (1) | FR2205745B1 (https=) |
| GB (1) | GB1443028A (https=) |
| IT (1) | IT996899B (https=) |
| NL (1) | NL7314802A (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5272466U (https=) * | 1975-11-26 | 1977-05-30 | ||
| NL7713758A (nl) * | 1977-12-13 | 1979-06-15 | Philips Nv | Halfgeleiderinrichting. |
| US4272644A (en) * | 1979-09-27 | 1981-06-09 | Hybrid Systems Corporation | Electronic hybrid circuit package |
| DE2942261A1 (de) * | 1979-10-19 | 1981-04-30 | Robert Bosch Gmbh, 7000 Stuttgart | Halbleiterbauelement |
| IT1218271B (it) * | 1981-04-13 | 1990-04-12 | Ates Componenti Elettron | Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento |
| DE3138743A1 (de) * | 1981-09-29 | 1983-04-07 | Siemens AG, 1000 Berlin und 8000 München | In einem dichten gehaeuse montiertes oberflaechenwellenfilter und dergleichen |
| US5072283A (en) * | 1988-04-12 | 1991-12-10 | Bolger Justin C | Pre-formed chip carrier cavity package |
| GB2236213A (en) * | 1989-09-09 | 1991-03-27 | Ibm | Integral protective enclosure for an assembly mounted on a flexible printed circuit board |
| DE4224103A1 (de) * | 1992-07-22 | 1994-01-27 | Manfred Dr Ing Michalk | Miniaturgehäuse mit elektronischen Bauelementen |
| US5372512A (en) * | 1993-04-30 | 1994-12-13 | Hewlett-Packard Company | Electrical interconnect system for a flexible circuit |
| GB2371674A (en) * | 2001-01-30 | 2002-07-31 | Univ Sheffield | Micro-element package |
| US8058719B2 (en) * | 2007-03-23 | 2011-11-15 | Microsemi Corporation | Integrated circuit with flexible planer leads |
| US8018042B2 (en) | 2007-03-23 | 2011-09-13 | Microsemi Corporation | Integrated circuit with flexible planar leads |
| EP3300104B1 (en) * | 2015-05-20 | 2026-01-21 | Kyocera Corporation | Semiconductor element package, semiconductor device, and mounting structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS476963U (https=) * | 1971-02-13 | 1972-09-25 | ||
| JPS4816345U (https=) * | 1971-07-02 | 1973-02-23 |
-
1972
- 1972-11-02 DE DE2253627A patent/DE2253627A1/de not_active Withdrawn
-
1973
- 1973-10-27 NL NL7314802A patent/NL7314802A/xx unknown
- 1973-10-30 IT IT70205/73A patent/IT996899B/it active
- 1973-10-30 GB GB5031973A patent/GB1443028A/en not_active Expired
- 1973-10-30 JP JP12128973A patent/JPS5638060B2/ja not_active Expired
- 1973-11-02 FR FR7339062A patent/FR2205745B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1443028A (en) | 1976-07-21 |
| DE2253627A1 (de) | 1974-05-16 |
| FR2205745A1 (https=) | 1974-05-31 |
| JPS4977172A (https=) | 1974-07-25 |
| NL7314802A (https=) | 1974-05-06 |
| IT996899B (it) | 1975-12-10 |
| FR2205745B1 (https=) | 1978-08-11 |