IT996899B - Componente elettrico microminia turizzato preferibilmente com ponente semiconduttore - Google Patents

Componente elettrico microminia turizzato preferibilmente com ponente semiconduttore

Info

Publication number
IT996899B
IT996899B IT7020573A IT7020573A IT996899B IT 996899 B IT996899 B IT 996899B IT 7020573 A IT7020573 A IT 7020573A IT 7020573 A IT7020573 A IT 7020573A IT 996899 B IT996899 B IT 996899B
Authority
IT
Italy
Prior art keywords
microminium
turized
semiconductor
component
electrical component
Prior art date
Application number
IT7020573A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT996899B publication Critical patent/IT996899B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT7020573A 1972-11-02 1973-10-30 Componente elettrico microminia turizzato preferibilmente com ponente semiconduttore IT996899B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722253627 DE2253627A1 (de) 1972-11-02 1972-11-02 Elektrisches bauelement in mikrotechnik, vorzugsweise halbleiterbauelement

Publications (1)

Publication Number Publication Date
IT996899B true IT996899B (it) 1975-12-10

Family

ID=5860646

Family Applications (1)

Application Number Title Priority Date Filing Date
IT7020573A IT996899B (it) 1972-11-02 1973-10-30 Componente elettrico microminia turizzato preferibilmente com ponente semiconduttore

Country Status (6)

Country Link
JP (1) JPS5638060B2 (it)
DE (1) DE2253627A1 (it)
FR (1) FR2205745B1 (it)
GB (1) GB1443028A (it)
IT (1) IT996899B (it)
NL (1) NL7314802A (it)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5272466U (it) * 1975-11-26 1977-05-30
NL7713758A (nl) * 1977-12-13 1979-06-15 Philips Nv Halfgeleiderinrichting.
US4272644A (en) * 1979-09-27 1981-06-09 Hybrid Systems Corporation Electronic hybrid circuit package
DE2942261A1 (de) * 1979-10-19 1981-04-30 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
IT1218271B (it) * 1981-04-13 1990-04-12 Ates Componenti Elettron Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento
DE3138743A1 (de) * 1981-09-29 1983-04-07 Siemens AG, 1000 Berlin und 8000 München In einem dichten gehaeuse montiertes oberflaechenwellenfilter und dergleichen
US5072283A (en) * 1988-04-12 1991-12-10 Bolger Justin C Pre-formed chip carrier cavity package
GB2236213A (en) * 1989-09-09 1991-03-27 Ibm Integral protective enclosure for an assembly mounted on a flexible printed circuit board
DE4224103A1 (de) * 1992-07-22 1994-01-27 Manfred Dr Ing Michalk Miniaturgehäuse mit elektronischen Bauelementen
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
GB2371674A (en) * 2001-01-30 2002-07-31 Univ Sheffield Micro-element package
US8058719B2 (en) 2007-03-23 2011-11-15 Microsemi Corporation Integrated circuit with flexible planer leads
US8018042B2 (en) 2007-03-23 2011-09-13 Microsemi Corporation Integrated circuit with flexible planar leads
EP3300104A4 (en) * 2015-05-20 2019-01-09 Kyocera Corporation SEMICONDUCTOR ELEMENT HOUSING, SEMICONDUCTOR ELEMENT AND MOUNTING STRUCTURE

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4816345B1 (it) * 1967-06-09 1973-05-21
JPS476963U (it) * 1971-02-13 1972-09-25
JPS4816345U (it) * 1971-07-02 1973-02-23

Also Published As

Publication number Publication date
FR2205745A1 (it) 1974-05-31
JPS5638060B2 (it) 1981-09-03
DE2253627A1 (de) 1974-05-16
FR2205745B1 (it) 1978-08-11
NL7314802A (it) 1974-05-06
JPS4977172A (it) 1974-07-25
GB1443028A (en) 1976-07-21

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