GB1441781A - Electric circuit fabrication - Google Patents

Electric circuit fabrication

Info

Publication number
GB1441781A
GB1441781A GB5028773A GB5028773A GB1441781A GB 1441781 A GB1441781 A GB 1441781A GB 5028773 A GB5028773 A GB 5028773A GB 5028773 A GB5028773 A GB 5028773A GB 1441781 A GB1441781 A GB 1441781A
Authority
GB
United Kingdom
Prior art keywords
layer
resist
portions
substrate
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5028773A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1441781A publication Critical patent/GB1441781A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Magnetic Heads (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
GB5028773A 1972-11-30 1973-10-29 Electric circuit fabrication Expired GB1441781A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31100672A 1972-11-30 1972-11-30

Publications (1)

Publication Number Publication Date
GB1441781A true GB1441781A (en) 1976-07-07

Family

ID=23204973

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5028773A Expired GB1441781A (en) 1972-11-30 1973-10-29 Electric circuit fabrication

Country Status (3)

Country Link
JP (1) JPS5733703B2 (tr)
FR (1) FR2209216B1 (tr)
GB (1) GB1441781A (tr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2213325A (en) * 1987-12-04 1989-08-09 Marconi Electronic Devices A method of forming electrical conductors on an insulating substrate
US5407530A (en) * 1992-11-18 1995-04-18 Mitsumi Electric Co., Ltd. Method of preparing fine conductive pattern
WO2022184038A1 (zh) * 2021-03-02 2022-09-09 苏州太阳井新能源有限公司 一种光伏电池电极的制作方法及光伏电池

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7704186A (nl) * 1977-04-18 1978-10-20 Philips Nv Werkwijze voor het galvanisch versterken van een geleidend basispatroon en inrichting ver- kregen met behulp van de werkwijze.
JPS5580819A (en) * 1978-12-14 1980-06-18 Mitsubishi Electric Corp Manufacture of thin film magnetic head
JPS5691494A (en) * 1979-12-25 1981-07-24 Nippon Electric Co Method of forming conductor pattern
JPS5766523A (en) * 1980-10-13 1982-04-22 Hitachi Ltd Thin-film magnetic head
IE51854B1 (en) * 1980-12-03 1987-04-15 Memorex Corp Method of fabricating a metallic pattern on a substrate
JPS57164413A (en) * 1981-03-31 1982-10-09 Fujitsu Ltd Manufacture of thin film magnetic head
JPS5819716A (ja) * 1981-07-27 1983-02-04 Hitachi Ltd 薄膜磁気ヘツドおよびその製造方法
US4375390A (en) * 1982-03-15 1983-03-01 Anderson Nathaniel C Thin film techniques for fabricating narrow track ferrite heads
JPH05235173A (ja) * 1992-02-24 1993-09-10 Nec Corp 半導体装置及びその製造方法
JPH0644531A (ja) * 1993-02-24 1994-02-18 Hitachi Ltd 薄膜磁気ヘッド
JPH07273118A (ja) * 1994-03-28 1995-10-20 Toshiba Corp 配線、電極の形成方法
CN114501833B (zh) * 2020-10-23 2024-05-14 深南电路股份有限公司 线路板上阻焊层的加工方法
CN114173510B (zh) * 2021-12-08 2022-12-13 上海交通大学 一种具有空气隔热层的微型多层隔热结构及其制备和应用

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3154450A (en) * 1960-01-27 1964-10-27 Bendix Corp Method of making mesas for diodes by etching
US3474021A (en) * 1966-01-12 1969-10-21 Ibm Method of forming openings using sequential sputtering and chemical etching
US3507756A (en) * 1967-08-04 1970-04-21 Bell Telephone Labor Inc Method of fabricating semiconductor device contact

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2213325A (en) * 1987-12-04 1989-08-09 Marconi Electronic Devices A method of forming electrical conductors on an insulating substrate
GB2213325B (en) * 1987-12-04 1992-01-02 Marconi Electronic Devices A method of forming electrical conductors
US5407530A (en) * 1992-11-18 1995-04-18 Mitsumi Electric Co., Ltd. Method of preparing fine conductive pattern
WO2022184038A1 (zh) * 2021-03-02 2022-09-09 苏州太阳井新能源有限公司 一种光伏电池电极的制作方法及光伏电池

Also Published As

Publication number Publication date
JPS5733703B2 (tr) 1982-07-19
FR2209216B1 (tr) 1977-09-30
FR2209216A1 (tr) 1974-06-28
JPS4983868A (tr) 1974-08-12

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee