GB2213325B - A method of forming electrical conductors - Google Patents

A method of forming electrical conductors

Info

Publication number
GB2213325B
GB2213325B GB8728372A GB8728372A GB2213325B GB 2213325 B GB2213325 B GB 2213325B GB 8728372 A GB8728372 A GB 8728372A GB 8728372 A GB8728372 A GB 8728372A GB 2213325 B GB2213325 B GB 2213325B
Authority
GB
United Kingdom
Prior art keywords
electrical conductors
forming electrical
forming
conductors
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8728372A
Other versions
GB2213325A (en
GB8728372D0 (en
Inventor
Gillian Denise Kellet
Roy Charles Winter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marconi Electronic Devices Ltd
Original Assignee
Marconi Electronic Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Electronic Devices Ltd filed Critical Marconi Electronic Devices Ltd
Priority to GB8728372A priority Critical patent/GB2213325B/en
Publication of GB8728372D0 publication Critical patent/GB8728372D0/en
Publication of GB2213325A publication Critical patent/GB2213325A/en
Application granted granted Critical
Publication of GB2213325B publication Critical patent/GB2213325B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
GB8728372A 1987-12-04 1987-12-04 A method of forming electrical conductors Expired - Fee Related GB2213325B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8728372A GB2213325B (en) 1987-12-04 1987-12-04 A method of forming electrical conductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8728372A GB2213325B (en) 1987-12-04 1987-12-04 A method of forming electrical conductors

Publications (3)

Publication Number Publication Date
GB8728372D0 GB8728372D0 (en) 1988-01-13
GB2213325A GB2213325A (en) 1989-08-09
GB2213325B true GB2213325B (en) 1992-01-02

Family

ID=10627985

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8728372A Expired - Fee Related GB2213325B (en) 1987-12-04 1987-12-04 A method of forming electrical conductors

Country Status (1)

Country Link
GB (1) GB2213325B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW453139B (en) 1998-07-13 2001-09-01 Siemens Ag Method to produce circuit-plates with coarse conductive patterns and at least one region with fine conductive patterns
DE10106399C1 (en) * 2001-02-12 2002-09-05 Siemens Ag Process for the production of circuit carriers with coarse conductor structures and at least one area with fine conductor structures

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1441781A (en) * 1972-11-30 1976-07-07 Ibm Electric circuit fabrication
EP0062300A2 (en) * 1981-04-06 1982-10-13 FRITZ WITTIG Herstellung gedruckter Schaltungen Process for making a circuit board
GB2098807A (en) * 1981-05-16 1982-11-24 Ferranti Ltd Method of making circuit elements in a film
GB2113477A (en) * 1981-12-31 1983-08-03 Hara J B O Method of producing printed circuits
GB2124037A (en) * 1982-07-19 1984-02-08 Gen Electric Co Plc Methods of forming patterns on substrates
WO1987000390A1 (en) * 1985-06-27 1987-01-15 Ncr Corporation Method of manufacturing printed circuit boards

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1441781A (en) * 1972-11-30 1976-07-07 Ibm Electric circuit fabrication
EP0062300A2 (en) * 1981-04-06 1982-10-13 FRITZ WITTIG Herstellung gedruckter Schaltungen Process for making a circuit board
GB2098807A (en) * 1981-05-16 1982-11-24 Ferranti Ltd Method of making circuit elements in a film
GB2113477A (en) * 1981-12-31 1983-08-03 Hara J B O Method of producing printed circuits
GB2124037A (en) * 1982-07-19 1984-02-08 Gen Electric Co Plc Methods of forming patterns on substrates
WO1987000390A1 (en) * 1985-06-27 1987-01-15 Ncr Corporation Method of manufacturing printed circuit boards

Also Published As

Publication number Publication date
GB2213325A (en) 1989-08-09
GB8728372D0 (en) 1988-01-13

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19971204