GB1439351A - Capacitor - Google Patents

Capacitor

Info

Publication number
GB1439351A
GB1439351A GB2203573A GB2203573A GB1439351A GB 1439351 A GB1439351 A GB 1439351A GB 2203573 A GB2203573 A GB 2203573A GB 2203573 A GB2203573 A GB 2203573A GB 1439351 A GB1439351 A GB 1439351A
Authority
GB
United Kingdom
Prior art keywords
grooves
substrate
capacitor
layer
studs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2203573A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of GB1439351A publication Critical patent/GB1439351A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/62—Capacitors having potential barriers
    • H10D1/66—Conductor-insulator-semiconductor capacitors, e.g. MOS capacitors
    • H10D1/665—Trench conductor-insulator-semiconductor capacitors, e.g. trench MOS capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Memories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Integrated Circuits (AREA)
GB2203573A 1972-06-02 1973-05-09 Capacitor Expired GB1439351A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25933272A 1972-06-02 1972-06-02

Publications (1)

Publication Number Publication Date
GB1439351A true GB1439351A (en) 1976-06-16

Family

ID=22984501

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2203573A Expired GB1439351A (en) 1972-06-02 1973-05-09 Capacitor

Country Status (4)

Country Link
JP (1) JPS5648976B2 (enrdf_load_stackoverflow)
DE (1) DE2328090C2 (enrdf_load_stackoverflow)
GB (1) GB1439351A (enrdf_load_stackoverflow)
NL (1) NL185432C (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113555444A (zh) * 2021-07-06 2021-10-26 浙江芯国半导体有限公司 一种高质量氧化镓半导体器件及制备方法

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51148385A (en) * 1975-06-14 1976-12-20 Fujitsu Ltd Semiconductor memory cell
JPS583259A (ja) * 1981-06-29 1983-01-10 Fujitsu Ltd たて型キヤパシタの製造方法
JPS5891669A (ja) * 1981-11-26 1983-05-31 Seiko Epson Corp 半導体装置
JPS58137242A (ja) * 1982-02-09 1983-08-15 Seiko Epson Corp 集積回路装置
JPS6012752A (ja) * 1983-07-01 1985-01-23 Nippon Telegr & Teleph Corp <Ntt> 半導体記憶装置およびその製造方法
JPS6023505B2 (ja) * 1983-11-21 1985-06-07 株式会社日立製作所 半導体記憶装置
JPS6023507B2 (ja) * 1983-11-21 1985-06-07 株式会社日立製作所 半導体記憶装置
JPS6023506B2 (ja) * 1983-11-21 1985-06-07 株式会社日立製作所 半導体記憶装置
JPS60158654A (ja) * 1984-01-28 1985-08-20 Seiko Epson Corp 半導体装置
JPS6151869A (ja) * 1984-08-20 1986-03-14 Mitsubishi Electric Corp 半導体記憶装置およびその製造方法
JPS6099549U (ja) * 1984-10-11 1985-07-06 日本電気株式会社 半導体装置
JPS61177767A (ja) * 1985-01-31 1986-08-09 Mitsubishi Electric Corp 半導体装置の製造方法
JPS61228660A (ja) * 1985-04-02 1986-10-11 Mitsubishi Electric Corp 半導体集積回路の製造方法
JPH02191370A (ja) * 1989-12-15 1990-07-27 Seiko Epson Corp 半導体装置
RU2082258C1 (ru) * 1991-08-14 1997-06-20 Сименс АГ Схемная структура с по меньшей мере одним конденсатором и способ ее изготовления
DE19713052A1 (de) * 1997-03-27 1998-10-01 Siemens Ag Kondensatorstruktur
FR2808924B1 (fr) * 2000-05-09 2002-08-16 Centre Nat Rech Scient Condenseur a capacite variable
JP2017135376A (ja) * 2016-01-22 2017-08-03 Tdk株式会社 薄膜キャパシタ及び電子回路モジュール
JP2023141145A (ja) * 2022-03-23 2023-10-05 日産自動車株式会社 半導体装置、及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE635797C (de) * 1930-07-26 1936-09-28 Hermsdorf Schomburg Isolatoren Hochspannungskondensator mit einem Dielektrikum aus keramischem Stoff oder Glas
DE897861C (de) * 1951-06-29 1953-11-26 Siemens Ag Elektrischer Durchfuehrungskondensator
DE1097563B (de) * 1958-04-26 1961-01-19 Elektroteile G M B H Zugmagnet fuer Gleich- oder Wechselstrom mit vom Anker angetriebener Zahnstange
US3149399A (en) * 1962-09-25 1964-09-22 Sprague Electric Co Silicon capacitor
GB1288278A (enrdf_load_stackoverflow) * 1968-12-31 1972-09-06
JPS512699Y2 (enrdf_load_stackoverflow) * 1971-01-23 1976-01-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113555444A (zh) * 2021-07-06 2021-10-26 浙江芯国半导体有限公司 一种高质量氧化镓半导体器件及制备方法

Also Published As

Publication number Publication date
NL185432C (nl) 1990-04-02
DE2328090C2 (de) 1987-01-22
NL7307686A (enrdf_load_stackoverflow) 1973-12-04
NL185432B (nl) 1989-11-01
JPS5648976B2 (enrdf_load_stackoverflow) 1981-11-19
JPS4957779A (enrdf_load_stackoverflow) 1974-06-05
DE2328090A1 (de) 1973-12-13

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years

Effective date: 19930508