GB1424642A - Layer circuits - Google Patents

Layer circuits

Info

Publication number
GB1424642A
GB1424642A GB36774A GB36774A GB1424642A GB 1424642 A GB1424642 A GB 1424642A GB 36774 A GB36774 A GB 36774A GB 36774 A GB36774 A GB 36774A GB 1424642 A GB1424642 A GB 1424642A
Authority
GB
United Kingdom
Prior art keywords
sintered
contacts
plate
ceramic
interconnected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB36774A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1424642A publication Critical patent/GB1424642A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
GB36774A 1973-02-08 1974-01-04 Layer circuits Expired GB1424642A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2306236A DE2306236C2 (de) 1973-02-08 1973-02-08 Verfahren zur Herstellung von Schichtschaltungen mit leitenden Schichten auf beiden Seiten eines Keramiksubstrates

Publications (1)

Publication Number Publication Date
GB1424642A true GB1424642A (en) 1976-02-11

Family

ID=5871358

Family Applications (1)

Application Number Title Priority Date Filing Date
GB36774A Expired GB1424642A (en) 1973-02-08 1974-01-04 Layer circuits

Country Status (9)

Country Link
US (1) US3922777A (enExample)
JP (1) JPS5760796B2 (enExample)
BE (1) BE810777A (enExample)
DE (1) DE2306236C2 (enExample)
FR (1) FR2217905B1 (enExample)
GB (1) GB1424642A (enExample)
IT (1) IT1007177B (enExample)
LU (1) LU69334A1 (enExample)
NL (1) NL7401287A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2188194A (en) * 1986-03-21 1987-09-23 Plessey Co Plc Carrier for high frequency integrated circuits
WO2003034446A3 (de) * 2001-10-13 2004-02-05 Bosch Gmbh Robert Grüner keramischer einsatzkörper, keramischer einsatzkörper, keramischer grünkörper oder grünkörperverbund und damit hergestellter keramischer schichtverbund

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
EP0080535B1 (de) * 1981-11-27 1985-08-28 Krohne AG Messwertaufnehmer für magnetisch-induktive Durchflussmessgeräte
JPS59231890A (ja) * 1983-06-14 1984-12-26 日立化成工業株式会社 スルホ−ル導体の形成方法
JPS6028296A (ja) * 1983-07-27 1985-02-13 株式会社日立製作所 セラミツク多層配線回路板
WO1987000686A1 (fr) * 1985-07-16 1987-01-29 Nippon Telegraph And Telephone Corporation Bornes de connection entre des substrats et procede de production
US4771537A (en) * 1985-12-20 1988-09-20 Olin Corporation Method of joining metallic components
JPS62265796A (ja) * 1986-05-14 1987-11-18 株式会社住友金属セラミックス セラミツク多層配線基板およびその製造法
WO1988005959A1 (en) * 1987-02-04 1988-08-11 Coors Porcelain Company Ceramic substrate with conductively-filled vias and method for producing
DE3709770A1 (de) * 1987-03-25 1988-10-13 Ant Nachrichtentech Leiterplatte, -folie, multilayerinnenlage oder leitersubstrat mit durchkontaktierungen und herstellungsverfahren
JPS63240096A (ja) * 1987-03-27 1988-10-05 富士通株式会社 グリ−ンシ−ト多層法
US5280414A (en) * 1990-06-11 1994-01-18 International Business Machines Corp. Au-Sn transient liquid bonding in high performance laminates
US5283104A (en) * 1991-03-20 1994-02-01 International Business Machines Corporation Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
US5223790A (en) * 1991-05-10 1993-06-29 Metricom, Inc. Current sensor using current transformer with sintered primary
JP3057924B2 (ja) * 1992-09-22 2000-07-04 松下電器産業株式会社 両面プリント基板およびその製造方法
DE4318061C2 (de) * 1993-06-01 1998-06-10 Schulz Harder Juergen Verfahren zum Herstellen eines Metall-Keramik-Substrates
JP3451868B2 (ja) * 1997-01-17 2003-09-29 株式会社デンソー セラミック積層基板の製造方法
DE10247409B4 (de) * 2002-10-11 2008-09-25 Robert Bosch Gmbh Keramischer Substratkörper und Verfahren zu dessen Herstellung
WO2010141100A1 (en) * 2009-06-04 2010-12-09 Morgan Advanced Ceramics, Inc. Co-fired metal and ceramic composite feedthrough assemblies for use at least in implantable medical devices and methods for making the same
DE102015202669A1 (de) 2015-02-13 2016-09-01 Robert Bosch Gmbh Schaltungsträger und Verfahren zur Herstellung eines Schaltungsträgers
US11554509B1 (en) * 2021-07-13 2023-01-17 Lowell Dean Feil Drip irrigation feeder pipe slicer tool and method of detaching barbed fittings and devices using the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1283586A (fr) * 1960-03-11 1962-02-02 Int Resistance Co Circuit imprimé
US3077511A (en) * 1960-03-11 1963-02-12 Int Resistance Co Printed circuit unit
DE1301378B (de) * 1966-03-30 1969-08-21 Ibm Verfahren zur Herstellung vielschichtiger elektrischer Schaltungselemente auf keramischer Basis
US3423517A (en) * 1966-07-27 1969-01-21 Dielectric Systems Inc Monolithic ceramic electrical interconnecting structure
US3540894A (en) * 1967-03-29 1970-11-17 Ibm Eutectic lead bisilicate ceramic compositions and fired ceramic bodies
US3517437A (en) * 1967-06-19 1970-06-30 Beckman Instruments Inc Method of forming a terminal structure in a refractory base
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
US3561110A (en) * 1967-08-31 1971-02-09 Ibm Method of making connections and conductive paths
US3488429A (en) * 1969-02-24 1970-01-06 Gerald Boucher Multilayer printed circuits
US3772748A (en) * 1971-04-16 1973-11-20 Nl Industries Inc Method for forming electrodes and conductors
US3798762A (en) * 1972-08-14 1974-03-26 Us Army Circuit board processing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2188194A (en) * 1986-03-21 1987-09-23 Plessey Co Plc Carrier for high frequency integrated circuits
WO2003034446A3 (de) * 2001-10-13 2004-02-05 Bosch Gmbh Robert Grüner keramischer einsatzkörper, keramischer einsatzkörper, keramischer grünkörper oder grünkörperverbund und damit hergestellter keramischer schichtverbund

Also Published As

Publication number Publication date
BE810777A (fr) 1974-05-29
US3922777A (en) 1975-12-02
DE2306236C2 (de) 1982-11-25
JPS5760796B2 (enExample) 1982-12-21
JPS49112164A (enExample) 1974-10-25
IT1007177B (it) 1976-10-30
DE2306236A1 (de) 1974-08-15
FR2217905A1 (enExample) 1974-09-06
LU69334A1 (enExample) 1974-05-17
FR2217905B1 (enExample) 1979-08-03
NL7401287A (enExample) 1974-08-12

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee