GB1397330A - Housings for semiconductor systems - Google Patents

Housings for semiconductor systems

Info

Publication number
GB1397330A
GB1397330A GB6005172A GB6005172A GB1397330A GB 1397330 A GB1397330 A GB 1397330A GB 6005172 A GB6005172 A GB 6005172A GB 6005172 A GB6005172 A GB 6005172A GB 1397330 A GB1397330 A GB 1397330A
Authority
GB
United Kingdom
Prior art keywords
bores
metal
housings
ring
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6005172A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1397330A publication Critical patent/GB1397330A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casings For Electric Apparatus (AREA)
GB6005172A 1972-03-22 1972-12-29 Housings for semiconductor systems Expired GB1397330A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2213915A DE2213915A1 (de) 1972-03-22 1972-03-22 Gehaeuse fuer halbleitersysteme

Publications (1)

Publication Number Publication Date
GB1397330A true GB1397330A (en) 1975-06-11

Family

ID=5839779

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6005172A Expired GB1397330A (en) 1972-03-22 1972-12-29 Housings for semiconductor systems

Country Status (9)

Country Link
JP (1) JPS496880A (cg-RX-API-DMAC7.html)
AT (1) AT327989B (cg-RX-API-DMAC7.html)
CA (1) CA979122A (cg-RX-API-DMAC7.html)
CH (1) CH548109A (cg-RX-API-DMAC7.html)
DE (1) DE2213915A1 (cg-RX-API-DMAC7.html)
FR (1) FR2176661B1 (cg-RX-API-DMAC7.html)
GB (1) GB1397330A (cg-RX-API-DMAC7.html)
IT (1) IT982542B (cg-RX-API-DMAC7.html)
NL (1) NL7302989A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
GB2146174B (en) * 1983-09-06 1987-04-23 Gen Electric Hermetic power chip packages

Also Published As

Publication number Publication date
IT982542B (it) 1974-10-21
DE2213915A1 (de) 1973-10-04
AT327989B (de) 1976-02-25
JPS496880A (cg-RX-API-DMAC7.html) 1974-01-22
FR2176661B1 (cg-RX-API-DMAC7.html) 1977-12-30
FR2176661A1 (cg-RX-API-DMAC7.html) 1973-11-02
CH548109A (de) 1974-04-11
CA979122A (en) 1975-12-02
NL7302989A (cg-RX-API-DMAC7.html) 1973-09-25
ATA1012972A (de) 1975-05-15

Similar Documents

Publication Publication Date Title
CA1008167A (en) Encapsulation housing for electronic circuit boards or the like and method of encapsulating
EP0069901A3 (en) Current rectifier module
GB1207728A (en) Housing assembly for an electric circuit
GB1064886A (en) Improvements in or relating to electrical circuit assemblies
GB1478797A (en) Semiconductor arrangements
CA922026A (en) Method of making electrical contacts on the surface of a semiconductor device
GB1300881A (en) Improvements in or relating to stacked arrangements of semiconductor bodies
GB1294623A (en) Improvements in or relating to semiconductor components
FR2150488A1 (cg-RX-API-DMAC7.html)
GB1100737A (en) Semiconductor device junction stabilization
GB1397713A (en) Case for a plurality of semiconductor devices
GB1115302A (en) Method of mounting semiconductor devices
GB1329810A (en) Semiconductor device packaging
GB1044276A (en) Electrical semiconductor device
GB1011611A (en) Mounting means for semi-conductor devices
GB1286185A (en) Hermetically sealed electronic package with high current carrying conductor
GB1319573A (en) Semiconductor devices
CA803093A (en) Metallic contacts for semiconductor devices
CA859935A (en) Multilevel terminal metallurgy for semiconductor devices
CA858126A (en) Semiconductor device, method of manufacturing the same and circuit arrangement comprising such a semiconductor device
GB1353310A (en) Semiconductor device mounting arrangement
AU5468269A (en) Metallic contact and interconnection system for semiconductor devices
CA824339A (en) Pressure assembled semiconductor device using massive flexibly mounted terminals
GB1125418A (en) Semiconductor devices
GB990012A (en) A semi-conductor rectifier device

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee