NL7302989A - - Google Patents
Info
- Publication number
- NL7302989A NL7302989A NL7302989A NL7302989A NL7302989A NL 7302989 A NL7302989 A NL 7302989A NL 7302989 A NL7302989 A NL 7302989A NL 7302989 A NL7302989 A NL 7302989A NL 7302989 A NL7302989 A NL 7302989A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2213915A DE2213915A1 (de) | 1972-03-22 | 1972-03-22 | Gehaeuse fuer halbleitersysteme |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7302989A true NL7302989A (cg-RX-API-DMAC7.html) | 1973-09-25 |
Family
ID=5839779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7302989A NL7302989A (cg-RX-API-DMAC7.html) | 1972-03-22 | 1973-03-02 |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS496880A (cg-RX-API-DMAC7.html) |
| AT (1) | AT327989B (cg-RX-API-DMAC7.html) |
| CA (1) | CA979122A (cg-RX-API-DMAC7.html) |
| CH (1) | CH548109A (cg-RX-API-DMAC7.html) |
| DE (1) | DE2213915A1 (cg-RX-API-DMAC7.html) |
| FR (1) | FR2176661B1 (cg-RX-API-DMAC7.html) |
| GB (1) | GB1397330A (cg-RX-API-DMAC7.html) |
| IT (1) | IT982542B (cg-RX-API-DMAC7.html) |
| NL (1) | NL7302989A (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2439478A1 (fr) * | 1978-10-19 | 1980-05-16 | Cii Honeywell Bull | Boitier plat pour dispositifs a circuits integres |
| GB2146174B (en) * | 1983-09-06 | 1987-04-23 | Gen Electric | Hermetic power chip packages |
-
1972
- 1972-03-22 DE DE2213915A patent/DE2213915A1/de active Pending
- 1972-11-23 CH CH1708472A patent/CH548109A/xx not_active IP Right Cessation
- 1972-11-28 AT AT1012972A patent/AT327989B/de not_active IP Right Cessation
- 1972-12-18 FR FR7245013A patent/FR2176661B1/fr not_active Expired
- 1972-12-29 GB GB6005172A patent/GB1397330A/en not_active Expired
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1973
- 1973-03-02 NL NL7302989A patent/NL7302989A/xx unknown
- 1973-03-15 CA CA166,172A patent/CA979122A/en not_active Expired
- 1973-03-16 IT IT21712/73A patent/IT982542B/it active
- 1973-03-20 JP JP48031551A patent/JPS496880A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| IT982542B (it) | 1974-10-21 |
| DE2213915A1 (de) | 1973-10-04 |
| AT327989B (de) | 1976-02-25 |
| JPS496880A (cg-RX-API-DMAC7.html) | 1974-01-22 |
| FR2176661B1 (cg-RX-API-DMAC7.html) | 1977-12-30 |
| FR2176661A1 (cg-RX-API-DMAC7.html) | 1973-11-02 |
| CH548109A (de) | 1974-04-11 |
| GB1397330A (en) | 1975-06-11 |
| CA979122A (en) | 1975-12-02 |
| ATA1012972A (de) | 1975-05-15 |