GB1392125A - Mounting preformed circuits on preformed dielectric substrates - Google Patents

Mounting preformed circuits on preformed dielectric substrates

Info

Publication number
GB1392125A
GB1392125A GB3387972A GB3387972A GB1392125A GB 1392125 A GB1392125 A GB 1392125A GB 3387972 A GB3387972 A GB 3387972A GB 3387972 A GB3387972 A GB 3387972A GB 1392125 A GB1392125 A GB 1392125A
Authority
GB
United Kingdom
Prior art keywords
circuit
preformed
dielectric substrate
bonded
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3387972A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Buckbee Mears Co
Original Assignee
Buckbee Mears Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buckbee Mears Co filed Critical Buckbee Mears Co
Publication of GB1392125A publication Critical patent/GB1392125A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/05—Interconnection of layers the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
GB3387972A 1971-11-12 1972-07-20 Mounting preformed circuits on preformed dielectric substrates Expired GB1392125A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19814771A 1971-11-12 1971-11-12

Publications (1)

Publication Number Publication Date
GB1392125A true GB1392125A (en) 1975-04-30

Family

ID=22732180

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3387972A Expired GB1392125A (en) 1971-11-12 1972-07-20 Mounting preformed circuits on preformed dielectric substrates

Country Status (9)

Country Link
US (1) US3778899A (https=)
JP (1) JPS5547476B2 (https=)
BE (1) BE787386A (https=)
CA (1) CA980463A (https=)
DE (1) DE2240853A1 (https=)
FR (1) FR2159286A1 (https=)
GB (1) GB1392125A (https=)
IT (1) IT969963B (https=)
NL (1) NL7215259A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2411081A1 (fr) * 1977-12-08 1979-07-06 Crown Cork Japan Structure composite pouvant etre delaminee et procede de preparation

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838506A (en) * 1973-04-09 1974-10-01 Ibm Aluminum surface and treatment thereof to enhance adhesion in printed circuit laminates
US3960561A (en) * 1975-04-10 1976-06-01 International Business Machines Corporation Method for making electrical lead frame devices
US4127438A (en) * 1977-11-07 1978-11-28 International Business Machines Corporation Adhesion promoter for additively plated printed circuit boards
US4698275A (en) * 1983-11-04 1987-10-06 Augat Inc. Wire mat mateable with a circuit board
US4627162A (en) * 1983-11-04 1986-12-09 Augat Incorporated Method of producing a wired circuit board
US4648180A (en) * 1983-11-04 1987-03-10 Augat Inc. Method of producing a wired circuit board
US5250758A (en) * 1991-05-21 1993-10-05 Elf Technologies, Inc. Methods and systems of preparing extended length flexible harnesses
JPH07105420B2 (ja) * 1991-08-26 1995-11-13 ヒューズ・エアクラフト・カンパニー 成形された接点をもった電気接続
US5826329A (en) * 1995-12-19 1998-10-27 Ncr Corporation Method of making printed circuit board using thermal transfer techniques
US6085414A (en) * 1996-08-15 2000-07-11 Packard Hughes Interconnect Company Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom
US6723927B1 (en) * 2000-08-24 2004-04-20 High Connection Density, Inc. High-reliability interposer for low cost and high reliability applications
DE102014104510B4 (de) * 2014-03-31 2019-02-07 Gottfried Wilhelm Leibniz Universität Hannover Verfahren zum Fügen und Einrichtung zum Fügen einer Anordnung unter Verwendung des Verfahrens
CN109587938A (zh) * 2018-12-20 2019-04-05 瑞华高科技电子工业园(厦门)有限公司 一种超薄柔性线路板的加工方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2997521A (en) * 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly
US3414487A (en) * 1965-06-30 1968-12-03 Texas Instruments Inc Method of manufacturing printed circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2411081A1 (fr) * 1977-12-08 1979-07-06 Crown Cork Japan Structure composite pouvant etre delaminee et procede de preparation

Also Published As

Publication number Publication date
BE787386A (fr) 1972-12-01
CA980463A (en) 1975-12-23
JPS4855358A (https=) 1973-08-03
DE2240853A1 (de) 1973-05-17
JPS5547476B2 (https=) 1980-11-29
NL7215259A (https=) 1973-05-15
US3778899A (en) 1973-12-18
FR2159286A1 (https=) 1973-06-22
IT969963B (it) 1974-04-10

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee