GB1162823A - Improvements in Copper-Plastic Laminates - Google Patents

Improvements in Copper-Plastic Laminates

Info

Publication number
GB1162823A
GB1162823A GB3852166A GB3852166A GB1162823A GB 1162823 A GB1162823 A GB 1162823A GB 3852166 A GB3852166 A GB 3852166A GB 3852166 A GB3852166 A GB 3852166A GB 1162823 A GB1162823 A GB 1162823A
Authority
GB
United Kingdom
Prior art keywords
copper
layer
laminate
spraying
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3852166A
Inventor
Terrence Francis Origer
Herbert John Fick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schjeldahl Co G T
GT Schjeldahl Co
Original Assignee
Schjeldahl Co G T
GT Schjeldahl Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schjeldahl Co G T, GT Schjeldahl Co filed Critical Schjeldahl Co G T
Priority to GB3852166A priority Critical patent/GB1162823A/en
Publication of GB1162823A publication Critical patent/GB1162823A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

1,162,823. Laminated printed circuit. G. T. SCHJELDAHL CO. 27 Aug., 1966, No. 38521/66. Heading B5N. [Also in Division H1] In a laminate for use in forming printed circuits and comprising an insulating layer 10 of polyethylene terephthalate film and a layer 11 of copper bonded thereto, the surface of the copper layer facing the layer 10 is covered by a film 12 of gamma-aminopropyl triethoxysilane and the copper layer is etched to the desired pattern. The adhesive 13 used to unite the layers may be a polyester or epoxy resin. In one method of producing the laminate a copper foil from which the surface oxide film has been removed by immersion in and spraying with an ammonium persulphate solution is coated with gamma aminopropyl triethoxysilane or a solution thereof by spraying, dipping, or painting. The coating is dried before the copper foil is adhered to a substrate. A printed circuit is produced from the so formed laminate by conventional photo-resist and etching solution methods. The silane coating on the copper layer aids curing of the adhesive bonding the laminate layers and resists oxidation of the copper.
GB3852166A 1966-08-27 1966-08-27 Improvements in Copper-Plastic Laminates Expired GB1162823A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3852166A GB1162823A (en) 1966-08-27 1966-08-27 Improvements in Copper-Plastic Laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3852166A GB1162823A (en) 1966-08-27 1966-08-27 Improvements in Copper-Plastic Laminates

Publications (1)

Publication Number Publication Date
GB1162823A true GB1162823A (en) 1969-08-27

Family

ID=10404026

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3852166A Expired GB1162823A (en) 1966-08-27 1966-08-27 Improvements in Copper-Plastic Laminates

Country Status (1)

Country Link
GB (1) GB1162823A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0857402A1 (en) * 1996-08-23 1998-08-12 Gould Electronics Inc. High performance flexible laminate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0857402A1 (en) * 1996-08-23 1998-08-12 Gould Electronics Inc. High performance flexible laminate
EP0857402A4 (en) * 1996-08-23 2003-05-02 Ga Tek Inc High performance flexible laminate

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees