GB864873A - Improvements in or relating to the manufacture of materials for use in the production of printed circuits - Google Patents

Improvements in or relating to the manufacture of materials for use in the production of printed circuits

Info

Publication number
GB864873A
GB864873A GB1920558A GB1920558A GB864873A GB 864873 A GB864873 A GB 864873A GB 1920558 A GB1920558 A GB 1920558A GB 1920558 A GB1920558 A GB 1920558A GB 864873 A GB864873 A GB 864873A
Authority
GB
United Kingdom
Prior art keywords
solution
foil
sodium hydroxide
sodium
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1920558A
Inventor
Dennis Charles Lowe
Donald Lidgley
Edward Donnelly
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Formica International Ltd
Original Assignee
Formica International Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formica International Ltd filed Critical Formica International Ltd
Priority to GB1920558A priority Critical patent/GB864873A/en
Priority to FR845259A priority patent/FR1275231A/en
Publication of GB864873A publication Critical patent/GB864873A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

An adhesive composition used for a laminate (see Group VIII) is a mixture of a thermosetting resin and synthetic rubber. In the examples the adhesive is a solution in methyl-ethyl-ketone and diacetone alcohol of a mixture of a butadieneacrylonitrile copolymer and a cashew-phenol/aldehyde resin.ALSO:An electrically conducting metal sheet or foil, e.g. of copper, to be laminated to an electrically insulating material (see Group VIII) is treated to produce at least on the surface to be bonded a superficial oxidation to assist the bond, but insufficient to require for the removal of the visible part thereof from the insulating layer, after etching, an extension of the etching time sufficient to cause undercutting of the metal to be retained. The metal may be first cleaned by immersion in a solution of hydrochloric or sulphuric acid and a surface-active agent, and then oxidized by treatment with an oxidizing solution. In the examples, copper foil was immersed for two minutes at 75 DEG to 85 DEG C in a solution containing 48 g/l sodium chlorite, 6 g/l sodium hydroxide and an insignificant concentration of sodium chloride. It was then washed and dried and had a coating of 2.2 g. of copper oxide per square metre of foil. The specification gives ranges of concentration of 4 to 9 g/l for sodium hydroxide and 20 to 100 g/l for sodium chlorite; potassium hydroxide may be used in place of sodium hydroxide. The thickness of the oxide coating may be from 0.75 to 1.4 g/m2 of surface.
GB1920558A 1958-06-16 1958-06-16 Improvements in or relating to the manufacture of materials for use in the production of printed circuits Expired GB864873A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB1920558A GB864873A (en) 1958-06-16 1958-06-16 Improvements in or relating to the manufacture of materials for use in the production of printed circuits
FR845259A FR1275231A (en) 1958-06-16 1960-11-28 Manufacturing process of metallized insulating materials and their applications

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1920558A GB864873A (en) 1958-06-16 1958-06-16 Improvements in or relating to the manufacture of materials for use in the production of printed circuits

Publications (1)

Publication Number Publication Date
GB864873A true GB864873A (en) 1961-04-12

Family

ID=10125476

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1920558A Expired GB864873A (en) 1958-06-16 1958-06-16 Improvements in or relating to the manufacture of materials for use in the production of printed circuits

Country Status (1)

Country Link
GB (1) GB864873A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997042688A1 (en) * 1996-05-02 1997-11-13 Robert Bosch Gmbh Method of producing a commutator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997042688A1 (en) * 1996-05-02 1997-11-13 Robert Bosch Gmbh Method of producing a commutator

Similar Documents

Publication Publication Date Title
YU305375A (en) Process for the purification of the oxide layer from the metal surface like copper or brass by chemical pickling in acid solutions containing hydrogen peroxide
GB1392125A (en) Mounting preformed circuits on preformed dielectric substrates
GB864873A (en) Improvements in or relating to the manufacture of materials for use in the production of printed circuits
JPH05304361A (en) Processing of copper circuit of circuit board
US3258318A (en) Etched metal foil for electrolytic capacitors and the like consisting of silver-aluminum alloys
US2852421A (en) Adhesive coated metallic sheet and its method of manufacturing
JP2656622B2 (en) Bonding method between copper and resin
JPS5698495A (en) Surface treatment method of magnesium or its alloy
US2993847A (en) Aluminum treating process
US20080000552A1 (en) Process for increasing the adhesion of a metal surface to a polymer
GB1042380A (en) Deplating process
GB876858A (en) Improvements in or relating to the manufacture of printed circuits
GB719630A (en) Bonding rubber to metal
JP3237410B2 (en) Processing method of copper circuit of wiring board for inner layer
JPH073055A (en) Method for treating surface of polyimide film
US2680678A (en) Method of chemically polishing nickel
GB844776A (en) Improvements in or relating to methods of bonding metals to organic fluro-carbon plastic materials and articles made thereby
SU1207463A1 (en) Method of working bars of writing carbonate chalk
FR2119734A5 (en) Printed circuits - prodn by electrolytic engraving
GB1006287A (en) Improvements in or relating to manufacturing aluminium oxide films
JPS61250036A (en) Bonding of copper and resin
GB761647A (en) Improvements relating to metallic foil
GB835091A (en) Improved method of manufacture of capacitors
JPS63219588A (en) Surface oxidation treatment for copper
DE805537C (en) Process for the insulation of transformer and dynamo sheets