DE2240853A1 - Verfahren zum verbinden einer zur herstellung einer leiterplatte geeigneten metallschicht mit einer biegsamen dielektrischen unterlage - Google Patents
Verfahren zum verbinden einer zur herstellung einer leiterplatte geeigneten metallschicht mit einer biegsamen dielektrischen unterlageInfo
- Publication number
- DE2240853A1 DE2240853A1 DE2240853A DE2240853A DE2240853A1 DE 2240853 A1 DE2240853 A1 DE 2240853A1 DE 2240853 A DE2240853 A DE 2240853A DE 2240853 A DE2240853 A DE 2240853A DE 2240853 A1 DE2240853 A1 DE 2240853A1
- Authority
- DE
- Germany
- Prior art keywords
- metal layer
- base
- bath
- circuit board
- flexible dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims description 35
- 229910052751 metal Inorganic materials 0.000 title claims description 35
- 238000000034 method Methods 0.000 title claims description 15
- 238000004519 manufacturing process Methods 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 239000005708 Sodium hypochlorite Substances 0.000 claims description 3
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004160 Ammonium persulphate Substances 0.000 claims description 2
- 235000019395 ammonium persulphate Nutrition 0.000 claims description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 150000002483 hydrogen compounds Chemical class 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/05—Interconnection of layers the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19814771A | 1971-11-12 | 1971-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2240853A1 true DE2240853A1 (de) | 1973-05-17 |
Family
ID=22732180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2240853A Pending DE2240853A1 (de) | 1971-11-12 | 1972-08-19 | Verfahren zum verbinden einer zur herstellung einer leiterplatte geeigneten metallschicht mit einer biegsamen dielektrischen unterlage |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3778899A (https=) |
| JP (1) | JPS5547476B2 (https=) |
| BE (1) | BE787386A (https=) |
| CA (1) | CA980463A (https=) |
| DE (1) | DE2240853A1 (https=) |
| FR (1) | FR2159286A1 (https=) |
| GB (1) | GB1392125A (https=) |
| IT (1) | IT969963B (https=) |
| NL (1) | NL7215259A (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3838506A (en) * | 1973-04-09 | 1974-10-01 | Ibm | Aluminum surface and treatment thereof to enhance adhesion in printed circuit laminates |
| US3960561A (en) * | 1975-04-10 | 1976-06-01 | International Business Machines Corporation | Method for making electrical lead frame devices |
| US4127438A (en) * | 1977-11-07 | 1978-11-28 | International Business Machines Corporation | Adhesion promoter for additively plated printed circuit boards |
| JPS5480383A (en) * | 1977-12-08 | 1979-06-27 | Crown Cork Japan | Releasable adhesion structure |
| US4698275A (en) * | 1983-11-04 | 1987-10-06 | Augat Inc. | Wire mat mateable with a circuit board |
| US4627162A (en) * | 1983-11-04 | 1986-12-09 | Augat Incorporated | Method of producing a wired circuit board |
| US4648180A (en) * | 1983-11-04 | 1987-03-10 | Augat Inc. | Method of producing a wired circuit board |
| US5250758A (en) * | 1991-05-21 | 1993-10-05 | Elf Technologies, Inc. | Methods and systems of preparing extended length flexible harnesses |
| JPH07105420B2 (ja) * | 1991-08-26 | 1995-11-13 | ヒューズ・エアクラフト・カンパニー | 成形された接点をもった電気接続 |
| US5826329A (en) * | 1995-12-19 | 1998-10-27 | Ncr Corporation | Method of making printed circuit board using thermal transfer techniques |
| US6085414A (en) * | 1996-08-15 | 2000-07-11 | Packard Hughes Interconnect Company | Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom |
| US6723927B1 (en) * | 2000-08-24 | 2004-04-20 | High Connection Density, Inc. | High-reliability interposer for low cost and high reliability applications |
| DE102014104510B4 (de) * | 2014-03-31 | 2019-02-07 | Gottfried Wilhelm Leibniz Universität Hannover | Verfahren zum Fügen und Einrichtung zum Fügen einer Anordnung unter Verwendung des Verfahrens |
| CN109587938A (zh) * | 2018-12-20 | 2019-04-05 | 瑞华高科技电子工业园(厦门)有限公司 | 一种超薄柔性线路板的加工方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2997521A (en) * | 1960-04-11 | 1961-08-22 | Sanders Associates Inc | Insulated electric circuit assembly |
| US3414487A (en) * | 1965-06-30 | 1968-12-03 | Texas Instruments Inc | Method of manufacturing printed circuits |
-
1971
- 1971-11-12 US US00198147A patent/US3778899A/en not_active Expired - Lifetime
-
1972
- 1972-06-06 CA CA143,956A patent/CA980463A/en not_active Expired
- 1972-07-20 GB GB3387972A patent/GB1392125A/en not_active Expired
- 1972-08-09 BE BE787386A patent/BE787386A/xx unknown
- 1972-08-19 DE DE2240853A patent/DE2240853A1/de active Pending
- 1972-10-11 JP JP10119172A patent/JPS5547476B2/ja not_active Expired
- 1972-10-26 IT IT30989/72A patent/IT969963B/it active
- 1972-11-02 FR FR7238841A patent/FR2159286A1/fr not_active Withdrawn
- 1972-11-10 NL NL7215259A patent/NL7215259A/xx not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| BE787386A (fr) | 1972-12-01 |
| CA980463A (en) | 1975-12-23 |
| JPS4855358A (https=) | 1973-08-03 |
| GB1392125A (en) | 1975-04-30 |
| JPS5547476B2 (https=) | 1980-11-29 |
| NL7215259A (https=) | 1973-05-15 |
| US3778899A (en) | 1973-12-18 |
| FR2159286A1 (https=) | 1973-06-22 |
| IT969963B (it) | 1974-04-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OD | Request for examination | ||
| OHW | Rejection |