JPS6439794A - Resin adhesive copper foil, printed wiring board using resin adhesive copper foil and film carrier for semiconductor device - Google Patents
Resin adhesive copper foil, printed wiring board using resin adhesive copper foil and film carrier for semiconductor deviceInfo
- Publication number
- JPS6439794A JPS6439794A JP19690887A JP19690887A JPS6439794A JP S6439794 A JPS6439794 A JP S6439794A JP 19690887 A JP19690887 A JP 19690887A JP 19690887 A JP19690887 A JP 19690887A JP S6439794 A JPS6439794 A JP S6439794A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- resin adhesive
- adhesive copper
- alloy layer
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To improve the adhesion of a cooper foil with a resin and to prevent the generation of a migration by a method wherein an Sn-Ni alloy layer or an Sn-Co alloy layer is provided on the surface, which comes into contact with an insulative resin substrate, of the copper foil. CONSTITUTION:A 35mum thick rolled copper foil, which is ready-subjected to roughened treatment on one side, is used and a 0.2mum Sn-Ni alloy layer is formed on the side of the roughened surface of the copper foil from a fluoride bath of pH 2.5 at a bath temperature of 60 deg.C containing 50g/l of an SnCl, 250g/l of an NiCl and 40g/l of an acid ammonium fluoride. The copper foil 1 with the alloy layer 2 formed thereon in such a way is fixed by heating and pressure on a paper phenol substrate 4 using a bonding agent 3. A resin adhesive copper foil obtained in such a way is used as a printed-wiring board or a film carrier for a semiconductor device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19690887A JPS6439794A (en) | 1987-08-06 | 1987-08-06 | Resin adhesive copper foil, printed wiring board using resin adhesive copper foil and film carrier for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19690887A JPS6439794A (en) | 1987-08-06 | 1987-08-06 | Resin adhesive copper foil, printed wiring board using resin adhesive copper foil and film carrier for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6439794A true JPS6439794A (en) | 1989-02-10 |
Family
ID=16365651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19690887A Pending JPS6439794A (en) | 1987-08-06 | 1987-08-06 | Resin adhesive copper foil, printed wiring board using resin adhesive copper foil and film carrier for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6439794A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6316288B1 (en) * | 1997-03-21 | 2001-11-13 | Seiko Epson Corporation | Semiconductor device and methods of manufacturing film camera tape |
-
1987
- 1987-08-06 JP JP19690887A patent/JPS6439794A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6316288B1 (en) * | 1997-03-21 | 2001-11-13 | Seiko Epson Corporation | Semiconductor device and methods of manufacturing film camera tape |
US6627994B2 (en) | 1997-03-21 | 2003-09-30 | Seiko Epson Corporation | Semiconductor device and film carrier tape |
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