JPS6439794A - Resin adhesive copper foil, printed wiring board using resin adhesive copper foil and film carrier for semiconductor device - Google Patents

Resin adhesive copper foil, printed wiring board using resin adhesive copper foil and film carrier for semiconductor device

Info

Publication number
JPS6439794A
JPS6439794A JP19690887A JP19690887A JPS6439794A JP S6439794 A JPS6439794 A JP S6439794A JP 19690887 A JP19690887 A JP 19690887A JP 19690887 A JP19690887 A JP 19690887A JP S6439794 A JPS6439794 A JP S6439794A
Authority
JP
Japan
Prior art keywords
copper foil
resin adhesive
adhesive copper
alloy layer
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19690887A
Other languages
Japanese (ja)
Inventor
Osamu Yoshioka
Ryozo Yamagishi
Norio Okabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP19690887A priority Critical patent/JPS6439794A/en
Publication of JPS6439794A publication Critical patent/JPS6439794A/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve the adhesion of a cooper foil with a resin and to prevent the generation of a migration by a method wherein an Sn-Ni alloy layer or an Sn-Co alloy layer is provided on the surface, which comes into contact with an insulative resin substrate, of the copper foil. CONSTITUTION:A 35mum thick rolled copper foil, which is ready-subjected to roughened treatment on one side, is used and a 0.2mum Sn-Ni alloy layer is formed on the side of the roughened surface of the copper foil from a fluoride bath of pH 2.5 at a bath temperature of 60 deg.C containing 50g/l of an SnCl, 250g/l of an NiCl and 40g/l of an acid ammonium fluoride. The copper foil 1 with the alloy layer 2 formed thereon in such a way is fixed by heating and pressure on a paper phenol substrate 4 using a bonding agent 3. A resin adhesive copper foil obtained in such a way is used as a printed-wiring board or a film carrier for a semiconductor device.
JP19690887A 1987-08-06 1987-08-06 Resin adhesive copper foil, printed wiring board using resin adhesive copper foil and film carrier for semiconductor device Pending JPS6439794A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19690887A JPS6439794A (en) 1987-08-06 1987-08-06 Resin adhesive copper foil, printed wiring board using resin adhesive copper foil and film carrier for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19690887A JPS6439794A (en) 1987-08-06 1987-08-06 Resin adhesive copper foil, printed wiring board using resin adhesive copper foil and film carrier for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6439794A true JPS6439794A (en) 1989-02-10

Family

ID=16365651

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19690887A Pending JPS6439794A (en) 1987-08-06 1987-08-06 Resin adhesive copper foil, printed wiring board using resin adhesive copper foil and film carrier for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6439794A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316288B1 (en) * 1997-03-21 2001-11-13 Seiko Epson Corporation Semiconductor device and methods of manufacturing film camera tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316288B1 (en) * 1997-03-21 2001-11-13 Seiko Epson Corporation Semiconductor device and methods of manufacturing film camera tape
US6627994B2 (en) 1997-03-21 2003-09-30 Seiko Epson Corporation Semiconductor device and film carrier tape

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