CA1099031A - Process and article for printed circuit board manufacture - Google Patents
Process and article for printed circuit board manufactureInfo
- Publication number
- CA1099031A CA1099031A CA299,132A CA299132A CA1099031A CA 1099031 A CA1099031 A CA 1099031A CA 299132 A CA299132 A CA 299132A CA 1099031 A CA1099031 A CA 1099031A
- Authority
- CA
- Canada
- Prior art keywords
- article
- copper
- copper layer
- contacting
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 239000003082 abrasive agent Substances 0.000 claims abstract description 10
- 239000007800 oxidant agent Substances 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 15
- 230000000873 masking effect Effects 0.000 claims description 14
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims description 4
- 229960002218 sodium chlorite Drugs 0.000 claims description 4
- 239000001488 sodium phosphate Substances 0.000 claims description 4
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 229910000406 trisodium phosphate Inorganic materials 0.000 claims description 3
- 235000019801 trisodium phosphate Nutrition 0.000 claims description 3
- 238000000354 decomposition reaction Methods 0.000 claims description 2
- 239000000428 dust Substances 0.000 claims description 2
- 235000013312 flour Nutrition 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 239000012858 resilient material Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 1
- 239000000725 suspension Substances 0.000 claims 1
- 238000011282 treatment Methods 0.000 description 9
- 230000001590 oxidative effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000012876 carrier material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000007900 aqueous suspension Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- RNLHVODSMDJCBR-VURMDHGXSA-N (z)-3-methyl-5-(2,2,3-trimethylcyclopent-3-en-1-yl)pent-4-en-2-ol Chemical compound CC(O)C(C)\C=C/C1CC=C(C)C1(C)C RNLHVODSMDJCBR-VURMDHGXSA-N 0.000 description 1
- 208000035874 Excoriation Diseases 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical compound ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 235000011008 sodium phosphates Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
UNITED STATES PATENT APPLICATION
OF: Fritz Stahl FOR: PROCESS AND ARTICLE FOR PRINTED
CIRCUIT BOARD MANUFACTURE
ABSTRACT OF THE DISCLOSURE
There are provided an article and process useful in the production of printed circuit boards, the-process compris-ing providing an article comprising an insulating base and a layer of copper thereon, and microroughening the surface of said copper layer by contacting with a chemical oxidizing agent or a finely divided abrasive material, or both. Articles made in accordance with this process are also provided.
OF: Fritz Stahl FOR: PROCESS AND ARTICLE FOR PRINTED
CIRCUIT BOARD MANUFACTURE
ABSTRACT OF THE DISCLOSURE
There are provided an article and process useful in the production of printed circuit boards, the-process compris-ing providing an article comprising an insulating base and a layer of copper thereon, and microroughening the surface of said copper layer by contacting with a chemical oxidizing agent or a finely divided abrasive material, or both. Articles made in accordance with this process are also provided.
Description
1~9~31 i-i .
. :
. ~ . ` .
'' ''', ' ' ' . . . . .
. ' ` `" , , ,.i - 1. j ! ~
~; :
18~
19'!¦ This invention relates to the formation of artic~e.
which are useful in the production of printed circuit boards 211 in accordance with the so-called "build-up" method. More 221 particularly, this invention provides an insulating article 231 having a layer of copper, the surface of which has been micro-.
24ll roughened to improve the adhesion of masking materials, and 25~1 which optionally comprise an oxide layer which protects tli~e 26 1¦ microroughened surface during storage and shipment. .
27 i1 . ' :
281¦ . B~CKGROUND OF T~ y~NTlo~
2911 :
30j The production of printed circuit boards by the so-j Il .
1,.
1~ ~(;i996?3~
GPC-23/2 l 1 called "build-up" method is known in the art. In this method,
. :
. ~ . ` .
'' ''', ' ' ' . . . . .
. ' ` `" , , ,.i - 1. j ! ~
~; :
18~
19'!¦ This invention relates to the formation of artic~e.
which are useful in the production of printed circuit boards 211 in accordance with the so-called "build-up" method. More 221 particularly, this invention provides an insulating article 231 having a layer of copper, the surface of which has been micro-.
24ll roughened to improve the adhesion of masking materials, and 25~1 which optionally comprise an oxide layer which protects tli~e 26 1¦ microroughened surface during storage and shipment. .
27 i1 . ' :
281¦ . B~CKGROUND OF T~ y~NTlo~
2911 :
30j The production of printed circuit boards by the so-j Il .
1,.
1~ ~(;i996?3~
GPC-23/2 l 1 called "build-up" method is known in the art. In this method,
2 an insulating carrier or base material, e.g., a molded laminate,
3 is provided with a thin layer of copper having a thickness of,
4 for example, from 0.5 to 8 microns, preferably from 1 to 3 . 5 microns. After the application of a layer of masking material on selected areas of the copper surface, the desired pattern 7 of conductor lines is built up on the unmasked areas by the 8 galvanic or electrolytic deposition of copper and, if desired, 9 other metals; the thin layer of copper acts as the current supply. After electrolytic deposition, the layer of masking 11 material is removed and the thin layer of copper in the pre-12 viously masked areas, which are now exposed, is treated to de-13 compose it.
The initial layer of copper may be applied to the .16 surface of the carrier material by known methods, such as by 17 pressing a preformed copper foil thereon, preferably during 1.
18 the production of the carrier material itself. Alternatively, 19 the copper may be applied by means of electroless metal deposi-tion, vapor deposition or other known methods. In order to 21 avoid deep etching of the conductor lines, which is especially 22 undesirable in the case of narrow conductor lines, the layer 23 of copper on the other areas must have a very small thickness.
24 Such minute thicknesses also have a favorable effect upon the etching step with respect to lowering manufacturing costs.
26 .
27 In order to satisfactorily achieve better a&esion, 28 the copper surface and masking material, e.g., a masking ink 29 applied by screen printing, a photographic printing varnish or liquid-sensitive dry film, and moreover to avoid the forma-~'~9C~31 tion of blisters during electrolytic deposition and the like, it has been proposed to chemically etch the copper surface and thus microroughen it. Such prior art methods have a number of disadvantages, however, ranging from their great complexity and poor economy to insufficient reliability. In addition, these methods are not practical in the case of thin copper layers.
The present invention provides a method of manufacture wherein the reliability of adhesion of the masking layer to the copper surface is assured, and the formation of blisters is avoided; at the same time, the surface of the copper layer is protected. Unlike prior art methods, all of this is accomplished without decomposing ; the copper layer.
_ESCRIPTION OF THE_INVENTION
In its broadest aspects, this invention provides a method for preparing an article useful in the production of printed circuit boards, the article comprising an insulating base and a layer of copper thereon, the improvement for increasing the adhesion of a masking material to the copper layer comprising microroughening the surface of the copper layer without decomposing it by contacting with (i) a chemical oxidizing agent, or (ii) a finely divided abrasive material, or (iii) both of the foregoing, to obtain the article having a microroughened copper surface capable of improved adhesion to a masking material.
mb/~ 3 -~ (~996~31 This invention also provides articles useful in the production of printed circuit boards, each article comprising an insulating base and a layer of copper thereon which has been microroughened chemically without decomposition by contacting with an oxidizing agent or mechanically by contacting with a finely divided abrasive material, or both the copper layer being capable of improved adhesion to a masking material.
In accordance with this invention, the oxidizing and mechanical treatments may be used individually, or they may be used in combination in successive steps or simultaneously. When both treatments are used in succession, it is preferred that the oxidizing treatment follow the mechanical abrasion treatment, but this is not critical and the reverse sequence may also be employed.
The oxidizing treatment also results in the formation of a protective film of oxide on the surface of the copper layer, which protects said surface against mechanical damage, fingerprints, and the like, during further processing. The article protected by this oxidized layer may thus be stored as such without danger for prolonged periods of time, or it may be used immediately by applying a layer of masking material. The masking material adheres reliably to the copper surface oretreated in accordance with this invention and shows no tendency toward the formation of blisters.
If desired, the oxide layer may be removed later mb/~
.
.. '. ~
' ', .
`` f . Il ~903~
l on during processing, e.g., by immersion in dilute sulfuric 2 acid, or by the use of conventional oxide-cleaning techniques.
4 DESCRIPTION OF ~IE PREFERRED EMBODIMENTS
6 For the mechanical treatment, the carrier material having a thin layer of copper thereon is fed between a pair, 8 preferably a plurality of pairs of rollers, the rollers 9 having been provided with a coating of rubber or other suitable lO resilient material. At the same time, an aqueous suspension ll of finely divided material, such as quartz flour or glass dust, 12 is fed to the rollers or to the copper surface. The micro-13 roughening is achieved by the pressing of the f ~ vided 14 material against the copper sur ace. After mi~roroughening, 15 the finely divided abrasive material is cleaned\~rom the copper ~ -16 surface, e.g., by flushing with water at high pressure.
l?
18 For the chemical treatment, an aqueous solution l9 comprising sodium chlorite, trisodium phosphate and sodium hydroxide is preferred. Such solutions may also contain con-21 ventional additives, such as wetting agents and the like. A
22 specific example of a suitable oxidizing solution consists 23 of, per liter, 160 grams of sodium chlorite, lO grams of tri-24 sodium phosphate and lO grams of sodium hydroxide, the balance being water, and preferably ~istilled water.
27 A suitable commercially available product for the (tr~O~ r~
B 28 oxidizing treatment is "Ebanol", manufacture by Enthone, Inc., West Haven, Connecticut.
. .
~ - 5 -''': ' ' .
, - ~
I (~99V31 1 It is especially preferred to combine the chcmical 2 and mechanical treatments, and to add the solution of oxidiæing 3 agent to an aqueous suspension of the finely divided abrasive material.
" 5 6 Other modifications and variations are possible in 7 the light of the above disclosure. It is to be understood, therefore, that changes may be made in the particular embodi-. 9 ments described herein which are within the full intended scope of the invention as defined in the appended claims.
~0
The initial layer of copper may be applied to the .16 surface of the carrier material by known methods, such as by 17 pressing a preformed copper foil thereon, preferably during 1.
18 the production of the carrier material itself. Alternatively, 19 the copper may be applied by means of electroless metal deposi-tion, vapor deposition or other known methods. In order to 21 avoid deep etching of the conductor lines, which is especially 22 undesirable in the case of narrow conductor lines, the layer 23 of copper on the other areas must have a very small thickness.
24 Such minute thicknesses also have a favorable effect upon the etching step with respect to lowering manufacturing costs.
26 .
27 In order to satisfactorily achieve better a&esion, 28 the copper surface and masking material, e.g., a masking ink 29 applied by screen printing, a photographic printing varnish or liquid-sensitive dry film, and moreover to avoid the forma-~'~9C~31 tion of blisters during electrolytic deposition and the like, it has been proposed to chemically etch the copper surface and thus microroughen it. Such prior art methods have a number of disadvantages, however, ranging from their great complexity and poor economy to insufficient reliability. In addition, these methods are not practical in the case of thin copper layers.
The present invention provides a method of manufacture wherein the reliability of adhesion of the masking layer to the copper surface is assured, and the formation of blisters is avoided; at the same time, the surface of the copper layer is protected. Unlike prior art methods, all of this is accomplished without decomposing ; the copper layer.
_ESCRIPTION OF THE_INVENTION
In its broadest aspects, this invention provides a method for preparing an article useful in the production of printed circuit boards, the article comprising an insulating base and a layer of copper thereon, the improvement for increasing the adhesion of a masking material to the copper layer comprising microroughening the surface of the copper layer without decomposing it by contacting with (i) a chemical oxidizing agent, or (ii) a finely divided abrasive material, or (iii) both of the foregoing, to obtain the article having a microroughened copper surface capable of improved adhesion to a masking material.
mb/~ 3 -~ (~996~31 This invention also provides articles useful in the production of printed circuit boards, each article comprising an insulating base and a layer of copper thereon which has been microroughened chemically without decomposition by contacting with an oxidizing agent or mechanically by contacting with a finely divided abrasive material, or both the copper layer being capable of improved adhesion to a masking material.
In accordance with this invention, the oxidizing and mechanical treatments may be used individually, or they may be used in combination in successive steps or simultaneously. When both treatments are used in succession, it is preferred that the oxidizing treatment follow the mechanical abrasion treatment, but this is not critical and the reverse sequence may also be employed.
The oxidizing treatment also results in the formation of a protective film of oxide on the surface of the copper layer, which protects said surface against mechanical damage, fingerprints, and the like, during further processing. The article protected by this oxidized layer may thus be stored as such without danger for prolonged periods of time, or it may be used immediately by applying a layer of masking material. The masking material adheres reliably to the copper surface oretreated in accordance with this invention and shows no tendency toward the formation of blisters.
If desired, the oxide layer may be removed later mb/~
.
.. '. ~
' ', .
`` f . Il ~903~
l on during processing, e.g., by immersion in dilute sulfuric 2 acid, or by the use of conventional oxide-cleaning techniques.
4 DESCRIPTION OF ~IE PREFERRED EMBODIMENTS
6 For the mechanical treatment, the carrier material having a thin layer of copper thereon is fed between a pair, 8 preferably a plurality of pairs of rollers, the rollers 9 having been provided with a coating of rubber or other suitable lO resilient material. At the same time, an aqueous suspension ll of finely divided material, such as quartz flour or glass dust, 12 is fed to the rollers or to the copper surface. The micro-13 roughening is achieved by the pressing of the f ~ vided 14 material against the copper sur ace. After mi~roroughening, 15 the finely divided abrasive material is cleaned\~rom the copper ~ -16 surface, e.g., by flushing with water at high pressure.
l?
18 For the chemical treatment, an aqueous solution l9 comprising sodium chlorite, trisodium phosphate and sodium hydroxide is preferred. Such solutions may also contain con-21 ventional additives, such as wetting agents and the like. A
22 specific example of a suitable oxidizing solution consists 23 of, per liter, 160 grams of sodium chlorite, lO grams of tri-24 sodium phosphate and lO grams of sodium hydroxide, the balance being water, and preferably ~istilled water.
27 A suitable commercially available product for the (tr~O~ r~
B 28 oxidizing treatment is "Ebanol", manufacture by Enthone, Inc., West Haven, Connecticut.
. .
~ - 5 -''': ' ' .
, - ~
I (~99V31 1 It is especially preferred to combine the chcmical 2 and mechanical treatments, and to add the solution of oxidiæing 3 agent to an aqueous suspension of the finely divided abrasive material.
" 5 6 Other modifications and variations are possible in 7 the light of the above disclosure. It is to be understood, therefore, that changes may be made in the particular embodi-. 9 ments described herein which are within the full intended scope of the invention as defined in the appended claims.
~0
Claims (13)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. In a method for preparing an article useful in the production of printed circuit boards, said article comprising an insulating base and a layer of copper thereon, the improvement for increasing the adhesion of a masking material to said copper layer comprising microroughening the surface of said copper layer without decomposing it by contacting with (i) a chemical oxidizing agent, or (ii) a finely divided abrasive material, or (iii) both of the foregoing, to obtain said article having a microroughened copper surface capable of improved adhesion to a masking material.
2. A method as defined in Claim 1 in which the surface of said copper layer is microroughened by contacting with (i) a chemical oxidizing agent.
3. A method as defined in Claim 2 in which said oxidizing agent comprises an aqueous solution of sodium chlorite, trisodium phosphate and sodium hydroxide.
4. A method as defined in Claim 3 in which said aqueous solution comprising, per liter, 160 grams of sodium chlorite, 10 grams of trisodium phosphate and 10 grams of sodium hydroxide, the balance comprising water.
5. A method as defined in Claim 1 in which the surface of said copper layer is microroughened by contacting with (ii) a finely divided abrasive material.
6. A method as defined in Claim 5 in which said contacting is carried out by feeding said article from step (a) through one or more pairs of rollers under pressure together with said finely divided abrasive material in suspension in water.
7. A method as defined in Claim 6 in which said finely divided abrasive material is selected from among quartz flour, glass dust, or a mixture thereof.
8. A method as defined in Claim 6 in which said rollers comprise a resilient material.
9. A method as defined in Claim 1 wherein said copper layer is contacted with (i) and (ii) in succession.
10. A method as defined in Claim 1 wherein said copper layer is contacted with (i) and (ii) simultaneously.
11. An article useful in the production of printed circuit boards, said article comprising an insulating base and a layer of copper thereon which has been microroughened chemically without decomposition by contacting with an oxidizing agent or mechanically by contacting with a finely divided abrasive material, or both, said copper layer being capable of improved adhesion to a masking material.
12. An article as defined in Claim 11 in which said copper layer has a thickness of from 0.5 to 8 microns.
13. An article as defined in Claim 12 in which the copper layer has a thickness of from 1 to 3 microns.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP2713391.1 | 1977-03-23 | ||
| DE2713391A DE2713391C3 (en) | 1977-03-23 | 1977-03-23 | Process for the production of a carrier material for printed circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1099031A true CA1099031A (en) | 1981-04-07 |
Family
ID=6004742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA299,132A Expired CA1099031A (en) | 1977-03-23 | 1978-03-17 | Process and article for printed circuit board manufacture |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS53147265A (en) |
| AT (1) | AT379279B (en) |
| AU (1) | AU516016B2 (en) |
| CA (1) | CA1099031A (en) |
| DE (1) | DE2713391C3 (en) |
| FR (1) | FR2385192A1 (en) |
| GB (1) | GB1588998A (en) |
| IT (1) | IT7848565A0 (en) |
| NL (1) | NL180163C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0117258B1 (en) * | 1983-02-23 | 1987-05-20 | Ibm Deutschland Gmbh | Process for the production of metallic layers adhering to plastic supports |
| JPS59227188A (en) * | 1983-06-07 | 1984-12-20 | 松下電器産業株式会社 | Printed board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2997521A (en) * | 1960-04-11 | 1961-08-22 | Sanders Associates Inc | Insulated electric circuit assembly |
| US3481777A (en) * | 1967-02-17 | 1969-12-02 | Ibm | Electroless coating method for making printed circuits |
-
1977
- 1977-03-23 DE DE2713391A patent/DE2713391C3/en not_active Expired
-
1978
- 1978-03-17 CA CA299,132A patent/CA1099031A/en not_active Expired
- 1978-03-20 GB GB10853/78A patent/GB1588998A/en not_active Expired
- 1978-03-22 AT AT0205078A patent/AT379279B/en not_active IP Right Cessation
- 1978-03-22 NL NLAANVRAGE7803106,A patent/NL180163C/en not_active IP Right Cessation
- 1978-03-23 FR FR7808487A patent/FR2385192A1/en active Granted
- 1978-03-23 JP JP3401678A patent/JPS53147265A/en active Pending
- 1978-03-23 IT IT7848565A patent/IT7848565A0/en unknown
- 1978-04-03 AU AU34697/78A patent/AU516016B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| AT379279B (en) | 1985-12-10 |
| AU516016B2 (en) | 1981-05-14 |
| NL180163B (en) | 1986-08-01 |
| DE2713391B2 (en) | 1979-06-28 |
| FR2385192B1 (en) | 1980-10-17 |
| GB1588998A (en) | 1981-05-07 |
| IT7848565A0 (en) | 1978-03-23 |
| DE2713391C3 (en) | 1980-03-06 |
| FR2385192A1 (en) | 1978-10-20 |
| JPS53147265A (en) | 1978-12-21 |
| NL7803106A (en) | 1978-09-26 |
| NL180163C (en) | 1987-01-02 |
| AU3469778A (en) | 1979-10-11 |
| DE2713391A1 (en) | 1978-09-28 |
| ATA205078A (en) | 1985-04-15 |
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