ATA205078A - METHOD FOR PRODUCING A SUPPORT MATERIAL EQUIPPED WITH A THIN COPPER LAYER FOR PRODUCING PRINTED CIRCUITS - Google Patents

METHOD FOR PRODUCING A SUPPORT MATERIAL EQUIPPED WITH A THIN COPPER LAYER FOR PRODUCING PRINTED CIRCUITS

Info

Publication number
ATA205078A
ATA205078A AT0205078A AT205078A ATA205078A AT A205078 A ATA205078 A AT A205078A AT 0205078 A AT0205078 A AT 0205078A AT 205078 A AT205078 A AT 205078A AT A205078 A ATA205078 A AT A205078A
Authority
AT
Austria
Prior art keywords
producing
support material
copper layer
thin copper
printed circuits
Prior art date
Application number
AT0205078A
Other languages
German (de)
Other versions
AT379279B (en
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of ATA205078A publication Critical patent/ATA205078A/en
Application granted granted Critical
Publication of AT379279B publication Critical patent/AT379279B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • ing And Chemical Polishing (AREA)
AT0205078A 1977-03-23 1978-03-22 METHOD FOR PRODUCING A SUPPORT MATERIAL EQUIPPED WITH A THIN COPPER LAYER FOR PRODUCING PRINTED CIRCUITS AT379279B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2713391A DE2713391C3 (en) 1977-03-23 1977-03-23 Process for the production of a carrier material for printed circuits

Publications (2)

Publication Number Publication Date
ATA205078A true ATA205078A (en) 1985-04-15
AT379279B AT379279B (en) 1985-12-10

Family

ID=6004742

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0205078A AT379279B (en) 1977-03-23 1978-03-22 METHOD FOR PRODUCING A SUPPORT MATERIAL EQUIPPED WITH A THIN COPPER LAYER FOR PRODUCING PRINTED CIRCUITS

Country Status (9)

Country Link
JP (1) JPS53147265A (en)
AT (1) AT379279B (en)
AU (1) AU516016B2 (en)
CA (1) CA1099031A (en)
DE (1) DE2713391C3 (en)
FR (1) FR2385192A1 (en)
GB (1) GB1588998A (en)
IT (1) IT7848565A0 (en)
NL (1) NL180163C (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117258B1 (en) * 1983-02-23 1987-05-20 Ibm Deutschland Gmbh Process for the production of metallic layers adhering to plastic supports
JPS59227188A (en) * 1983-06-07 1984-12-20 松下電器産業株式会社 Printed board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2997521A (en) * 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly
US3481777A (en) * 1967-02-17 1969-12-02 Ibm Electroless coating method for making printed circuits

Also Published As

Publication number Publication date
AT379279B (en) 1985-12-10
AU516016B2 (en) 1981-05-14
NL180163B (en) 1986-08-01
DE2713391B2 (en) 1979-06-28
FR2385192B1 (en) 1980-10-17
GB1588998A (en) 1981-05-07
IT7848565A0 (en) 1978-03-23
DE2713391C3 (en) 1980-03-06
FR2385192A1 (en) 1978-10-20
JPS53147265A (en) 1978-12-21
NL7803106A (en) 1978-09-26
NL180163C (en) 1987-01-02
AU3469778A (en) 1979-10-11
DE2713391A1 (en) 1978-09-28
CA1099031A (en) 1981-04-07

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee