IT7848565A0 - PROCESS AND OBJECT FOR THE MANUFACTURE OF PRINTED CIRCUIT DIAGRAM - Google Patents

PROCESS AND OBJECT FOR THE MANUFACTURE OF PRINTED CIRCUIT DIAGRAM

Info

Publication number
IT7848565A0
IT7848565A0 IT7848565A IT4856578A IT7848565A0 IT 7848565 A0 IT7848565 A0 IT 7848565A0 IT 7848565 A IT7848565 A IT 7848565A IT 4856578 A IT4856578 A IT 4856578A IT 7848565 A0 IT7848565 A0 IT 7848565A0
Authority
IT
Italy
Prior art keywords
manufacture
printed circuit
circuit diagram
printed
diagram
Prior art date
Application number
IT7848565A
Other languages
Italian (it)
Inventor
Fritz Stahl
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of IT7848565A0 publication Critical patent/IT7848565A0/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
IT7848565A 1977-03-23 1978-03-23 PROCESS AND OBJECT FOR THE MANUFACTURE OF PRINTED CIRCUIT DIAGRAM IT7848565A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2713391A DE2713391C3 (en) 1977-03-23 1977-03-23 Process for the production of a carrier material for printed circuits

Publications (1)

Publication Number Publication Date
IT7848565A0 true IT7848565A0 (en) 1978-03-23

Family

ID=6004742

Family Applications (1)

Application Number Title Priority Date Filing Date
IT7848565A IT7848565A0 (en) 1977-03-23 1978-03-23 PROCESS AND OBJECT FOR THE MANUFACTURE OF PRINTED CIRCUIT DIAGRAM

Country Status (9)

Country Link
JP (1) JPS53147265A (en)
AT (1) AT379279B (en)
AU (1) AU516016B2 (en)
CA (1) CA1099031A (en)
DE (1) DE2713391C3 (en)
FR (1) FR2385192A1 (en)
GB (1) GB1588998A (en)
IT (1) IT7848565A0 (en)
NL (1) NL180163C (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3371734D1 (en) * 1983-02-23 1987-06-25 Ibm Deutschland Process for the production of metallic layers adhering to plastic supports
JPS59227188A (en) * 1983-06-07 1984-12-20 松下電器産業株式会社 Printed board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2997521A (en) * 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly
US3481777A (en) * 1967-02-17 1969-12-02 Ibm Electroless coating method for making printed circuits

Also Published As

Publication number Publication date
NL7803106A (en) 1978-09-26
DE2713391C3 (en) 1980-03-06
JPS53147265A (en) 1978-12-21
NL180163C (en) 1987-01-02
AU3469778A (en) 1979-10-11
GB1588998A (en) 1981-05-07
FR2385192B1 (en) 1980-10-17
NL180163B (en) 1986-08-01
DE2713391B2 (en) 1979-06-28
FR2385192A1 (en) 1978-10-20
DE2713391A1 (en) 1978-09-28
AT379279B (en) 1985-12-10
CA1099031A (en) 1981-04-07
AU516016B2 (en) 1981-05-14
ATA205078A (en) 1985-04-15

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