AU516016B2 - Producing printed circuit boards - Google Patents

Producing printed circuit boards

Info

Publication number
AU516016B2
AU516016B2 AU34697/78A AU3469778A AU516016B2 AU 516016 B2 AU516016 B2 AU 516016B2 AU 34697/78 A AU34697/78 A AU 34697/78A AU 3469778 A AU3469778 A AU 3469778A AU 516016 B2 AU516016 B2 AU 516016B2
Authority
AU
Australia
Prior art keywords
printed circuit
circuit boards
producing printed
producing
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU34697/78A
Other versions
AU3469778A (en
Inventor
F Stahl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of AU3469778A publication Critical patent/AU3469778A/en
Application granted granted Critical
Publication of AU516016B2 publication Critical patent/AU516016B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AU34697/78A 1977-03-23 1978-04-03 Producing printed circuit boards Expired AU516016B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2713391A DE2713391C3 (en) 1977-03-23 1977-03-23 Process for the production of a carrier material for printed circuits
DEDE2713391 1977-03-23

Publications (2)

Publication Number Publication Date
AU3469778A AU3469778A (en) 1979-10-11
AU516016B2 true AU516016B2 (en) 1981-05-14

Family

ID=6004742

Family Applications (1)

Application Number Title Priority Date Filing Date
AU34697/78A Expired AU516016B2 (en) 1977-03-23 1978-04-03 Producing printed circuit boards

Country Status (9)

Country Link
JP (1) JPS53147265A (en)
AT (1) AT379279B (en)
AU (1) AU516016B2 (en)
CA (1) CA1099031A (en)
DE (1) DE2713391C3 (en)
FR (1) FR2385192A1 (en)
GB (1) GB1588998A (en)
IT (1) IT7848565A0 (en)
NL (1) NL180163C (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117258B1 (en) * 1983-02-23 1987-05-20 Ibm Deutschland Gmbh Process for the production of metallic layers adhering to plastic supports
JPS59227188A (en) * 1983-06-07 1984-12-20 松下電器産業株式会社 Printed board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2997521A (en) * 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly
US3481777A (en) * 1967-02-17 1969-12-02 Ibm Electroless coating method for making printed circuits

Also Published As

Publication number Publication date
DE2713391A1 (en) 1978-09-28
AT379279B (en) 1985-12-10
CA1099031A (en) 1981-04-07
DE2713391C3 (en) 1980-03-06
DE2713391B2 (en) 1979-06-28
FR2385192B1 (en) 1980-10-17
IT7848565A0 (en) 1978-03-23
NL7803106A (en) 1978-09-26
GB1588998A (en) 1981-05-07
JPS53147265A (en) 1978-12-21
ATA205078A (en) 1985-04-15
AU3469778A (en) 1979-10-11
NL180163C (en) 1987-01-02
FR2385192A1 (en) 1978-10-20
NL180163B (en) 1986-08-01

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