GB1588998A - Process and article for printed circuit board manufacture - Google Patents
Process and article for printed circuit board manufacture Download PDFInfo
- Publication number
- GB1588998A GB1588998A GB10853/78A GB1085378A GB1588998A GB 1588998 A GB1588998 A GB 1588998A GB 10853/78 A GB10853/78 A GB 10853/78A GB 1085378 A GB1085378 A GB 1085378A GB 1588998 A GB1588998 A GB 1588998A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- oxidizing
- layer
- finely divided
- abrasive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 41
- 229910052802 copper Inorganic materials 0.000 claims description 40
- 239000010949 copper Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 28
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 24
- 238000011282 treatment Methods 0.000 claims description 18
- 230000000873 masking effect Effects 0.000 claims description 17
- 239000003082 abrasive agent Substances 0.000 claims description 16
- 230000001590 oxidative effect Effects 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 239000000243 solution Substances 0.000 claims description 10
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims description 8
- 229960002218 sodium chlorite Drugs 0.000 claims description 8
- 239000001488 sodium phosphate Substances 0.000 claims description 8
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 8
- 229910000406 trisodium phosphate Inorganic materials 0.000 claims description 8
- 235000019801 trisodium phosphate Nutrition 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 239000007800 oxidant agent Substances 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 239000007900 aqueous suspension Substances 0.000 claims description 4
- 239000012876 carrier material Substances 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 4
- 235000013312 flour Nutrition 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- 239000012858 resilient material Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 239000000725 suspension Substances 0.000 claims description 3
- RNLHVODSMDJCBR-VURMDHGXSA-N (z)-3-methyl-5-(2,2,3-trimethylcyclopent-3-en-1-yl)pent-4-en-2-ol Chemical compound CC(O)C(C)\C=C/C1CC=C(C)C1(C)C RNLHVODSMDJCBR-VURMDHGXSA-N 0.000 claims description 2
- 208000035874 Excoriation Diseases 0.000 claims description 2
- 238000005299 abrasion Methods 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000012153 distilled water Substances 0.000 claims description 2
- 238000011010 flushing procedure Methods 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
- 230000004048 modification Effects 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 238000007788 roughening Methods 0.000 claims description 2
- 239000000080 wetting agent Substances 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
(54) PROCESS AND ARTICLE FOR PRINTEL) CIRCUIT BOARD MANUFACTURE
(71) We, KOLLMORGEN TECH
NOLOGIES CORPORATION of Republic
National Bank Building, Dallas, Texas 75201, a corporation duly organized and existing under the laws of the State of Texas,
United States of America do hereby declare the invention, for which we pray that a patent may be granted to us, and the method by which it is to be performed, to be particularly described in and by the following statement:
The present invention relates to the formation of articles which are useful in the production of printed circuit boards in accordance with the so-called "build-up" method. More particulary, this invention provides an insulating article having a layer of copper, the surface of which has been micro-roughened to improve the adhesion of masking materials, and which optionally comprise an oxide layer which protects the micro-roughened surface during storage and shipment.
The production of printed circuit boards by the so-called "build-up" method is known in the art. In this method, an insulating carrier or base material, e.g., a molded laminate, is provided with a thin layer of copper having a thickness of, for example, from 0.5 to 8 microns, preferably from 1 to 3 microns. After the application of a layer of masking material on selected areas of the copper surface, the desired pattern of conductor lines is built up on the unmasked areas by the galvanic or electrolytic deposition of copper and, if desired, other metals; the thin layer of copper acts as the current supply. After electrolytic deposition, the layer of masking material is removed and the thin layer of copper in the previously masked areas, which are now exposed, is treated to decompose it.
The initial layer of copper may be applied to the surface of the carrier material by known methods, such as by pressing a preformed copper foil thereon, preferably during the production of the carrier material itself. Alternatively, the copper may be applied by means of electroless metal deposition, vapor deposition or other known methods. In order to avoid deep etching of the conductor lines, which is especially undesirable in the case of narrow conductor lines, the layer of copper on the other areas must have a very small thickness. Such minute thicknesses also have a favorable effect upon the etching step with respect to lowering manufacturing costs.
In order to satisfactorily achieve better adhesion, the copper surface and masking material, e.g., a masking ink applied by screen printing, a photographic printing varnish or liquid-sensitive dry film, and moreover to avoid the formation of blisters in the masking layer during electrolytic deposition and the like, it has been proposed to chemically etch the copper surface and thus macroroughen it. Such prior art methods have a number of disadvantages, however, ranging from their great complexity and poor economy to insufficient reliability. In addition, these methods are not practical in the case of thin copper layers.
The present invention provides a method of manufacture wherein the reliability of adhesion of the masking layer to the copper surface is assured, and the formation of blisters in said masking layer is avoided; at the same time, the surface of the copper layer is protected. Unlike prior art method all of this is accomplished without decomposing the copper layer.
In its broadest aspects, this invention provides a method for manufacturing a base material covered with a thin copper layer useful in the production of printed circuit boards which is provided with a masking material to protect those areas from copper deposition which do not correspond to the conductor pattern, the method for manufacturing such base material comprising that said base material is contacted with a. finely divided abrasive material by feeding said base material through one or more pairs of rollers under pressure together with said finely divided abrasive material in suspension in water.
This invention also provides articles comprising an insulating base and a layer of copper thereon having a micro-roughened surface, the microroughening having been achieved chemically or mechanically, or both, as described above.
In accordance with this invention, the oxidizing and mechanical treatments may be used individually, or they may be used in combination in successive steps or simultaneously. When both treatments are used in succession, it is preferred that the oxidizing treatment follows the mechanical abrasion treatment, but this is not critical and the reverse sequence may also be employed.
The oxidizing treatment also results in the formation of a protective film of oxide on the surface of the copper layer, which protects said surface against mechanical damage, fingerprints, and the like, during further processing. The article protected by this oxidizing layer may thus be stored as such without danger for prolonged periods of time, or it may be used immediately by applying a layer of masking material. The masking material adheres reliably to the copper surface pretreated in accordance with this invention and shows no tendency toward the formation of blisters.
The oxide layer is removed later on during processing, e.g., by immersion in dilute sulfuric acid, or by the use of conventional oxide-cleaning techniques.
For the mechanical treatment, the carrier material having a thin layer of copper thereon is fed between a pair, preferably a plurality of pairs of rollers, the rollers having been provided with a coating of rubber or other suitable resilient material. At the same time, an aqueous suspension of finely divided material, such as quartz flour or glass dust, is fed to the rollers or to the copper surface. The micro-roughening is achieved by the pressing of the finely divided material against the copper surface.
After microroughening, the finely divided abrasive material is cleaned from the copper surface, e.g., by flushing with water at high pressure.
For the chemical treatment, an aqueous solution comprising sodium chlorite, trisodium phosphate and sodium hydroxide is preferred. Such solutions may also contain conventional additives, such as wetting agents and the like. A specific example of a suitable oxidizing solution consists of, per liter, 160 grams of sodium chlorite, 10 grams of trisodium phosphate and 10 grams of sodium hydroxide, the balance being water, and preferably distilled water.
A suitable commercially available product for the oxidizing treatment is "Ebanol" (RTM).
It is especially preferred to combine the chemical and mechanical treatments, and to add the solution of oxidizing agent to an aqueous suspension of the finely divided abrasive material.
Other modifications and variations are possible in the light of the above disclosure.
It is to be understood, therefore, that changes may be made in the particular embodiments described herein which are within the full intended scope of the invention as defined in the appended claims.
WHAT WE CLAIM IS:
1. A method for manufacturing a base material covered with a thin copper layer useful in the production of printed circuit boards which is provided with a masking material to protect those areas from copper deposition which do not correspond to the conductor pattern, characterized in that said base material is contacted with a finely divided abrasive material by feeding said base material through one or more pairs of rollers under pressure together with said finely divided abrasive material in suspension in water.
2. A method as claimed in claim 1 characterized in that the copper surface is protected by an oxide layer which protects the copper surface during storage until the masking material is applied.
3. A method as claimed in claims 1 or 2 characterized in that the surface of the copper layer is treated with an oxidizing agent which contains an abrasive material.
4. Method as claimed in claim 3 characterized in that the oxidizing agent contains a mixture of sodium chlorite, trisodium phosphate and sodium hydroxide in a watery solution.
5. Method as claimed in claims 3 and 4 characterized in that the oxidizing solution contains 160 girl sodium chlorite
10 g/l trisodium phosphate
10 g/l sodium hydroxide
in water
6. Method as claimed in claim 1 characterized in that the finely divided abrasive material is suspended in water.
7. Method as claimed in claim 1 characterized in that the abrasive material is selected from among quartz flour, glass dust or a mixture thereof.
8. Method as claimed in claim 1 characterized in that the rollers comprise a resilient material.
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (8)
1. A method for manufacturing a base material covered with a thin copper layer useful in the production of printed circuit boards which is provided with a masking material to protect those areas from copper deposition which do not correspond to the conductor pattern, characterized in that said base material is contacted with a finely divided abrasive material by feeding said base material through one or more pairs of rollers under pressure together with said finely divided abrasive material in suspension in water.
2. A method as claimed in claim 1 characterized in that the copper surface is protected by an oxide layer which protects the copper surface during storage until the masking material is applied.
3. A method as claimed in claims 1 or 2 characterized in that the surface of the copper layer is treated with an oxidizing agent which contains an abrasive material.
4. Method as claimed in claim 3 characterized in that the oxidizing agent contains a mixture of sodium chlorite, trisodium phosphate and sodium hydroxide in a watery solution.
5. Method as claimed in claims 3 and 4 characterized in that the oxidizing solution contains 160 girl sodium chlorite
10 g/l trisodium phosphate
10 g/l sodium hydroxide
in water
6. Method as claimed in claim 1 characterized in that the finely divided abrasive material is suspended in water.
7. Method as claimed in claim 1 characterized in that the abrasive material is selected from among quartz flour, glass dust or a mixture thereof.
8. Method as claimed in claim 1 characterized in that the rollers comprise a resilient material.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2713391A DE2713391C3 (en) | 1977-03-23 | 1977-03-23 | Process for the production of a carrier material for printed circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1588998A true GB1588998A (en) | 1981-05-07 |
Family
ID=6004742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB10853/78A Expired GB1588998A (en) | 1977-03-23 | 1978-03-20 | Process and article for printed circuit board manufacture |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS53147265A (en) |
| AT (1) | AT379279B (en) |
| AU (1) | AU516016B2 (en) |
| CA (1) | CA1099031A (en) |
| DE (1) | DE2713391C3 (en) |
| FR (1) | FR2385192A1 (en) |
| GB (1) | GB1588998A (en) |
| IT (1) | IT7848565A0 (en) |
| NL (1) | NL180163C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4642163A (en) * | 1983-02-23 | 1987-02-10 | International Business Machines Corporation | Method of making adhesive metal layers on substrates of synthetic material and device produced thereby |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59227188A (en) * | 1983-06-07 | 1984-12-20 | 松下電器産業株式会社 | Printed board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2997521A (en) * | 1960-04-11 | 1961-08-22 | Sanders Associates Inc | Insulated electric circuit assembly |
| US3481777A (en) * | 1967-02-17 | 1969-12-02 | Ibm | Electroless coating method for making printed circuits |
-
1977
- 1977-03-23 DE DE2713391A patent/DE2713391C3/en not_active Expired
-
1978
- 1978-03-17 CA CA299,132A patent/CA1099031A/en not_active Expired
- 1978-03-20 GB GB10853/78A patent/GB1588998A/en not_active Expired
- 1978-03-22 NL NLAANVRAGE7803106,A patent/NL180163C/en not_active IP Right Cessation
- 1978-03-22 AT AT0205078A patent/AT379279B/en not_active IP Right Cessation
- 1978-03-23 IT IT7848565A patent/IT7848565A0/en unknown
- 1978-03-23 FR FR7808487A patent/FR2385192A1/en active Granted
- 1978-03-23 JP JP3401678A patent/JPS53147265A/en active Pending
- 1978-04-03 AU AU34697/78A patent/AU516016B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4642163A (en) * | 1983-02-23 | 1987-02-10 | International Business Machines Corporation | Method of making adhesive metal layers on substrates of synthetic material and device produced thereby |
Also Published As
| Publication number | Publication date |
|---|---|
| AT379279B (en) | 1985-12-10 |
| FR2385192A1 (en) | 1978-10-20 |
| DE2713391A1 (en) | 1978-09-28 |
| IT7848565A0 (en) | 1978-03-23 |
| NL180163B (en) | 1986-08-01 |
| DE2713391B2 (en) | 1979-06-28 |
| ATA205078A (en) | 1985-04-15 |
| JPS53147265A (en) | 1978-12-21 |
| NL180163C (en) | 1987-01-02 |
| CA1099031A (en) | 1981-04-07 |
| AU3469778A (en) | 1979-10-11 |
| FR2385192B1 (en) | 1980-10-17 |
| AU516016B2 (en) | 1981-05-14 |
| DE2713391C3 (en) | 1980-03-06 |
| NL7803106A (en) | 1978-09-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |