JPH03130373A - Surface treatment of resin molded article containing glass filler - Google Patents
Surface treatment of resin molded article containing glass fillerInfo
- Publication number
- JPH03130373A JPH03130373A JP26740989A JP26740989A JPH03130373A JP H03130373 A JPH03130373 A JP H03130373A JP 26740989 A JP26740989 A JP 26740989A JP 26740989 A JP26740989 A JP 26740989A JP H03130373 A JPH03130373 A JP H03130373A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- copper plating
- plating layer
- article
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000945 filler Substances 0.000 title claims abstract description 24
- 239000011521 glass Substances 0.000 title claims description 13
- 229920005989 resin Polymers 0.000 title claims description 13
- 239000011347 resin Substances 0.000 title claims description 13
- 238000004381 surface treatment Methods 0.000 title claims description 13
- 238000007747 plating Methods 0.000 claims abstract description 41
- 238000005530 etching Methods 0.000 claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000005238 degreasing Methods 0.000 claims abstract description 8
- 238000006386 neutralization reaction Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 40
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 26
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 8
- 239000003054 catalyst Substances 0.000 abstract description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract description 4
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 abstract description 4
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 abstract description 4
- 229910017604 nitric acid Inorganic materials 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- 230000002452 interceptive effect Effects 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- 239000010408 film Substances 0.000 description 9
- 229910052763 palladium Inorganic materials 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
小型電子機器のカバー類に使用されるガラスフィラー入
り樹脂成形品の表面処理方法に関し、ガラスフィラー入
り樹脂成形品の表面と導電膜の密着性を良くしてその導
電膜の剥離を防止することを目的とし、
被処理品の脱脂工程と、当該被処理品の表面を粗面化す
るエツチング工程と、上記エツチング工程で付着したク
ロムを還元して除去する中和工程と、該被処理品の表面
にパラジウムと錫を吸着させた後に銅めっき層を形成す
る無電解銅めっき工程と、前記銅めっき層の表面にニッ
ケルめっき層を形成する無電解ニッケルめっき工程とか
らなる合成樹脂の無電解めっきプロセスにおいて、弗酸
と硝酸系の混合液に浸漬して、上記被処理品の基材およ
びフィラー部分に小さな穴を無数に形成するプリエツチ
ング工程を、上記脱脂工程と該エツチング工程の間に付
加する。[Detailed Description of the Invention] [Summary] Regarding a surface treatment method for a resin molded product containing glass filler used for covers of small electronic devices, the present invention improves the adhesion between the surface of the resin molded product containing glass filler and a conductive film. In order to prevent the conductive film from peeling off, the process includes a degreasing process for the processed item, an etching process to roughen the surface of the processed item, and a reduction and removal of chromium deposited during the etching process. a neutralization step, an electroless copper plating step in which a copper plating layer is formed after palladium and tin are adsorbed on the surface of the processed product, and an electroless nickel plating step in which a nickel plating layer is formed on the surface of the copper plating layer. In the electroless plating process for synthetic resins, the process includes a pre-etching process in which countless small holes are formed in the base material and filler portion of the article to be treated by immersion in a mixed solution of hydrofluoric acid and nitric acid. It is added between the degreasing step and the etching step.
本発明は、小型電子機器のカバー類に使用されるガラス
フィラー入り樹脂成形品の表面処理方法に関する。The present invention relates to a method for surface treatment of glass filler-containing resin molded products used for covers of small electronic devices.
最近、オフィス内に設置される小型電算機等には強度の
高いガラスフィラー入りポリカーボネイト樹脂より成形
されたカバー類が広く使用されているが、それらの電子
機器より発する妨害波により他の機器に多くの障害を発
生させているので、各種電子機器に対しｒ情報処理装置
および電子事務用機器から発生する妨害波の自主規制措
置運用規定（ＶＣＣＩ）Ｊが設定されており、その規定
をクリアするために機器のカバー類に妨害波の遮蔽を目
的とした導電膜を形成することができるガラスフィラー
入り樹脂成形品の表面処理方法が必要とされている。Recently, covers molded from high-strength glass-filled polycarbonate resin have been widely used for small computers installed in offices, but the interference waves emitted by these electronic devices often interfere with other devices. Therefore, the Voluntary Control Measures Operation Regulations (VCCI) J for interference waves generated from r information processing equipment and electronic office equipment have been set for various electronic equipment, and in order to clear the regulations. There is a need for a surface treatment method for resin molded products containing glass filler that can form a conductive film on equipment covers for the purpose of shielding interference waves.
（従来の技術〕
従来広く使用されている樹脂成形品の表面処理方法は、
第３図の工程順ブロック図で示すように、（１）は、例
えばフレオン系の溶剤により被処理品表面の脱脂と洗浄
を行う脱脂工程。(Conventional technology) The surface treatment method for resin molded products that has been widely used in the past is as follows:
As shown in the step order block diagram of FIG. 3, (1) is a degreasing step in which the surface of the workpiece is degreased and cleaned using, for example, a Freon-based solvent.
（２）は、室温のクロム酸、硫酸系の液に浸漬すること
によりエツチングして被処理品ｌの表面を粗面化するエ
ツチング工程。(2) is an etching process in which the surface of the object to be treated is roughened by etching it by immersing it in a chromic acid or sulfuric acid solution at room temperature.
（３）は、上記エツチング工程で被処理品の表面に付着
したクロムを塩酸等で還元して除去する中和工程。(3) is a neutralization step in which chromium adhering to the surface of the workpiece in the etching step is reduced and removed using hydrochloric acid or the like.
（４）は、塩化パラジウムと塩化錫の混合液により被処
理品１の表面にパラジウムと錫を吸着させる触媒付与工
程。(4) is a catalyst application step in which palladium and tin are adsorbed onto the surface of the workpiece 1 using a mixed solution of palladium chloride and tin chloride.
（５）は、被処理品ｌを希塩酸の溶液に浸漬して前工程
で付与したパラジウムの表面に付着した余分の錫を除去
する反応促進工程。(5) is a reaction acceleration step in which the product to be treated 1 is immersed in a dilute hydrochloric acid solution to remove excess tin adhering to the surface of the palladium applied in the previous step.
（６）は、無電解により約１μｍ厚さの銅めっき層を被
処理品の表面に形成する無電解銅めっき工程。(6) is an electroless copper plating process in which a copper plating layer with a thickness of approximately 1 μm is electrolessly formed on the surface of the workpiece.
（７）は、塩化パラジウムの溶液により前記工程で形成
された銅めっき層の表面にパラジウムを吸着させる触媒
付与工程。(7) is a catalyst application step in which palladium is adsorbed onto the surface of the copper plating layer formed in the above step using a palladium chloride solution.
（８）は、同じく無電解により約０．３μｍ厚さのニッ
ケルめっき層を被処理品の表面に形成する無電解ニッケ
ルめっき工程。(8) is an electroless nickel plating process in which a nickel plating layer with a thickness of about 0.3 μm is formed on the surface of the workpiece by electroless method.
の順序により被処理品の表面に妨害波遮蔽用の導電膜を
形成して、その後に装飾用の塗装が行われている。In this order, a conductive film for shielding interference waves is formed on the surface of the object to be treated, and then a decorative coating is applied.
以上説明した従来の表面処理方法で問題となるのは、上
記第（２）項のエツチング工程により被処理品１の母材
表面を粗面化すると、第４図の拡大断面図（ａ）に示す
ように被処理品１のポリカーボネイト／ＡＢＳ樹脂より
なる基材ｌ〜１の表面には小さなエツチング穴２が形成
されるが、その基材１−１表面に露出したフィラー１−
２部分はエツチングされずに残る。その状態で第（６）
工程の無電解銅めっきを行うと、第４図（ｂ）に示すよ
うに被処理品１の表面に露出したフィラー１−２部分に
銅めっき層３が形成されなかったり、或いは銅の薄膜が
フィラー１−２部分を覆っているだけとなり、更に、第
（８）工程の無電解ニッケルめっきにおいても、そのニ
ッケルめっき層とフィラー１−２部分との密着性が悪い
ので、塗装後において被処理品１の表面とめっき層の間
が剥離して形成した導電膜の各所に孔が発生して、妨害
波が通過するという問題が生じている。The problem with the conventional surface treatment method described above is that when the surface of the base material of the workpiece 1 is roughened by the etching process in item (2) above, the enlarged cross-sectional view (a) in FIG. As shown, small etching holes 2 are formed on the surface of the base material 1-1 made of polycarbonate/ABS resin of the product 1 to be treated, and the filler 1-1 exposed on the surface of the base material 1-1.
Two parts remain unetched. In that state (6)
When the electroless copper plating process is performed, as shown in FIG. 4(b), the copper plating layer 3 is not formed on the filler 1-2 portion exposed on the surface of the workpiece 1, or the copper thin film is formed. It only covers the filler 1-2 portion, and furthermore, in the electroless nickel plating in step (8), the adhesion between the nickel plating layer and the filler 1-2 portion is poor, so it is difficult to process the filler 1-2 after painting. A problem arises in that holes are generated in various places in the conductive film formed by peeling between the surface of the product 1 and the plating layer, and interference waves pass through.
本発明は上記のような問題点に鑑み、ガラスフィラー入
り樹脂成形品の母材表面と導電膜の密着性を良くしてそ
の導電膜の剥離を防止することができる新しいガラスフ
ィラー入り樹脂成形品の表面処理方法の提供を目的とす
る。In view of the above-mentioned problems, the present invention provides a new glass-filled resin molded product that improves the adhesion between the conductive film and the base material surface of the glass-filled resin molded product and prevents the conductive film from peeling off. The purpose of this invention is to provide a method for surface treatment.
本発明は、第１図に示すように被処理品の脱脂工程（１
）と、当該被処理品の表面を粗面化するエツチング工程
（２）と、上記エツチング工程で付着したクロムを還元
して除去する中和工程（３）と、該被処理品の表面にパ
ラジウムと錫を吸着させた後に銅めっき層を形成する無
電解銅めっき工程（４，５，６） と、前記鋼めっき層
の表面にニッケルめっき層を形成する無電解ニッケルめ
っき工程（７，８）とからなる合成樹脂の無電解めっき
プロセスにおいて、
弗酸と硝酸系の混合液に浸漬して、上記被処理品の基材
およびフィラー部分に小さな穴を無数に形成するプリエ
ツチング工程（２ａ）を、上記脱脂工程（１）と該エツ
チング工程（２）の間に付加する（作 用〕
本発明では、プリエツチング工程の弗酸と硝酸系の混合
液に被処理品１を浸漬すると、第２図（ａ）に示すよう
にその被処理品ｌの基材１−１表面が浸食されて小さな
プリエツチング穴１２ａが無数に形成されるとともに、
表面に露出したフィラー１−２部分も浸食されて微小な
穴が発生する。つづくエツチング工程においてはクロム
酸、硫酸系の液により、（ｂ）図に示すように前記プリ
エツチング穴１２ａが大きなエツチング穴１２ｂに成長
して、被処理品ｌの基材１−１表面が均一な粗面となる
ととともに露出したフィラー１−２部も粗面化されてい
るため、無電解銅めっき工程においては、（Ｃ）図に示
すように形成される銅めっき層３は被処理品ｌの表面に
密着するから、銅めっき層３およびニッケルめっき層の
不着と剥離を防止することが可能となる。The present invention is a degreasing process (1
), an etching step (2) to roughen the surface of the object to be treated, a neutralization step (3) to reduce and remove the chromium deposited in the etching step, and a process of adding palladium to the surface of the object to be treated. an electroless copper plating step (4, 5, 6) in which a copper plating layer is formed after adsorbing tin; and an electroless nickel plating step (7, 8) in which a nickel plating layer is formed on the surface of the steel plating layer. In the electroless plating process for synthetic resin, the pre-etching step (2a) involves forming countless small holes in the base material and filler portion of the article to be treated by immersing it in a mixed solution of hydrofluoric acid and nitric acid. is added between the degreasing step (1) and the etching step (2). As shown in Figure (a), the surface of the base material 1-1 of the processed product 1 is eroded, and countless small pre-etched holes 12a are formed.
The filler 1-2 portion exposed on the surface is also eroded and minute holes are generated. In the subsequent etching process, the pre-etched hole 12a grows into a large etched hole 12b using a chromic acid or sulfuric acid solution, as shown in FIG. Since the surface of the exposed filler 1-2 is also roughened, in the electroless copper plating process, the copper plating layer 3 formed as shown in FIG. Since it is in close contact with the surface of the copper plating layer 3 and the nickel plating layer, it is possible to prevent non-adhesion and peeling of the copper plating layer 3 and the nickel plating layer.
（実 施 例）
以下第１図および第２図について本発明の詳細な説明す
る。(Example) The present invention will be described in detail below with reference to FIGS. 1 and 2.
第１図は本実施例によるガラスフィラー入り樹脂成形品
の表面処理方法を示す工程順ブロック図、第２図は作用
の説明用拡大断面図を示す。FIG. 1 is a step-by-step block diagram showing the surface treatment method for a resin molded product containing glass filler according to this embodiment, and FIG. 2 is an enlarged sectional view for explaining the operation.
本発明のガラスフィラー入り樹脂成形品の表面処理方法
は、第１図の工程順ブロック図に示すように、
（１）は、例えばフレオン系の溶剤により被処理品表面
の脱脂と洗浄を行う脱脂工程。The surface treatment method for a glass filler-containing resin molded article of the present invention is as shown in the block diagram of the process order in FIG. Process.
（２ａ）は、室温の弗酸と硝酸系の混合液に約１分間浸
漬して、被処理品の基材表面に小さなプリエツチング穴
を形成させるとともに、その基材表面より露出したフィ
ラー部を粗面化するプリエツチング工程。(2a) is immersed in a mixed solution of hydrofluoric acid and nitric acid at room temperature for about 1 minute to form small pre-etched holes on the surface of the substrate of the product to be treated, and to remove the filler portion exposed from the surface of the substrate. Pre-etching process that roughens the surface.
（２）は、従来と同一のクロム酸、硫酸系の液に浸漬す
ることによりエツチングして、前記（２ａ）の工程で被
処理品の基材に形成されたプリエツチング穴を大きくす
るエツチング工程。(2) is an etching process in which the pre-etched hole formed in the base material of the processed item in step (2a) is enlarged by etching by immersion in the same chromic acid or sulfuric acid solution as in the conventional method. .
中和工程以降は、従来と同一工程により被処理品の表面
に銅めっき層およびニッケルめっき層よりなる妨害波遮
蔽用の導電膜を形成している。After the neutralization step, a conductive film for shielding interference waves consisting of a copper plating layer and a nickel plating layer is formed on the surface of the processed product using the same steps as in the conventional method.
その結果、プリエツチング工程において第２図（ａ）に
示すように被処理品■の基材１−１表面に小さなプリエ
ツチング穴１２ａが形成されるとともにフィラー１−２
部分にも微小な穴が発生し、次のエツチング工程におい
ては、第２図い）に示すように前記プリエツチング穴１
２ａが大きくなって、被処理品ｌの基材１−１表面が均
一な粗面となるとともに露出したフィラー１−２部も粗
面化されるため、無電解銅メツキ工程で形成される銅め
っき層３は第２図（Ｃ）に示すように被処理品ｌの表面
に密着するから銅めっき層３の不着または塗装工程以降
での剥離を防止することができる。As a result, in the pre-etching process, as shown in FIG.
In the next etching process, the pre-etched holes 1 are formed as shown in Figure 2).
2a becomes larger, the surface of the base material 1-1 of the product to be treated l becomes a uniform rough surface, and the exposed filler 1-2 part is also roughened, so that the copper formed in the electroless copper plating process Since the plating layer 3 adheres closely to the surface of the workpiece 1 as shown in FIG. 2(C), non-adhesion of the copper plating layer 3 or peeling after the coating process can be prevented.
以上の説明から明らかなように本発明によれば極めて簡
単なプリエツチング工程の付加により、合成樹脂よりな
る被処理品への導体膜不着または剥離を防止することが
できる等の利点があり、著しい経済的及び、信頼性向上
の効果が期待できるガラスフィラー入り樹脂成形品の表
面処理方法を提供することができる。As is clear from the above description, according to the present invention, by adding an extremely simple preetching process, there are significant advantages such as preventing non-adhesion or peeling of the conductor film on the processed object made of synthetic resin. It is possible to provide a surface treatment method for glass filler-containing resin molded products that is expected to be economical and to improve reliability.
第１図は本発明の一実施例によるガラスフィラー入り樹
脂成形品の表面処理方法を示す工程順ブロック図、
第２図は作用の説明用拡大断面図、
第３図は従来の表面処理方法を示す工程順ブロック図、
第４図は課題を説明する拡大断面図である。
図において、
１は被処理品、
１−１は基材、
１−２はフィラー
３は銅めっき層、
１２ａはプリエツチング穴、
１２ｂはエツチング穴、
を示す。Fig. 1 is a step-by-step block diagram showing a surface treatment method for a resin molded product containing glass filler according to an embodiment of the present invention, Fig. 2 is an enlarged sectional view for explaining the operation, and Fig. 3 is a conventional surface treatment method. FIG. 4 is an enlarged sectional view illustrating the problem. In the figure, 1 is a processed product, 1-1 is a base material, 1-2 is a filler 3 is a copper plating layer, 12a is a pre-etched hole, and 12b is an etched hole.
Claims (1)
粗面化するエッチング工程（２）と、上記エッチング工
程で付着したクロムを還元して除去する中和工程（３）
と、該被処理品の表面にパラジウムと錫を吸着させた後
に銅めっき層を形成する無電解銅めっき工程（４，５，
６）と、前記銅めっき層の表面にニッケルめっき層を形
成する無電解ニッケルめっき工程（７，８）とからなる
合成樹脂の無電解めっきプロセスにおいて、 弗酸と硝酸系の混合液に浸漬して、上記被処理品の基材
およびフィラー部分に小さな穴を無数に形成するプリエ
ッチング工程（２ａ）を、上記脱脂工程（１）と該エッ
チング工程（２）の間に付加したことを特徴とするガラ
スフィラー入り樹脂成形品の表面処理方法。[Scope of Claims] A degreasing step (1) for the object to be treated, an etching step (2) for roughening the surface of the object, and a neutralization step for reducing and removing chromium deposited in the etching step. Process (3)
and an electroless copper plating step (4, 5,
6) and an electroless nickel plating step (7, 8) for forming a nickel plating layer on the surface of the copper plating layer. A pre-etching step (2a) for forming countless small holes in the base material and filler portion of the article to be treated is added between the degreasing step (1) and the etching step (2). A method for surface treatment of resin molded products containing glass filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26740989A JPH03130373A (en) | 1989-10-13 | 1989-10-13 | Surface treatment of resin molded article containing glass filler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26740989A JPH03130373A (en) | 1989-10-13 | 1989-10-13 | Surface treatment of resin molded article containing glass filler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03130373A true JPH03130373A (en) | 1991-06-04 |
Family
ID=17444445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26740989A Pending JPH03130373A (en) | 1989-10-13 | 1989-10-13 | Surface treatment of resin molded article containing glass filler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03130373A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05339738A (en) * | 1992-01-21 | 1993-12-21 | General Electric Co <Ge> | Method for improving adhesion of electroless plated film to resinous article by permanganate treatment |
| JP2012151326A (en) * | 2011-01-20 | 2012-08-09 | Toshiba Corp | Method of manufacturing semiconductor device, semiconductor device, and method of shielding electronic component |
| JP2015115559A (en) * | 2013-12-13 | 2015-06-22 | 株式会社東芝 | Method of manufacturing semiconductor device and semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6263674A (en) * | 1985-09-17 | 1987-03-20 | Toray Ind Inc | Method for metallizing surface of molded resin article |
| JPH02217477A (en) * | 1989-02-16 | 1990-08-30 | Mitsubishi Gas Chem Co Inc | Pretreatment of resin molded product before metal plating |
-
1989
- 1989-10-13 JP JP26740989A patent/JPH03130373A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6263674A (en) * | 1985-09-17 | 1987-03-20 | Toray Ind Inc | Method for metallizing surface of molded resin article |
| JPH02217477A (en) * | 1989-02-16 | 1990-08-30 | Mitsubishi Gas Chem Co Inc | Pretreatment of resin molded product before metal plating |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05339738A (en) * | 1992-01-21 | 1993-12-21 | General Electric Co <Ge> | Method for improving adhesion of electroless plated film to resinous article by permanganate treatment |
| JP2012151326A (en) * | 2011-01-20 | 2012-08-09 | Toshiba Corp | Method of manufacturing semiconductor device, semiconductor device, and method of shielding electronic component |
| JP2015115559A (en) * | 2013-12-13 | 2015-06-22 | 株式会社東芝 | Method of manufacturing semiconductor device and semiconductor device |
| US10312197B2 (en) | 2013-12-13 | 2019-06-04 | Toshiba Memory Corporation | Method of manufacturing semiconductor device and semiconductor device |
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