NL180163C - METHOD FOR MANUFACTURING A CARRIER WITH PRINTED WIRES - Google Patents

METHOD FOR MANUFACTURING A CARRIER WITH PRINTED WIRES

Info

Publication number
NL180163C
NL180163C NLAANVRAGE7803106,A NL7803106A NL180163C NL 180163 C NL180163 C NL 180163C NL 7803106 A NL7803106 A NL 7803106A NL 180163 C NL180163 C NL 180163C
Authority
NL
Netherlands
Prior art keywords
carrier
manufacturing
printed wires
wires
printed
Prior art date
Application number
NLAANVRAGE7803106,A
Other languages
Dutch (nl)
Other versions
NL7803106A (en
NL180163B (en
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of NL7803106A publication Critical patent/NL7803106A/en
Publication of NL180163B publication Critical patent/NL180163B/en
Application granted granted Critical
Publication of NL180163C publication Critical patent/NL180163C/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • ing And Chemical Polishing (AREA)
NLAANVRAGE7803106,A 1977-03-23 1978-03-22 METHOD FOR MANUFACTURING A CARRIER WITH PRINTED WIRES NL180163C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2713391A DE2713391C3 (en) 1977-03-23 1977-03-23 Process for the production of a carrier material for printed circuits

Publications (3)

Publication Number Publication Date
NL7803106A NL7803106A (en) 1978-09-26
NL180163B NL180163B (en) 1986-08-01
NL180163C true NL180163C (en) 1987-01-02

Family

ID=6004742

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7803106,A NL180163C (en) 1977-03-23 1978-03-22 METHOD FOR MANUFACTURING A CARRIER WITH PRINTED WIRES

Country Status (9)

Country Link
JP (1) JPS53147265A (en)
AT (1) AT379279B (en)
AU (1) AU516016B2 (en)
CA (1) CA1099031A (en)
DE (1) DE2713391C3 (en)
FR (1) FR2385192A1 (en)
GB (1) GB1588998A (en)
IT (1) IT7848565A0 (en)
NL (1) NL180163C (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117258B1 (en) * 1983-02-23 1987-05-20 Ibm Deutschland Gmbh Process for the production of metallic layers adhering to plastic supports
JPS59227188A (en) * 1983-06-07 1984-12-20 松下電器産業株式会社 Printed board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2997521A (en) * 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly
US3481777A (en) * 1967-02-17 1969-12-02 Ibm Electroless coating method for making printed circuits

Also Published As

Publication number Publication date
DE2713391A1 (en) 1978-09-28
AT379279B (en) 1985-12-10
AU516016B2 (en) 1981-05-14
CA1099031A (en) 1981-04-07
DE2713391C3 (en) 1980-03-06
DE2713391B2 (en) 1979-06-28
FR2385192B1 (en) 1980-10-17
IT7848565A0 (en) 1978-03-23
NL7803106A (en) 1978-09-26
GB1588998A (en) 1981-05-07
JPS53147265A (en) 1978-12-21
ATA205078A (en) 1985-04-15
AU3469778A (en) 1979-10-11
FR2385192A1 (en) 1978-10-20
NL180163B (en) 1986-08-01

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Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
A85 Still pending on 85-01-01
V1 Lapsed because of non-payment of the annual fee